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STM32L433CCY3TR

STMicroelectronics

STM32L433CCY3TR by STMicroelectronics

STM32L433CCY3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 125 °C, and supports low power modes. It includes 14 DMA channels and dual 12-bit DACs for versatile applications. Ideal for automotive and IoT solutions, it offers robust connectivity options.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,562 parts In-Stock

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Digiode

USA . 3,836 parts In-Stock

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Anansix

USA . 285 parts In-Stock

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285

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Distributors (Availability)

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Vigor

Singapore . 2,500 parts In-Stock

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$4.020

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2,500

$4.020

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AZTECH Wire

Italy . 996 parts In-Stock

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$9.050

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996

$9.050

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IDEA Electronic Components Group

UK . 1,594 parts In-Stock

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$14.308

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$12.877

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1,594

$14.308

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MKK Technologies

India . 1,626 parts In-Stock

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$26.905

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$26.905

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DigiPath Technology Company

USA . 1,626 parts In-Stock

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$26.905

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QUARKTWIN TECHNOLOGY LTD

USA . 28,194 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,139 parts In-Stock

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Parana Technologies

USA . 824 parts In-Stock

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$17.107

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Overview

Unlock innovation and efficiency with the STM32L433CCY3TR microcontroller by STMicroelectronics. Renowned for its cutting-edge quality, this powerful MCU excels in low-power applications, making it ideal for IoT devices, smart sensors, and wearable technology. With a robust design and versatile connectivity options, it empowers developers to create advanced solutions while benefiting from ST's trusted expertise and commitment to excellence. Elevate your projects with unparalleled performance and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction provides excellent protection against environmental factors, making the microcontroller suitable for various applications.

Integrated Cache: YES

With integrated cache, the microcontroller can achieve faster data access speeds, enhancing overall performance during operation.

Surface Mount: YES

Surface mount capability enables compact designs, saving board space and facilitating automated assembly.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of power supply systems, enhancing flexibility in design.

On Chip Data RAM Width: 8

The 8-bit RAM width optimizes data handling for various applications, balancing performance and memory efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier fitting in boards and contributes to effective cooling solutions.

Bit Size: 32

A 32-bit architecture supports complex computations and efficient processing, making it ideal for high-performance applications.

DAC Channels: YES

Integrated DAC channels allow for direct signal generation from digital data, simplifying design for mixed-signal applications.

No. of Terminals: 49

With 49 terminals, the microcontroller provides extensive connectivity options, enabling versatile interfacing capabilities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style allows for high-density PCB designs, essential for compact electronic devices.

Minimum Supply Voltage: 1.71 V

A minimum supply voltage of 1.71V guarantees low-power operation, extending battery life in portable applications.

Maximum Operating Temperature: 125 °C

This high operating temperature range makes it suitable for automotive and industrial applications in extreme conditions.

CPU Family: CORTEX-M4

The Cortex-M4 family enables efficient computation and DSP capabilities, ideal for both control and signal processing tasks.

No. of External Interrupts: 16

16 external interrupts provide extensive options for managing real-time events, enhancing responsiveness in critical applications.

Minimum Operating Temperature: -40 °C

A wide temperature operating range ensures reliable performance in harsh environments, making it suitable for automotive applications.

ADC Channels: YES

Having integrated ADC channels allows for direct analog signal processing, crucial for sensor applications.

DMA Channels: YES

DMA channels increase data transfer efficiency, reducing CPU load and improving overall performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates effective space management on PCBs, particularly in compact designs.

ROM Words: 262144

A substantial ROM size allows for complex firmware and application storage, supporting sophisticated functionalities.

Maximum Seated Height: 0.585 mm

The low seated height is conducive for space-constrained applications, ensuring compatibility with compact hardware.

Digital To Analog Convertors: 2-Ch 12-Bit

The 2-channel 12-bit DAC provides high-resolution signal conversion, which is important for precise control applications.

RAM Words: 65536

A generous amount of RAM supports efficient execution of complex operations and multitasking, enhancing performance.

Width: 3.127 mm

Compact dimensions facilitate implementation in small-scale electronic designs without compromising functionality.

Boundary Scan: YES

Boundary scan support enhances debugging capabilities, simplifying testing and improving reliability during development.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, PWM, RTC, TIMER(9), WDT(2)

The comprehensive range of peripherals allows for versatile application development and integration into various systems.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures fast processing speeds for real-time applications.

Length: 3.141 mm

With a compact length, this microcontroller can be easily incorporated into small devices, maximizing design efficiency.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and durability under the harshest conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction processing, improving performance for various applications.

No. of Timers: 11

Having 11 timers enhances scheduling and time-based functions, essential for real-time processing applications.

RAM Bytes: 65536

Sufficient RAM capacity allows for efficient data management and program execution, supporting complex applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption while maintaining high-speed performance.

Terminal Form: BALL

Ball terminal form is user-friendly for soldering and provides robust connectivity options for different PCB designs.

Analog To Digital Convertors: 10-Ch 12-Bit

With 10-channel ADCs, it supports multiple sensors, making it suitable for sensor integration and data acquisition.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V is standard and compatible with most electronic devices and components.

No. of DMA Channels: 14

14 DMA channels enable efficient data management and transfer, enhancing the performance of memory-intensive applications.

PWM Channels: YES

PWM channel availability allows for precise control of motors and lights, facilitating a range of control applications.

Connectivity: CAN, I2C(3), LPUART, QSPI, SAI, SPI(3), SWPMI, USART(3), USB

Diverse connectivity options ensure compatibility with various peripherals and systems, enhancing application flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, suitable for applications needing frequent firmware changes.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch enables high-density packing on PCBs, making it suitable for compact electronic designs.

Format: FLOATING POINT

The floating-point format allows for higher precision in mathematical computations, benefiting applications requiring accurate data analysis.

Speed: 80 rpm

With a specified operational speed, this microcontroller can effectively manage applications requiring precise timing and control.

Low Power Mode: YES

Low power mode capability optimizes energy consumption, making it ideal for battery-powered and energy-sensitive applications.

On Chip Program ROM Width: 8

The 8-bit ROM width ensures efficient storage and retrieval of program data, optimizing the overall system performance.

No. of I/O Lines: 39

Having 39 I/O lines provides significant interfacing options for connecting with sensors, actuators, and other peripherals.

Technical Specifications

Microcontrollers STM32L433CCY3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B49

Length:

3.141 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

39

No. of Terminals:

49

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.127 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, QSPI, SAI, SPI(3), SWPMI, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, PWM, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L433CCY3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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