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STM32L476JEY6VTR

STMicroelectronics

STM32L476JEY6VTR by STMicroelectronics

STM32L476JEY6VTR from STMicroelectronics is a low-power 32-bit microcontroller featuring a Cortex-M4 CPU, with a max clock frequency of 48 MHz. It supports up to 16 ADC channels and includes integrated DACs for versatile applications. Ideal for IoT devices, it operates b/w -40 °C to 85 °C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 9,993 parts In-Stock

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Digiode

USA . 3,693 parts In-Stock

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Anansix

USA . 183 parts In-Stock

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183

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Distributors (Availability)

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Microchip USA

USA . 1,599 parts In-Stock

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$10.755

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1,599

$10.755

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AZTECH Wire

Italy . 347 parts In-Stock

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$12.660

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347

$12.660

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IDEA Electronic Components Group

UK . 882 parts In-Stock

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$15.965

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$14.368

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882

$15.965

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$14.368

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MKK Technologies

India . 1,484 parts In-Stock

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$30.021

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$30.021

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DigiPath Technology Company

USA . 1,484 parts In-Stock

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$30.021

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Component Stockers USA

USA . 648 parts In-Stock

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$99.990

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Corphita

USA . 3,720 parts In-Stock

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3,720

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Vigor

Singapore . 3,403 parts In-Stock

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Parana Technologies

USA . 1,620 parts In-Stock

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$19.088

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock your next innovation with the STM32L476JEY6VTR microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for exceptional performance in low-power applications, this versatile chip excels in smart devices, IoT, and wearable technologies. Its advanced features ensure seamless connectivity and robust functionality, empowering you to create cutting-edge products that stand out in the market. Experience reliability and efficiency like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures long-term reliability and protection against environmental factors.

Integrated Cache: YES

Having integrated cache enhances data access speed, leading to improved overall performance of the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into existing circuits.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V enhances compatibility with low-voltage systems.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data processing while maintaining cost-effectiveness.

Package Shape: RECTANGULAR

The rectangular shape is standard for microcontrollers, allowing for easy placement on PCB layouts.

Bit Size: 32

A 32-bit architecture enables complex computations and enhanced performance in multitasking applications.

DAC Channels: YES

Integrated DAC channels allow for easy conversion of digital signals to analog, broadening application possibilities.

No. of Terminals: 72

With 72 terminals, this microcontroller provides ample connectivity options for interfacing with multiple peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch make it suitable for high-density applications, conserving PCB space.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage ensures functionality in battery-powered or energy-efficient projects.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes it ideal for industrial and automotive applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family provides powerful performance and energy efficiency, making it suitable for complex applications.

No. of External Interrupts: 16

With 16 external interrupts, the microcontroller can respond swiftly to multiple external events, improving responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes it suitable for harsh environments and critical applications.

ADC Channels: YES

Integrated ADC channels allow for real-time signal processing, vital for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) capabilities allow for efficient data transfer, enhancing processing speed and lowering CPU load.

Terminal Position: BOTTOM

Bottom terminal positioning aids in managing space on PCBs, facilitating easier circuit designs.

ROM Words: 524288

A high ROM capacity ensures that complex applications and large firmware can be stored directly on the microcontroller.

Maximum Seated Height: 0.585 mm

A low seated height aids in fitting within compact enclosures while ensuring stability on the PCB.

Digital To Analog Converters: 2-Ch 12-Bit

Two 12-bit DAC channels provide high-resolution analog output for a variety of applications.

Width: 3.7594 mm

A narrow width allows for space-efficient designs, making it suitable for compact electronic devices.

Boundary Scan: YES

Boundary scan capabilities facilitate easier testing and debugging of complex circuits during development.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

A rich set of peripherals enhances functionality, making it versatile for various application domains.

Maximum Clock Frequency: 48 MHz

A high clock frequency enables faster processing speeds, improving performance in real-time applications.

Length: 4.4084 mm

The compact length makes it easy to integrate into space-constrained designs without sacrificing performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance with simpler instructions for quick execution and efficient designs.

No. of Timers: 14

Multiple timers support complex timing operations, essential for precise control in applications.

RAM Bytes: 131072

Ample RAM allows for sophisticated computations and management of multiple tasks without performance degradation.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form allows for better soldering quality and mechanical stability on PCBs.

Analog To Digital Converters: 16-Ch 12-Bit

16 channels of 12-bit ADC ensure high-resolution data acquisition from multiple sources.

Maximum Supply Current: 12.1 mA

A maximum supply current of 12.1 mA ensures efficient power management in applications.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage is attractive for energy-sensitive projects, especially in portable devices.

No. of DMA Channels: 14

With 14 DMA channels, this microcontroller allows for efficient data handling and reduced CPU intervention.

No. of Serial I/Os: 8

Eight serial I/O channels support diverse communication protocols, enhancing connectivity options.

PWM Channels: YES

Pulse Width Modulation channels facilitate advanced control of motors and other actuators.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SPI(3), UART(2), USART(3), USB

Diverse connectivity options make it suitable for a wide range of applications, enabling easy integration with other systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, extending the lifespan of the product.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch supports fine pitch designs, increasing component density on PCBs.

Format: FLOATING POINT

Floating point format support enhances the ability to perform complex mathematical computations efficiently.

Speed: 80 rpm

Operating at 80 rpm indicates the microcontroller's capability to handle speed-sensitive applications.

Low Power Mode: YES

The low power mode increases efficiency and extends battery life in portable and remote applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width aids in integrating the microcontroller into various applications.

No. of I/O Lines: 57

Fifty-seven I/O lines allow for extensive interfacing, making it suitable for multi-functional projects.

Technical Specifications

Microcontrollers STM32L476JEY6VTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B72

Length:

4.4084 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

57

No. of Serial I/Os:

8

No. of Terminals:

72

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA72,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Current:

12.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.7594 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L476JEY6VTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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