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STM32L452RCT6TR

STMicroelectronics

STM32L452RCT6TR by STMicroelectronics

STM32L452RCT6TR by STMicroelectronics is a low-power 32-bit microcontroller featuring a Cortex-M4 CPU, operating from 1.71V to 3.6V with a max clock of 48 MHz. It includes integrated DAC and ADC channels, making it ideal for industrial applications. With 64 terminals and robust connectivity options, it's perfect for IoT devices.

Median Price

$1.357

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,000 parts In-Stock

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-

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$1.357

10k+ parts

$1.353

2,000

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$1.357

$1.353

Distributors (In-Stock)

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Digiode

USA . 3,330 parts In-Stock

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3,330

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Vyrian

USA . 2,404 parts In-Stock

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2,404

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Anansix

USA . 538 parts In-Stock

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538

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Distributors (Availability)

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AZTECH Wire

Italy . 553 parts In-Stock

1+ parts

$12.900

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553

$12.900

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Microchip USA

USA . 4,560 parts In-Stock

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$31.178

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4,560

$31.178

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IDEA Electronic Components Group

UK . 629 parts In-Stock

1+ parts

$61.411

100+ parts

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$55.270

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629

$61.411

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$55.270

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MKK Technologies

India . 832 parts In-Stock

1+ parts

$115.479

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832

$115.479

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DigiPath Technology Company

USA . 832 parts In-Stock

1+ parts

$115.479

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832

$115.479

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Corphita

USA . 3,746 parts In-Stock

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Eastek

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,643 parts In-Stock

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$73.426

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$73.426

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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1,600

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Overview

Unlock the potential of your next project with the STM32L452RCT6TR microcontroller from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics delivers a powerful solution tailored for low-power applications in industries like IoT, wearables, and smart home devices. Experience unmatched efficiency, versatile connectivity, and robust performance that elevate your designs while reducing energy consumption—ensuring you stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This robust material provides durability while keeping the weight low, making it ideal for various applications.

Integrated Cache: YES

The integrated cache helps speed up data access, enhancing performance in applications that require quick processing.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, which is vital for modern electronics.

Maximum Supply Voltage: 3.6 V

This maximum voltage ensures compatibility with a wide range of power supply systems.

On Chip Data RAM Width: 8

An 8-bit data width allows for efficient data processing and manipulation, catering to a variety of applications.

Package Shape: SQUARE

The square shape facilitates easier PCB layout and placement, increasing design flexibility.

Bit Size: 32

A 32-bit architecture provides a good balance of performance and efficiency, suited for various applications.

DAC Channels: YES

With DAC channels, this microcontroller can handle digital-to-analog conversion, useful in audio and control applications.

No. of Terminals: 64

A higher number of terminals allows for more peripheral connections and functionalities in complex designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This low-profile packaging enables compact designs, essential for space-constrained applications.

Minimum Supply Voltage: 1.71 V

This low minimum voltage allows for energy-efficient designs in battery-powered applications.

Maximum Operating Temperature: 85 °C

A wider operating temperature range ensures that the microcontroller can function reliably in harsh environments.

CPU Family: CORTEX-M4

The CORTEX-M4 CPU family offers advanced processing capabilities, making it suitable for demanding applications.

No. of External Interrupts: 16

Multiple external interrupts provide flexibility and responsiveness in real-time applications.

Minimum Operating Temperature: -40 °C

This low temperature rating enables usage in extreme conditions, enhancing the product's versatility.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and reliable connections in manufacturing.

ADC Channels: YES

Integrated ADC channels enable digital-to-analog conversions, useful in sensor interfacing applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal position provides a stable interface and improves signal integrity in complex layouts.

ROM Words: 262144

A large amount of ROM allows for extensive program storage, facilitating complex application development.

Maximum Seated Height: 1.6 mm

Low seated height helps achieve compact designs, making it suitable for modern electronic devices.

RAM Words: 163840

Plenty of RAM allows for efficient multitasking and execution of complex applications.

Width: 10 mm

A compact width ensures that the microcontroller can fit into tight spaces while maintaining connection reliability.

Boundary Scan: YES

Boundary scan capability facilitates easier debugging and testing, improving product reliability.

Peripherals: ANALOG COMPARATOR(2), BOR, CRC, DMA(14), PVD, PWM, RTC, TIMER(8), WDT(2)

A robust set of peripherals enhances the microcontroller's functionality, increasing design versatility.

Maximum Clock Frequency: 48 MHz

A relatively high clock frequency increases processing speed, making it suitable for real-time processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

This peak temperature allows for compatibility with a variety of surface-mount assembly processes.

Length: 10 mm

Compact length allows for high-density designs in consumer electronics.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller optimizes performance and efficiency, suitable for high-speed applications.

No. of Timers: 8

Multiple timers allow for precise timing control in various applications, increasing design flexibility.

RAM Bytes: 163840

An ample RAM size facilitates more complex task management, improving overall system performance.

Technology: CMOS

CMOS technology enables low power consumption along with high-speed operation, ideal for embedded systems.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and assembly, improving manufacturing efficiency.

Nominal Supply Voltage: 1.8 V

This low nominal voltage supports energy-efficient designs, essential for battery-operated devices.

No. of DMA Channels: 14

More DMA channels enhance throughput performance by enabling efficient data transfer without burdening the CPU.

PWM Channels: YES

PWM channels provide added flexibility for control applications, including motor control and dimming.

Connectivity: CAN, I2C(4), IRDA, LIN, LPUART, SAI, SDMMC, SPI(3), QSPI, UART, USART(3), USB

A wide variety of connectivity options ensures compatibility with many devices, enhancing application scope.

ROM Programmability: FLASH

Programmable flash memory allows for easy updates and modifications to software, improving product longevity.

Terminal Pitch: 0.5 mm

Small terminal pitch enables higher density designs, crucial for compact electronics.

Format: FLOATING POINT

Floating point capabilities support complex calculations, enhancing performance in scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making it essential for proper handling during manufacturing.

Speed: 80 rpm

This speed specification may refer to the operational efficiency in applications, affecting overall performance.

Low Power Mode: YES

This feature supports energy-efficient operation, particularly useful in battery-operated and power-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient instruction coding, catering to a variety of application needs.

No. of I/O Lines: 52

A high number of I/O lines increases flexibility, allowing for extensive interfacing options in design.

Technical Specifications

Microcontrollers STM32L452RCT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.4SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(4), IRDA, LIN, LPUART, SAI, SDMMC, SPI(3), QSPI, UART, USART(3), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, CRC, DMA(14), PVD, PWM, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L452RCT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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