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STM32L471QEI7TR

STMicroelectronics

STM32L471QEI7TR by STMicroelectronics

STM32L471QEI7TR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w -40 °C to 105 °C, and supports up to 48 MHz clock speed. With 19 ADC channels and dual DACs, it's ideal for industrial applications requiring precision. Its compact design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,849 parts In-Stock

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5,849

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Digiode

USA . 2,630 parts In-Stock

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2,630

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Anansix

USA . 1,173 parts In-Stock

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1,173

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Distributors (Availability)

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Vigor

Singapore . 1,882 parts In-Stock

1+ parts

$6.560

100+ parts

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1,882

$6.560

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AZTECH Wire

Italy . 189 parts In-Stock

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$8.140

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189

$8.140

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IDEA Electronic Components Group

UK . 1,103 parts In-Stock

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$43.740

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$39.366

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1,103

$43.740

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$39.366

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MKK Technologies

India . 291 parts In-Stock

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$82.249

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291

$82.249

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DigiPath Technology Company

USA . 291 parts In-Stock

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$82.249

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291

$82.249

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QUARKTWIN TECHNOLOGY LTD

USA . 11,874 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,595 parts In-Stock

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2,595

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Parana Technologies

USA . 444 parts In-Stock

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$52.297

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444

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$52.297

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Overview

Unlock innovation with the STM32L471QEI7TR microcontroller from STMicroelectronics, a leader in quality and reliability. Designed for diverse applications, it perfectly balances performance and energy efficiency, empowering your next project with unparalleled processing power while keeping energy consumption low. Ideal for IoT devices, industrial automation, and portable equipment, this versatile MCU delivers exceptional value, simplifying design and enhancing your product's capabilities. Embrace excellence and elevate your solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, facilitating compact designs and high-density applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a variety of low voltage power systems.

Address Bus Width: 26

A 26-bit address bus allows for a large addressable memory space, enabling complex applications and data processing.

Package Shape: SQUARE

Square packaging benefits layout efficiency and can simplify thermal management in compact designs.

Bit Size: 32

The 32-bit architecture provides improved performance and the ability to handle larger data types, enhancing overall processing capabilities.

DAC Channels: YES

Integrated Digital-to-Analog Converters (DACs) offer enhanced control in applications requiring signal conditioning or modulation.

No. of Terminals: 132

A high terminal count enables extensive connectivity options and supports multiple peripherals, making it versatile for complex designs.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style allows for better heat dissipation and supports high-density interconnections, ideal for modern electronic applications.

Minimum Supply Voltage: 1.71 V

Operating at a low minimum supply voltage enhances power efficiency, beneficial for battery-operated devices.

Maximum Operating Temperature: 105 °C

High operating temperature tolerance ensures reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures makes this microcontroller suitable for use in extreme conditions.

ADC Channels: YES

Integrated Analog-to-Digital Converters (ADCs) facilitate accurate signal capture, essential for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) support improves data transfer efficiency, minimizing CPU intervention and enhancing performance.

Terminal Position: BOTTOM

Bottom terminal placement aids in space-saving designs and better control over signal integrity.

ROM Words: 524288

A substantial ROM size allows for extensive program storage, critical for intricate applications and firmware.

Maximum Seated Height: 0.6 mm

The low seated height improves the design's overall profile, ideal for compact devices.

Digital To Analog Converters: 2 Ch 12-Bit

High-resolution DACs enable precise signal generation, improving the performance of audio and control systems.

Width: 7 mm

Compact width contributes to overall system miniaturization, making it suitable for space-constrained environments.

External Data Bus Width: 16

A wider external data bus allows for faster data transfers between the microcontroller and external peripherals.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(14), PWC, RTC, TIMER(14), TSC, WDT(2)

Diverse peripheral integration supports a variety of applications, enhancing functionality and reducing component count.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency provides sufficient processing speed for most embedded applications, ensuring responsive performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures operational reliability in harsh environments, suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers enhanced instruction processing efficiency, resulting in reduced power consumption and improved performance.

RAM Bytes: 131072

A generous amount of RAM supports complex software applications, enabling effective multitasking and data handling.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, essential for battery-operated and high-reliability applications.

Terminal Form: BALL

Ball terminal forms enhance soldering reliability and thermal performance, facilitating better production yield.

Analog To Digital Convertors: 19 Ch 12-Bit(3)

A high number of ADC channels supports multiple sensor inputs, allowing for versatile sensor interface designs.

Nominal Supply Voltage: 1.8 V

This nominal voltage helps reduce power consumption, making it ideal for low-power applications.

PWM Channels: YES

Programmable PWM channels facilitate motor control and other applications requiring precise duty cycle modulation.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3)

Extensive connectivity options enhance the microcontroller's versatility across various communication protocols, making it suitable for diverse applications.

ROM Programmability: FLASH

Flash ROM allows for easy firmware updates and reprogrammability, increasing the microcontroller's longevity and flexibility.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports high-density layouts and modern PCB designs, optimizing space utilization.

Speed: 80 rpm

The specified speed is relevant in applications like servos or motors, ensuring responsive control in real-time systems.

On Chip Program ROM Width: 8

An 8-bit program ROM width is essential for efficient byte-level operations, simplifying coding and data manipulation.

No. of I/O Lines: 109

A high number of I/O lines provides flexibility for interfacing with various peripherals and components, making the microcontroller highly adaptable.

Technical Specifications

Microcontrollers STM32L471QEI7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

No. of I/O Lines:

109

No. of Terminals:

132

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3)

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(14), PWC, RTC, TIMER(14), TSC, WDT(2)

Analog To Digital Convertors:

19 Ch 12-Bit(3)

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L471QEI7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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