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STM32L471QEI3TR

STMicroelectronics

STM32L471QEI3TR by STMicroelectronics

STM32L471QEI3TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and includes 19 ADC channels. Ideal for automotive applications, it supports various connectivity options like CAN and I2C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,030 parts In-Stock

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5,030

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Digiode

USA . 4,685 parts In-Stock

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4,685

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Anansix

USA . 1,556 parts In-Stock

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1,556

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Distributors (Availability)

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AZTECH Wire

Italy . 814 parts In-Stock

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$18.400

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814

$18.400

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Microchip USA

USA . 5,146 parts In-Stock

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$22.593

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5,146

$22.593

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IDEA Electronic Components Group

UK . 2,247 parts In-Stock

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$53.091

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$47.782

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2,247

$53.091

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$47.782

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MKK Technologies

India . 698 parts In-Stock

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$99.835

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698

$99.835

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DigiPath Technology Company

USA . 698 parts In-Stock

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$99.835

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698

$99.835

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Corphita

USA . 4,920 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Eastek

USA . 2,500 parts In-Stock

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$9.360

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2,500

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$9.360

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,883 parts In-Stock

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$63.479

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1,883

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$63.479

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Overview

Unlock unparalleled performance with the STM32L471QEI3TR microcontroller from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers a powerhouse that excels in energy efficiency and versatility. Ideal for IoT devices, automotive applications, and advanced sensor management, this microcontroller enables seamless connectivity and robust functionality while ensuring exceptional quality and durability, empowering your designs to thrive in any environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and higher assembly speeds, ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

This low maximum supply voltage is energy-efficient, reducing power consumption in battery-operated designs.

Address Bus Width: 26

A wider address bus enhances memory addressing capabilities, allowing for more extensive memory configurations.

Package Shape: SQUARE

A square package shape provides uniform dimensions, making it versatile for various PCB layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers excellent performance and precision for complex computations.

DAC Channels: YES

The inclusion of Digital-to-Analog Converters (DACs) enhances the ability to produce analog signals, making it versatile for control applications.

No. of Terminals: 132

A higher number of terminals enables connectivity for multiple peripherals, offering flexibility in system design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch can save space on a PCB, enabling more compact designs.

Minimum Supply Voltage: 1.71 V

This low minimum supply voltage allows operation in power-sensitive applications, enhancing battery life.

Maximum Operating Temperature: 125 °C

High-temperature tolerance ensures reliable operation in harsh environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

Low temperature capability allows operation in extreme conditions, suitable for outdoor and industrial applications.

ADC Channels: YES

Having multiple Analog-to-Digital Converters (ADCs) increases the ability to process analog inputs, beneficial for sensor integration.

DMA Channels: YES

DMA support enhances data transfer efficiency, freeing up CPU resources for other tasks, improving system performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy mounting on PCBs, simplifying the design and assembly process.

ROM Words: 524288

A large ROM capacity allows the storage of complex programs and functionalities, essential for advanced applications.

Maximum Seated Height: 0.6 mm

The low height allows for compact designs, making it suitable for tightening spaces in consumer electronics.

Digital To Analog Converters: 2 Ch 12-Bit

Having 12-bit resolution in DACs allows precise analog output, important for high-fidelity applications.

Width: 7 mm

The small width contributes to compact circuit board layouts, optimizing space usage in miniaturized devices.

External Data Bus Width: 16

A 16-bit data bus width can improve data transfer rates, making the microcontroller suitable for high-performance applications.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(14), PWC, RTC, TIMER(14), TSC, WDT(2)

Rich peripheral set enhances functionality, allowing effective integration of various features and management of tasks.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures responsive performance for a variety of applications including control and automation.

Temperature Grade: AUTOMOTIVE

Automotive-grade quality guarantees reliability in vehicles, essential for safety and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides high performance per watt, making this microcontroller efficient for demanding applications.

RAM Bytes: 131072

With sufficient RAM capacity, it accommodates more data and complex operations, crucial for advanced application requirements.

Technology: CMOS

CMOS technology enables low power consumption and high integration capability, essential for modern digital applications.

Terminal Form: BALL

Ball terminal form allows for easier soldering techniques like BGA, improving the reliability of connections.

Analog To Digital Convertors: 19 Ch 12-Bit

Nineteen channels of 12-bit resolution ADCs provide ample capability for monitoring and processing multiple sensor inputs.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V supports lower power circuits, enhancing efficiency in energy-sensitive designs.

PWM Channels: YES

Programmable PWM channels allow for effective motor control and signal modulation, vital for many applications.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3)

Diverse connectivity options ensure compatibility with various devices and systems, expanding application possibilities.

ROM Programmability: FLASH

FLASH programmability allows easy updates and modifications to firmware, enhancing long-term usability and flexibility.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports high-density designs, catering to space-constrained applications.

Speed: 80 rpm

The specified speed provides adequate responsiveness for applications requiring precise control.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports effective program functionality relative to the overall architecture.

No. of I/O Lines: 109

A high number of I/O lines enhances flexible interfacing with various peripherals, ideal for complex applications.

Technical Specifications

Microcontrollers STM32L471QEI3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

No. of I/O Lines:

109

No. of Terminals:

132

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3)

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(14), PWC, RTC, TIMER(14), TSC, WDT(2)

Analog To Digital Convertors:

19 Ch 12-Bit(3)

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L471QEI3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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