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STM32L443RCI3TR

STMicroelectronics

STM32L443RCI3TR by STMicroelectronics

STM32L443RCI3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and supports low power modes. With 64 terminals and integrated DAC/ADC channels, it's ideal for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,385 parts In-Stock

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Anansix

USA . 734 parts In-Stock

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734

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Digiode

USA . 207 parts In-Stock

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207

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Distributors (Availability)

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AZTECH Wire

Italy . 242 parts In-Stock

1+ parts

$18.850

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242

$18.850

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IDEA Electronic Components Group

UK . 465 parts In-Stock

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$46.292

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$41.662

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465

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Component Stockers USA

USA . 1,028 parts In-Stock

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$84.600

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$84.600

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MKK Technologies

India . 1,468 parts In-Stock

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$87.048

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1,468

$87.048

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DigiPath Technology Company

USA . 1,468 parts In-Stock

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$87.048

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1,468

$87.048

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,174 parts In-Stock

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3,174

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Parana Technologies

USA . 1,096 parts In-Stock

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$55.349

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1,096

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$55.349

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Overview

Unlock your project’s potential with the STM32L443RCI3TR microcontroller from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers a versatile solution ideal for low-power applications, automotive systems, and more. With its advanced processing capabilities and energy efficiency, this microcontroller empowers designers to create smarter, greener devices without compromising performance. Experience quality you can trust and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC

The use of durable plastic material enhances the product's resilience to environmental factors while keeping the cost economical.

Integrated Cache: YES

Having an integrated cache improves data access speeds, resulting in better overall performance.

Surface Mount: YES

Surface mount technology allows for smaller, more efficient designs, which is ideal for compact electronic devices.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with a wide variety of power sources while maintaining optimal performance.

On Chip Data RAM Width: 8

An 8-bit RAM width can enhance the efficiency of data processing, suitable for many embedded applications.

Package Shape: SQUARE

The square package shape is advantageous for layout efficiency on printed circuit boards (PCBs).

Bit Size: 32

A 32-bit architecture allows for handling larger data types and memory addressing, providing improved computational capabilities.

DAC Channels: YES

Integrated DAC channels enable analog output capabilities, enhancing versatility for applications like audio processing.

No. of Terminals: 64

With 64 terminals, this microcontroller supports a variety of peripheral devices and interfaces, allowing for extensive connectivity.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style is perfect for modern devices that require compact form factors while ensuring high-density interconnections.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage makes it energy efficient and allows it to operate in battery-powered applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range makes this microcontroller suitable for automotive and industrial applications where temperature extremes can occur.

CPU Family: CORTEX-M4

The Cortex-M4 family is renowned for its performance and energy efficiency, making it an excellent choice for real-time applications.

No. of External Interrupts: 16

With 16 external interrupts, this microcontroller can handle multiple events simultaneously, which is essential for responsive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product reliable in extreme cold environments, perfect for automotive use.

ADC Channels: YES

Integrated ADC channels facilitate the conversion of analog signals to digital data, broadening the range of applications.

DMA Channels: YES

The presence of DMA channels enables efficient data transfer without CPU intervention, ultimately improving system performance.

Terminal Position: BOTTOM

Bottom terminal positioning helps in optimal PCB layout and is great for automated assembly processes.

ROM Words: 262144

A substantial ROM capacity allows for complex firmware and applications to be stored directly on the microcontroller.

Maximum Seated Height: 0.6 mm

A very low profile enhances the microcontroller's compatibility with high-density applications and small devices.

RAM Words: 16384

This amount of RAM supports the execution of more complex algorithms and data handling processes.

Width: 5 mm

A compact width contributes to overall space-saving in electronic designs, ideal for portable devices.

Boundary Scan: YES

Support for boundary scan improves testing and debugging capabilities, which is crucial for manufacturing quality control.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz allows for fast processing speeds, enabling real-time applications and quick response times.

Temperature Grade: AUTOMOTIVE

The automotive grade classification signifies high reliability and performance under stressful conditions found in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture simplifies instruction sets and enhances processing efficiency, making it effective for embedded systems.

No. of Timers: 11

Having 11 timer units provides ample flexibility for time-sensitive tasks and functionalities in various applications.

RAM Bytes: 65536

With 64KB of RAM, the microcontroller can support larger applications, making it suitable for complex systems.

Technology: CMOS

CMOS technology is known for low power consumption, making it ideal for battery-operated and power-sensitive applications.

Terminal Form: BALL

Ball terminal form enhances solderability and improves electrical performance in compact setups.

Maximum Supply Current: 10.3 mA

A max supply current of 10.3 mA allows for efficient power management in portable devices.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3V allows for easy integration with common power supplies in various applications.

No. of DMA Channels: 14

With 14 DMA channels, this microcontroller can handle multiple data streams efficiently, enhancing performance.

PWM Channels: YES

PWM capability is crucial for controlling motors and other devices, broadening possible application areas.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming of the firmware, which is beneficial for long-term product support.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density packing of components, which is essential for miniaturized designs.

Format: FLOATING POINT

Floating point format enhances mathematical precision and capability in computations, useful for more complex algorithms.

Speed: 80 rpm

Speed of 80 rpm indicates capability in applications such as robotics or motor control, suitable for precision tasks.

Low Power Mode: YES

Low power mode functionality extends battery life, making it ideal for portable and IoT devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports simple, efficient code that can still handle a wide range of applications.

No. of I/O Lines: 52

Having 52 I/O lines allows extensive interfacing capabilities with other peripherals, making it a flexible choice for developers.

Technical Specifications

Microcontrollers STM32L443RCI3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Current:

10.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32L443RCI3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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