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STM32L451RCI6

STMicroelectronics

STM32L451RCI6 by STMicroelectronics

STM32L451RCI6 microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With 16 ADC channels and low power modes, it's ideal for energy-efficient applications. Its compact design includes a very thin profile package with 64 terminals for versatile connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

USA . 490 parts In-Stock

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Vyrian

USA . 5,587 parts In-Stock

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Anansix

USA . 2,823 parts In-Stock

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Digiode

USA . 440 parts In-Stock

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Vigor

Singapore . 915 parts In-Stock

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$7.100

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915

$7.100

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AZTECH Wire

Italy . 993 parts In-Stock

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$13.730

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$13.730

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IDEA Electronic Components Group

UK . 1,666 parts In-Stock

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$19.239

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$17.315

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Microchip USA

USA . 1,531 parts In-Stock

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$21.840

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MKK Technologies

India . 1,546 parts In-Stock

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$36.178

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DigiPath Technology Company

USA . 1,546 parts In-Stock

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$36.178

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iodParts Technologies Inc.

India . 30,000 parts In-Stock

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Perfect Parts

USA . 3,842 parts In-Stock

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Corphita

USA . 3,118 parts In-Stock

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Eastek

USA . 1,470 parts In-Stock

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GreenTree Electronics

Israel . 1,470 parts In-Stock

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Parana Technologies

USA . 1,349 parts In-Stock

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$23.003

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$23.003

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Overview

Unlock a world of innovation with the STM32L451RCI6 microcontroller from STMicroelectronics! Renowned for their quality and reliability, STMicroelectronics delivers this powerful, low-power solution designed for diverse applications—from smart home devices to industrial automation. With its exceptional performance in a compact package, the STM32L451RCI6 empowers you to create energy-efficient, high-performance systems that adapt seamlessly to your needs, ensuring both longevity and value in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental conditions, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and simplified assembly, enhancing the product's fit in space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for battery-operated devices while ensuring safe operation.

On Chip Data RAM Width: 8

An 8-bit RAM width is efficient for many embedded applications, balancing speed and resource utilization.

Package Shape: SQUARE

A square package shape facilitates easy placement on PCBs, promoting design versatility.

Bit Size: 32

A 32-bit architecture allows for processing greater amounts of data and performing complex calculations, ideal for advanced applications.

DAC Channels: YES

Having DAC channels enhances the microcontroller's ability to convert digital signals into analog, expanding its application scope.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for various peripherals and devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style minimizes space requirements and enhances performance by allowing better thermal management.

Minimum Supply Voltage: 1.71 V

The ability to operate at a low minimum supply voltage supports energy efficiency, crucial for battery-operated applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C enables the microcontroller to function reliably in a variety of environments and conditions.

CPU Family: CORTEX-M4

The ARM Cortex-M4 CPU family is optimized for low power consumption and high performance, making it excellent for embedded applications.

No. of External Interrupts: 16

Having 16 external interrupts allows for responsive handling of various events, enabling efficient multitasking in applications.

Minimum Operating Temperature: -40 °C

A wide temperature operating range ensures reliability and performance in extreme environments, making it suitable for industrial applications.

ADC Channels: YES

Built-in ADC channels provide the ability to read analog signals, making it ideal for sensor applications.

DMA Channels: YES

Direct Memory Access capabilities allow for faster data transfers between peripherals and memory, enhancing overall system efficiency.

Terminal Position: BOTTOM

Bottom-terminal positioning allows for a compact layout and is well-suited for flexible PCB designs.

ROM Words: 262144

With 262,144 ROM words, there is sufficient memory for complex programs and functions, making it suitable for more sophisticated applications.

Maximum Seated Height: 0.6 mm

A low seated height helps in maintaining a compact design in multi-layer PCBs.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit DAC provides fine resolution for analog output, essential for applications requiring high accuracy.

Width: 5 mm

A compact width allows for efficient use of space on a PCB, contributing to smaller device sizes.

Boundary Scan: YES

The presence of boundary scan features enables easier testing and debugging of PCB designs.

Peripherals: BOR, COMPARATOR(2), DMA(14), PVD, PVM, PWM, RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

A rich variety of peripherals enhances functionality and allows for diverse applications, ranging from sensor management to control tasks.

Maximum Clock Frequency: 48 MHz

A high clock frequency allows for faster processing and more rapid task execution, improving system performance.

Length: 5 mm

This length supports compact designs, allowing the microcontroller to fit into smaller devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance by optimizing the instruction set for efficiency, suitable for various applications.

No. of Timers: 12

With 12 timers, the microcontroller can manage multiple timing tasks efficiently, ideal for complex applications.

RAM Bytes: 163840

A substantial amount of RAM (163,840 bytes) allows for robust program execution and data handling.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball form terminals facilitate soldering to PCBs, ensuring reliable connections in compact designs.

Analog To Digital Converters: 16-Ch 12-Bit

16 channels of 12-bit ADCs provide the capability to read multiple analog inputs simultaneously, enhancing application flexibility.

Maximum Supply Current: 10.5 mA

A maximum supply current of 10.5 mA helps maintain low power consumption, which is critical for portable devices.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V ensures compatibility with most standard microcontroller applications.

No. of DMA Channels: 14

Having 14 DMA channels significantly boosts data throughput, reducing CPU workload and improving efficiency.

No. of Serial I/Os: 5

With 5 serial I/O interfaces, this microcontroller can communicate effectively with various devices and peripherals.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of signals and motors, making this product versatile for control applications.

Connectivity: CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), UART, USART(3)

A wide range of connectivity options makes this microcontroller suitable for various networking and interfacing tasks.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing long-term application flexibility.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density PCB layouts, suitable for advanced electronics designs.

Format: FLOATING POINT

Support for floating-point operations facilitates the handling of real-number calculations, essential for computational tasks.

Speed: 80 rpm

Operating at 80 RPM provides the necessary performance for applications where speed is critical.

Low Power Mode: YES

Low power mode capability extends battery life in portable applications, making it an energy-efficient choice.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient program execution and memory utilization.

No. of I/O Lines: 52

With 52 I/O lines, this microcontroller can interface with a large number of peripheral devices, enhancing its functionality.

Technical Specifications

Microcontrollers STM32L451RCI6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Current:

10.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), UART, USART(3)

Peripherals:

BOR, COMPARATOR(2), DMA(14), PVD, PVM, PWM, RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L451RCI6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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