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STM32L452RCY6TR

STMicroelectronics

STM32L452RCY6TR by STMicroelectronics

STM32L452RCY6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 14 DMA channels. With low power modes and extensive connectivity options, it's ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,473 parts In-Stock

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4,473

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Anansix

USA . 2,626 parts In-Stock

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2,626

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Digiode

USA . 990 parts In-Stock

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990

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Distributors (Availability)

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AZTECH Wire

Italy . 405 parts In-Stock

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$10.590

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405

$10.590

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IDEA Electronic Components Group

UK . 149 parts In-Stock

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$71.689

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$64.520

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149

$71.689

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$64.520

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MKK Technologies

India . 1,760 parts In-Stock

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$134.807

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1,760

$134.807

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DigiPath Technology Company

USA . 1,760 parts In-Stock

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$134.807

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1,760

$134.807

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QUARKTWIN TECHNOLOGY LTD

USA . 10,320 parts In-Stock

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10,320

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Microchip USA

USA . 3,584 parts In-Stock

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Corphita

USA . 3,084 parts In-Stock

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3,084

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Vigor

Singapore . 1,150 parts In-Stock

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1,150

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Parana Technologies

USA . 360 parts In-Stock

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$85.715

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360

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$85.715

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Overview

Unlock the potential of your next project with the STM32L452RCY6TR microcontroller from STMicroelectronics. Renowned for its reliability and innovative design, this 32-bit Cortex-M4 powerhouse offers exceptional energy efficiency, enabling extended battery life for portable applications. Ideal for IoT devices, industrial automation, and smart home solutions, it combines versatility with robust performance. Elevate your designs effortlessly while enjoying the trusted quality that STMicroelectronics delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliable performance and longevity under various conditions.

Integrated Cache: YES

The integrated cache helps to improve processing speed and efficiency, making this microcontroller suitable for demanding applications.

Surface Mount: YES

Surface mount technology allows for compact designs, saving space on PCBs and enabling more complex systems.

Maximum Supply Voltage: 3.6 V

A maximum voltage of 3.6 V protects the device from overvoltage, thus enhancing reliability.

On Chip Data RAM Width: 8

An 8-bit data width allows for efficient data handling and processing, suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape helps in optimizing the PCB layout and design.

Bit Size: 32

A 32-bit architecture offers better processing capability than lower bit sizes, accommodating complex computations.

DAC Channels: YES

Digital-to-Analog Converter channels enable analog signal output, making the microcontroller versatile for various applications.

No. of Terminals: 64

With 64 terminals, this microcontroller offers extensive connectivity and interfacing options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This packaging style supports high-density mounting and enhances thermal performance.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage allows for energy-efficient designs, which is essential for battery-powered applications.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures stability and reliability in high-temperature environments.

CPU Family: CORTEX-M4

The Cortex-M4 family offers a powerful processing capability ideal for real-time applications.

No. of External Interrupts: 16

With 16 external interrupts, this microcontroller provides flexible event handling for various applications.

Minimum Operating Temperature: -40 °C

The capability to function in low temperatures makes it suitable for industrial applications in harsh environments.

ADC Channels: YES

The presence of ADC channels allows for signal digitization, facilitating numerous sensor interfacing.

DMA Channels: YES

Dedicated DMA channels enhance data transfer efficiency, freeing up CPU time for other tasks.

Terminal Position: BOTTOM

Bottom-positioned terminals facilitate efficient heat dissipation and contribute to compact PCB layouts.

ROM Words: 262144

A large ROM capacity allows for substantial program storage, giving developers the flexibility to implement complex applications.

Maximum Seated Height: 0.585 mm

This low seated height aids in designing compact electronic devices without compromising performance.

RAM Words: 163840

Ample RAM size allows for efficient data handling and running multiple processes simultaneously.

Width: 3.357 mm

Compact width is ideal for applications with limited space and helps achieve a smaller overall design.

Boundary Scan: YES

Boundary scan support facilitates easier testing and debugging of complex PCB layouts.

Peripherals: ANALOG COMPARATOR(2), BOR, CRC, DMA(14), PVD, PWM, RTC, TIMER(8), WDT(2)

A rich variety of integrated peripherals increases functionality and reduces the need for external components.

Maximum Clock Frequency: 48 MHz

A high clock frequency enables faster data processing and enhances the performance of real-time applications.

Length: 3.657 mm

A compact length complements space-conservative designs in modern electronics.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability across a wide range of operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture implies efficiency and performance, ideal for embedded system applications.

No. of Timers: 8

Multiple timers provide versatile timing control suitable for various applications like scheduling tasks.

RAM Bytes: 163840

The significant amount of RAM allows for more complex applications and data manipulation.

Technology: CMOS

CMOS technology offers low-power consumption and high speed, making it ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form facilitates dense packaging, optimizing circuit board layout.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V contributes to energy efficiency, especially in portable applications.

No. of DMA Channels: 14

With 14 DMA channels, data transfer is efficient, allowing for high performance in data-intensive applications.

PWM Channels: YES

PWM channels facilitate precise control over motors and other devices, essential for robotics and automation.

Connectivity: CAN, I2C(4), IRDA, LIN, LPUART, SAI, SDMMC, SPI(3), QSPI, UART, USART(3), USB

Robust connectivity options make it adaptable to various peripherals and protocols.

ROM Programmability: FLASH

FLASH memory allows for easy updates and modifications to the program, enhancing operational flexibility.

Terminal Pitch: 0.4 mm

A fine terminal pitch of 0.4 mm permits higher pin density, optimizing the design for compact applications.

Format: FLOATING POINT

Support for floating-point operations enables complex mathematical computations necessary for advanced applications.

Speed: 80 rpm

Operating at 80 rpm allows for sufficient performance in time-sensitive applications.

Low Power Mode: YES

The inclusion of a low power mode offers enhanced energy efficiency, crucial for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports the execution of varied instruction sets, promoting versatility.

No. of I/O Lines: 52

With 52 I/O lines, it provides ample interfacing options for various external components.

Technical Specifications

Microcontrollers STM32L452RCY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B64

Length:

3.657 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.357 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(4), IRDA, LIN, LPUART, SAI, SDMMC, SPI(3), QSPI, UART, USART(3), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, CRC, DMA(14), PVD, PWM, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L452RCY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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