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STM32L471ZEJ6

STMicroelectronics

STM32L471ZEJ6 by STMicroelectronics

STM32L471ZEJ6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports up to 48 MHz clock frequency. With 144 terminals and integrated ADC/DMA channels, it's ideal for low-power applications. Its compact design makes it suitable for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,525 parts In-Stock

1+ parts

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4,525

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Vyrian

USA . 2,262 parts In-Stock

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2,262

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Anansix

USA . 232 parts In-Stock

1+ parts

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232

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$7.520

100+ parts

-

1k+ parts

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10k+ parts

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2,500

$7.520

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AZTECH Wire

Italy . 1,206 parts In-Stock

1+ parts

$13.040

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1,206

$13.040

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IDEA Electronic Components Group

UK . 529 parts In-Stock

1+ parts

$56.793

100+ parts

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$51.113

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529

$56.793

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$51.113

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MKK Technologies

India . 1,369 parts In-Stock

1+ parts

$106.795

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1,369

$106.795

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DigiPath Technology Company

USA . 1,369 parts In-Stock

1+ parts

$106.795

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1,369

$106.795

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Component Stockers USA

USA . 1,269 parts In-Stock

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1,269

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Corphita

USA . 1,034 parts In-Stock

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1,034

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Parana Technologies

USA . 1,031 parts In-Stock

1+ parts

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100+ parts

$67.904

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1,031

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$67.904

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Overview

Elevate your projects with the STM32L471ZEJ6, a cutting-edge microcontroller from STMicroelectronics! Renowned for excellence, STMicroelectronics delivers unmatched performance and reliability in every chip. This ultra-efficient 32-bit MCU is perfect for IoT applications, wearable tech, and low-power devices, offering extended battery life and seamless connectivity. Experience innovation at its best—unlock creativity and drive success with STM32L471ZEJ6 today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact installations, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in design.

Address Bus Width: 26

A wider address bus width allows for greater memory access, enabling the microcontroller to handle larger applications efficiently.

Package Shape: SQUARE

The square package shape facilitates easy integration into various layouts, offering design convenience.

Bit Size: 32

A 32-bit architecture allows for faster processing and the ability to handle complex calculations, making it suitable for advanced applications.

No. of Terminals: 144

A larger number of terminals provides more connectivity options, allowing for comprehensive interfacing with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch design enhance thermal performance and allow for high-density configurations.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage compatibility helps in low-power applications, making it energy-efficient.

ADC Channels: YES

Incorporation of ADC channels enables the microcontroller to process analog signals, expanding its application range in sensor integration.

DMA Channels: YES

DMA channels allow for efficient data transfer without CPU intervention, freeing up processing resources for other tasks.

Terminal Position: BOTTOM

Bottom terminal positioning helps in optimizing PCB layout, simplifying assembly processes.

Width: 10 mm

A compact width enhances compatibility with smaller board designs, making it suitable for portable devices.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data handling and improves interaction with peripheral devices.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures fast processing capabilities, essential for time-sensitive applications.

Length: 10 mm

The minimal length supports compact builds while maintaining efficient performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller indicates it is optimized for speed and efficiency, ideal for performance-critical applications.

Terminal Form: BALL

Ball terminal form allows for reliable connections and is suited for automated soldering processes.

Nominal Supply Voltage: 1.8 V

This nominal supply voltage is conducive for low-power designs, making it ideal for battery-powered devices.

PWM Channels: YES

PWM channels facilitate motor control and signal modulation, expanding application capabilities.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch improves soldering accuracy and is compatible with modern PCB design standards.

Speed: 80 rpm

The ability to operate at 80 rpm is beneficial for motor control applications and various automation tasks.

No. of I/O Lines: 114

Having 114 I/O lines provides significant interfacing opportunities for multiple peripherals, enhancing functionality.

Technical Specifications

Microcontrollers STM32L471ZEJ6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

10 mm

No. of I/O Lines:

114

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L471ZEJ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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