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STM32L443RCI3

STMicroelectronics

STM32L443RCI3 by STMicroelectronics

STM32L443RCI3 microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 48 MHz clock frequency. With 64 terminals and integrated ADC/DMA channels, it's ideal for low-power applications in IoT devices. Its compact design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,266 parts In-Stock

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10,266

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Digiode

USA . 3,010 parts In-Stock

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3,010

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Anansix

USA . 1,952 parts In-Stock

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1,952

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 100 parts In-Stock

1+ parts

$7.530

100+ parts

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100

$7.530

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AZTECH Wire

Italy . 37 parts In-Stock

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$12.470

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37

$12.470

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Microchip USA

USA . 3,968 parts In-Stock

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$25.788

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3,968

$25.788

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

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$67.631

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$60.868

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1,576

$67.631

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$60.868

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MKK Technologies

India . 1,365 parts In-Stock

1+ parts

$127.176

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1,365

$127.176

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DigiPath Technology Company

USA . 1,365 parts In-Stock

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$127.176

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1,365

$127.176

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 2,929 parts In-Stock

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2,929

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Parana Technologies

USA . 2,333 parts In-Stock

1+ parts

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$80.863

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2,333

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$80.863

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Overview

Unlock the potential of your next project with the STM32L443RCI3 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a powerful 32-bit solution that excels in energy efficiency and performance. Perfect for IoT devices, wearables, and smart home applications, this compact gem enhances functionality while minimizing power consumption, making it the ideal choice for developers seeking reliability and advanced capabilities. Elevate your designs with STM32's trusted technology!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact and space-constrained applications.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with a variety of power supply systems and components.

Package Shape: SQUARE

The square shape simplifies layout and placement in circuit boards, offering flexibility in design.

Bit Size: 32

A 32-bit architecture enhances processing capabilities, enabling more complex computations and increased performance.

No. of Terminals: 64

Having a high number of terminals allows for extensive connectivity options, making it versatile for various applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch enable high-density packaging which is ideal for modern compact devices.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage contributes to lower power consumption, making it suitable for battery-powered applications.

ADC Channels: YES

The presence of ADC channels enhances the product’s ability to handle analog signals, expanding its application range.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient heat dissipation and facilitates easier soldering for manufacturers.

Width: 5 mm

The compact width makes this microcontroller suitable for small device designs.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz delivers adequate speed for most embedded applications.

Length: 5 mm

Similar to its width, the short length promotes compactness, ideal for limited space environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enhances efficiency and makes it easier to implement high-performance applications.

Terminal Form: BALL

Ball terminal form factors improve electrical performance and allow for more robust connections.

Nominal Supply Voltage: 3 V

A nominal voltage of 3 V is compatible with most digital circuits, ensuring reliable operation.

PWM Channels: YES

PWM capabilities provide enhanced control for motors and other devices, making it valuable in automation systems.

Terminal Pitch: 0.5 mm

A 0.5 mm pitch allows for higher density and a smaller footprint, facilitating advanced circuit designs.

Speed: 80 rpm

The specified speed supports applications that require rotational control, such as motors in drones or small robotics.

No. of I/O Lines: 52

With 52 I/O lines, it provides ample connectivity options for interfacing with sensors, actuators, and other circuitry.

Technical Specifications

Microcontrollers STM32L443RCI3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

5 mm

No. of I/O Lines:

52

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32L443RCI3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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