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STM32L476JGY6PTR

STMicroelectronics

STM32L476JGY6PTR by STMicroelectronics

STM32L476JGY6PTR from STMicroelectronics is a 32-bit microcontroller ideal for low-power applications. It operates at a supply voltage of 1.71-3.6V, features 57 I/O lines, and supports ADC and PWM channels. Perfect for IoT devices and wearable tech, it combines efficiency with performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,979 parts In-Stock

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Digiode

USA . 4,019 parts In-Stock

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Anansix

USA . 1,870 parts In-Stock

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1,870

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AZTECH Wire

Italy . 504 parts In-Stock

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$17.110

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504

$17.110

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IDEA Electronic Components Group

UK . 966 parts In-Stock

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$79.212

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$71.291

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966

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$71.291

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MKK Technologies

India . 1,687 parts In-Stock

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$148.953

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1,687

$148.953

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DigiPath Technology Company

USA . 1,687 parts In-Stock

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$148.953

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1,687

$148.953

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QUARKTWIN TECHNOLOGY LTD

USA . 20,381 parts In-Stock

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Corphita

USA . 3,933 parts In-Stock

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Vigor

Singapore . 1,589 parts In-Stock

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Parana Technologies

USA . 1,240 parts In-Stock

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$94.710

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32L476JGY6PTR microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this advanced 32-bit MCU delivers superior performance in a compact design, ideal for IoT devices, wearables, and smart home applications. Experience unparalleled efficiency, lower power consumption, and seamless integration, empowering your innovations while ensuring longevity. Transform your ideas into reality with ST's trusted excellence!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact electronic devices, making layout design simpler and more efficient.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in design, allowing for a wider range of applications and power sources.

Address Bus Width: 2

A 2-bit address bus width allows for efficient address handling, suitable for applications requiring low data handling.

Package Shape: RECTANGULAR

The rectangular package shape promotes efficient space utilization on PCBs, improving overall product design.

Bit Size: 32

A 32-bit architecture enables processing of larger data types and more complex calculations, ideal for advanced applications.

No. of Terminals: 72

With 72 terminals, the microcontroller offers extensive connectivity options, accommodating complex functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style allows for high-density mounting on PCBs, contributing to smaller form factor designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage indicates low power consumption, making it suitable for battery-operated and energy-efficient devices.

Terminal Finish: TIN SILVER COPPER NICKEL

This terminal finish provides enhanced corrosion resistance and better soldering reliability, ensuring durability.

ADC Channels: YES

The inclusion of ADC channels allows for efficient analog signal processing, making it suitable for sensor applications.

DMA Channels: YES

DMA channels enhance performance by allowing direct memory access for data transfers, reducing CPU workload.

Terminal Position: BOTTOM

Bottom terminal positioning supports easy mounting and provides better thermal performance in compact designs.

Width: 3.7594 mm

The slim width enables tighter layouts on PCBs, allowing for more compact designs in size-constrained applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides decent processing speed for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds indicates good thermal resilience during manufacturing processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with high-temperature soldering processes.

Length: 4.4084 mm

The compact length contributes to space-saving designs, enabling the creation of smaller devices.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides a streamlined instruction set for improved performance and efficiency.

Terminal Form: BALL

Ball form terminals enhance solder joint reliability and facilitate easier handling during assembly.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V ensures minimal power consumption, suitable for portable and battery-operated applications.

PWM Channels: YES

PWM channels support precise control of motors and other devices, enhancing the versatility of the microcontroller.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for high-density layouts while maintaining reliable connections.

Speed: 80 rpm

An 80 rpm speed offers adequate performance for various motor control applications.

No. of I/O Lines: 57

With 57 I/O lines, this microcontroller can handle multiple inputs and outputs, making it suitable for complex tasks.

Technical Specifications

Microcontrollers STM32L476JGY6PTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

2

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e2

Length:

4.4084 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

57

No. of Terminals:

72

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.7594 mm

Peripheral IC Type:

Trade Compliance

STM32L476JGY6PTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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