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STM32L443RCI6TR

STMicroelectronics

STM32L443RCI6TR by STMicroelectronics

STM32L443RCI6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 14 DMA channels. Ideal for low-power applications, it supports various peripherals like ADC and DAC. Its compact design suits industrial environments with -40 °C to 85 °C temp range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,534 parts In-Stock

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4,534

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Anansix

USA . 1,623 parts In-Stock

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1,623

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Digiode

USA . 1,402 parts In-Stock

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1,402

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Distributors (Availability)

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Vigor

Singapore . 2,493 parts In-Stock

1+ parts

$4.010

100+ parts

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2,493

$4.010

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AZTECH Wire

Italy . 1,062 parts In-Stock

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$10.780

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1,062

$10.780

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Microchip USA

USA . 8,383 parts In-Stock

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$29.834

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8,383

$29.834

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IDEA Electronic Components Group

UK . 1,705 parts In-Stock

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$48.628

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$43.765

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1,705

$48.628

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$43.765

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MKK Technologies

India . 2,364 parts In-Stock

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$91.441

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2,364

$91.441

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DigiPath Technology Company

USA . 2,364 parts In-Stock

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$91.441

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2,364

$91.441

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,079 parts In-Stock

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Corphita

USA . 4,247 parts In-Stock

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Parana Technologies

USA . 100 parts In-Stock

1+ parts

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$58.142

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100

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$58.142

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Overview

Unlock endless possibilities with the STM32L443RCI6TR microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile powerhouse is designed for applications ranging from IoT devices to smart home technology, delivering exceptional performance while conserving energy. With robust features, industrial-grade reliability, and an efficient design, it ensures your projects are future-ready, helping you build smarter solutions that stand out in today’s competitive market. Embrace excellence with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC

The use of plastic for the package body ensures lightweight and cost-effective manufacturing, making it suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microcontroller, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for compact design and easier assembly, which is ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage allows compatibility with a broad range of power sources, increasing flexibility in design.

On Chip Data RAM Width: 8

An 8-bit data RAM width provides a good balance of speed and simplicity for various applications.

Package Shape: SQUARE

The square shape of the package optimizes space utilization on PCBs, facilitating denser designs.

Bit Size: 32

The 32-bit architecture allows for efficient handling of large data types and complex calculations, making it suitable for advanced applications.

DAC Channels: YES

The inclusion of DAC channels enables the microcontroller to output analog signals, expanding its range of applications in control systems.

No. of Terminals: 64

With 64 terminals, this microcontroller provides plenty of connectivity options for various inputs and outputs, enhancing its versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and very thin profile of the grid array package make it ideal for high-density applications where space is a constraint.

Minimum Supply Voltage: 1.71 V

Operating at a low minimum supply voltage increases efficiency and allows operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

The capability to operate at high temperatures makes this microcontroller suitable for industrial and harsh environments.

CPU Family: CORTEX-M4

The CORTEX-M4 family ensures high performance and energy efficiency, making it a great choice for embedded applications.

No. of External Interrupts: 16

Having 16 external interrupts allows for extensive interaction with peripherals, making the microcontroller more responsive to events.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this microcontroller reliable in extreme outdoor conditions.

Terminal Finish: TIN SILVER

The tin-silver terminal finish enhances solderability and provides good conductivity, ensuring long-term reliability.

ADC Channels: YES

Having ADC channels allows for the conversion of analog signals to digital, enabling the microcontroller to work with a variety of sensors.

DMA Channels: YES

Dedicated DMA channels allow for efficient data transfers without CPU intervention, optimizing processing capabilities.

Terminal Position: BOTTOM

Bottom terminal positioning is ideal for various layouts, providing flexibility in PCB design.

ROM Words: 262144

A large ROM capacity allows for extensive program storage, accommodating complex applications.

Maximum Seated Height: 0.6 mm

With a low seated height, this microcontroller is perfect for compact designs, enhancing overall system integration.

RAM Words: 16384

Adequate RAM size supports efficient data processing for more demanding applications.

Width: 5 mm

A compact width allows for smaller form factor designs, particularly beneficial in portable devices.

Boundary Scan: YES

Boundary scan capability provides an essential feature for testing and debugging circuits, ensuring robust design.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures responsiveness and adequate performance for most applications.

Peak Reflow Temperature °C: 260

Robust peak reflow temperature indicates good soldering reliability, making it suitable for mass production.

Length: 5 mm

A short length enhances mounting options and supports miniaturization trends in electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable operation in challenging environments and prolongs product life.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and power efficiency, suitable for various embedded applications.

No. of Timers: 11

The inclusion of multiple timers provides flexibility for time-sensitive applications, enhancing functionality.

RAM Bytes: 65536

A solid amount of RAM ensures smooth operation and the capability to handle complex tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption, which is crucial for battery-operated devices.

Terminal Form: BALL

Ball terminal forms provide a reliable connection and facilitate complex layouts in smaller devices.

Maximum Supply Current: 9.8 mA

A maximum supply current of 9.8 mA is low enough to support energy-efficient designs, prolonging battery life.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns well with common power supplies and battery systems, ensuring compatibility.

No. of DMA Channels: 14

Having 14 DMA channels allows for high-speed data transfers, improving system performance significantly.

PWM Channels: YES

PWM channels enhance the microcontroller's ability to control devices such as motors and lights with precision.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, increasing the microcontroller's longevity.

Terminal Pitch: 0.5 mm

A 0.5mm terminal pitch enables high density on PCBs, accommodating modern miniaturized designs.

Format: FLOATING POINT

Floating point format provides advanced mathematical capabilities, ideal for applications requiring precise calculations.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates moderate sensitivity to moisture, which entails proper handling during manufacturing and assembly.

Speed: 80 rpm

A speed of 80 rpm is suitable for applications involving sensor processing or slow actuation systems.

Low Power Mode: YES

The inclusion of low power modes enhances battery life, making the microcontroller well-suited for portable and energy-efficient applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width assists in faster data retrieval and efficient program execution.

No. of I/O Lines: 52

With 52 I/O lines, this microcontroller provides significant interaction capabilities with other components or sensors.

Technical Specifications

Microcontrollers STM32L443RCI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e2

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Current:

9.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32L443RCI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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