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STM32L443CCF6TR

STMicroelectronics

STM32L443CCF6TR by STMicroelectronics

STM32L443CCF6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.71V and 3.6V, and supports up to 48MHz clock frequency. With integrated DAC, ADC, and DMA channels, it's ideal for industrial applications requiring low power consumption. Its compact design ensures efficient use in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,535 parts In-Stock

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6,535

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Digiode

USA . 2,290 parts In-Stock

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2,290

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Anansix

USA . 1,785 parts In-Stock

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1,785

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Distributors (Availability)

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Vigor

Singapore . 1,482 parts In-Stock

1+ parts

$3.670

100+ parts

-

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1,482

$3.670

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AZTECH Wire

Italy . 219 parts In-Stock

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$14.360

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-

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219

$14.360

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Microchip USA

USA . 6,397 parts In-Stock

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$27.326

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6,397

$27.326

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IDEA Electronic Components Group

UK . 1,803 parts In-Stock

1+ parts

$63.363

100+ parts

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$57.027

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1,803

$63.363

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$57.027

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Component Stockers USA

USA . 2,236 parts In-Stock

1+ parts

$63.610

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2,236

$63.610

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MKK Technologies

India . 289 parts In-Stock

1+ parts

$119.150

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289

$119.150

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DigiPath Technology Company

USA . 289 parts In-Stock

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$119.150

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289

$119.150

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Parana Technologies

USA . 1,908 parts In-Stock

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$75.760

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1,908

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$75.760

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Corphita

USA . 1,522 parts In-Stock

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1,522

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Overview

Empower your projects with the STM32L443CCF6TR microcontroller from STMicroelectronics, a trusted leader in innovation and quality. Designed for efficiency and versatility, this compact powerhouse excels in low-power applications while offering seamless connectivity and robust performance. Ideal for IoT devices, industrial automation, and smart technologies, it delivers exceptional value, ensuring your creations are not only cutting-edge but also reliable and energy-efficient. Elevate your designs with ST's legacy of excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy offers excellent protection against environmental factors, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy integration into compact circuit designs, making it ideal for modern electronic applications.

Maximum Supply Voltage: 3.6 V

This voltage range supports a variety of power supply designs, providing flexibility for integration into different systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs and simplifies the assembly process.

Bit Size: 32

A 32-bit architecture improves processing power and enables the execution of more complex algorithms, making it suitable for advanced applications.

DAC Channels: YES

Integrated DAC channels allow for precise analog output, beneficial for applications requiring signal modulation.

No. of Terminals: 49

A higher number of terminals provides extensive connectivity options, enabling versatile interfacing with sensors and other peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the package contribute to high-density designs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows operation in battery-powered applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The industrial-grade temperature tolerance ensures reliable operation in harsh environments, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to function at low temperatures expands its applicability to extreme environments, ensuring robustness.

ADC Channels: YES

With integrated ADC channels, this microcontroller can effectively interface with analog sensors, enhancing data acquisition capabilities.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention, improving system performance in data-heavy applications.

Terminal Position: BOTTOM

Bottom terminal positioning can simplify PCB layout and assembly, optimizing space and reducing potential signal interference.

Maximum Seated Height: 0.585 mm

A low seated height aids in the design of compact and low-profile devices, compliant with modern design trends.

Width: 3.127 mm

This width supports high-density placements on PCBs, making it a great choice for space-constrained designs.

Maximum Clock Frequency: 48 MHz

A high clock frequency boosts performance, allowing for faster processing and responsiveness in applications.

Length: 3.141 mm

This compact length allows for integration into space-limited environments, providing flexibility in design layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in demanding applications, making it suitable for critical systems.

Peripheral IC Type: MICROCONTROLLER, RISC

This RISC architecture enhances efficiency and speed, allowing for optimized performance in embedded systems.

Technology: CMOS

CMOS technology contributes to low power consumption while maintaining high-speed performance, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form allows for more reliable solder connections, improving the durability of the device post-assembly.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V is optimal for low-power applications, maximizing battery life and system efficiency.

PWM Channels: YES

Integrated PWM channels enable precise control of motors and other devices, enhancing applications in automation and robotics.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, making this microcontroller suitable for dynamic applications.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for higher terminal density, facilitating more complex and feature-rich designs.

Speed: 80 rpm

An operational speed of 80 rpm provides reliable performance in time-sensitive applications, ensuring timely processing.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows efficient data handling, making it suitable for a wide range of control applications.

No. of I/O Lines: 39

A total of 39 I/O lines enables extensive interfacing capabilities, which is essential for complex embedded systems.

Technical Specifications

Microcontrollers STM32L443CCF6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B49

Length:

3.141 mm

No. of I/O Lines:

39

No. of Terminals:

49

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.127 mm

Peripheral IC Type:

Trade Compliance

STM32L443CCF6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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