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STM32L451REI6TR

STMicroelectronics

STM32L451REI6TR by STMicroelectronics

STM32L451REI6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and I2C. Its compact design makes it suitable for industrial use in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,417 parts In-Stock

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3,417

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Digiode

USA . 1,668 parts In-Stock

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1,668

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Anansix

USA . 1,406 parts In-Stock

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1,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,084 parts In-Stock

1+ parts

$8.740

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-

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1,084

$8.740

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Microchip USA

USA . 6,982 parts In-Stock

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$15.249

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6,982

$15.249

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IDEA Electronic Components Group

UK . 452 parts In-Stock

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$37.666

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$33.899

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452

$37.666

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$33.899

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MKK Technologies

India . 1,116 parts In-Stock

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$70.828

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1,116

$70.828

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DigiPath Technology Company

USA . 1,116 parts In-Stock

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$70.828

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1,116

$70.828

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Parana Technologies

USA . 1,248 parts In-Stock

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$45.035

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$45.035

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Corphita

USA . 1,203 parts In-Stock

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1,203

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Overview

Unlock the potential of your projects with the STM32L451REI6TR microcontroller from STMicroelectronics, a trusted leader in innovative solutions. This powerful yet energy-efficient device is designed for a myriad of applications, from wearable technology to industrial automation. Experience unmatched performance and reliability, backed by ST's commitment to quality and cutting-edge technology. Elevate your designs and deliver exceptional results with this versatile microcontroller!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package provides good thermal and mechanical protection, making it suitable for various applications.

Integrated Cache: YES

With integrated cache, this microcontroller can execute instructions faster, improving overall system performance.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The reasonable maximum supply voltage ensures system compatibility while maintaining low power consumption.

On Chip Data RAM Width: 8

An 8-bit RAM width enhances the flexibility and efficiency of data handling within embedded applications.

Package Shape: SQUARE

The square package shape facilitates easier mounting and compact storage in various electronic designs.

Bit Size: 32

The 32-bit architecture allows for more complex computations and processing capabilities, expanding application possibilities.

DAC Channels: YES

Integrated Digital-to-Analog Converter (DAC) channels provide versatility for applications that require analog signal generation.

No. of Terminals: 64

With 64 terminals, this microcontroller offers numerous I/O options for connecting various peripherals and sensors.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and very thin profile enable high-density designs, which is essential for modern electronics.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage extends the operational range and enhances battery performance in portable devices.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures reliability in demanding environments, suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 family provides advanced performance for demanding tasks, making it ideal for real-time processing.

No. of External Interrupts: 16

Having 16 external interrupts allows for responsive design to multiple external events, enhancing system interactivity.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold ensures reliability in harsh environments, ideal for industrial and automotive applications.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) channels provide real-time data monitoring, crucial for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) improves performance by allowing peripherals to access memory without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB design and reduces footprint, allowing for flexible circuit layouts.

ROM Words: 524288

A large ROM capacity accommodates complex applications and extensive firmware, enabling robust functionality.

Maximum Seated Height: 0.6 mm

Low seated height contributes to a slim profile, ideal for compact designs where space is at a premium.

Digital To Analog Convertors: 1-Ch 12-Bit

A 12-bit resolution in the DAC enhances the accuracy of analog signals in applications requiring precision.

RAM Words: 163840

Sufficient RAM capacity allows for more complex algorithms and smoother multitasking capabilities.

Width: 5 mm

Narrow width allows for higher density packaging and contributes to the overall compact design.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, increasing ease of manufacturing and quality assurance.

Peripherals: BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

Diverse peripherals enhance functionality, making this microcontroller ideal for a wide range of applications.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency supports faster processing, suitable for real-time applications requiring quick response times.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in extreme environments, suitable for various industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances efficiency and performance, making it suitable for high-performance embedded systems.

No. of Timers: 12

The presence of 12 timers allows for versatile timing and control applications, enhancing design flexibility.

RAM Bytes: 163840

Large RAM memory expands the capabilities of applications, allowing for more data storage and processing.

Technology: CMOS

CMOS technology ensures low power consumption, making it suitable for battery-operated and energy-efficient devices.

Terminal Form: BALL

Ball terminal form provides a reliable connection method for compact and high-density PCB designs.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 channels with 12-bit resolution allows for simultaneous readings from multiple sensors, enhancing data acquisition.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is ideal for low-power applications, extending battery life in portable devices.

No. of DMA Channels: 14

With 14 DMA channels, this microcontroller can handle multiple data transfers simultaneously, improving efficiency.

PWM Channels: YES

Integrated PWM channels facilitate motor control and other applications requiring precise duty cycle management.

Connectivity: CAN, I2C(4), LPUART, QSPI, SAI, SDMMC, SPI(3), UART, USART(3), USB

Extensive connectivity options ensure compatibility with a wide range of peripherals and communication standards.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development, enhancing long-term usability.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density component placement, critical for compact electronic designs.

Format: FLOATING POINT

Floating point format enhances the performance of mathematical computations, ideal for applications requiring numerical precision.

Speed: 80 rpm

The operational speed of 80 rpm can be relevant in applications needing precise rotational control.

Low Power Mode: YES

Low power mode extends battery life in remote applications, making it suitable for IoT and mobile devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width simplifies programming and enhances compatibility with existing systems.

No. of I/O Lines: 52

With 52 I/O lines, the microcontroller can connect to a wide variety of peripherals and expand functionality.

Technical Specifications

Microcontrollers STM32L451REI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, QSPI, SAI, SDMMC, SPI(3), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L451REI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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