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STM32L433CCT3TR

STMicroelectronics

STM32L433CCT3TR by STMicroelectronics

STM32L433CCT3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 125 °C, and supports low power modes. It includes 2 DACs, 10 ADCs, and offers extensive connectivity options like CAN and USB. Ideal for automotive applications requiring efficiency and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,876 parts In-Stock

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7,876

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Digiode

USA . 2,615 parts In-Stock

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2,615

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Anansix

USA . 366 parts In-Stock

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366

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 2,430,450 parts In-Stock

1+ parts

$0.020

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-

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2,430,450

$0.020

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AZTECH Wire

Italy . 70 parts In-Stock

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$22.100

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70

$22.100

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Microchip USA

USA . 4,094 parts In-Stock

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$31.273

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4,094

$31.273

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IDEA Electronic Components Group

UK . 1,915 parts In-Stock

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$59.196

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$53.276

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1,915

$59.196

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$53.276

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MKK Technologies

India . 832 parts In-Stock

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$111.313

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832

$111.313

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DigiPath Technology Company

USA . 832 parts In-Stock

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$111.313

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832

$111.313

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Corphita

USA . 280 parts In-Stock

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280

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Parana Technologies

USA . 141 parts In-Stock

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$70.777

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141

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$70.777

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Overview

Elevate your projects with the STM32L433CCT3TR microcontroller from STMicroelectronics—renowned for quality and innovation. This energy-efficient powerhouse, ideal for automotive and IoT applications, offers seamless connectivity and advanced features like built-in ADC and DAC channels. Experience exceptional performance in a compact design, enabling smarter solutions while reducing power consumption. Trust in STMicroelectronics to deliver reliability and excellence, empowering your creativity and boosting your competitive edge!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability, light weight, and cost-effectiveness, making it suitable for a wide range of applications.

Integrated Cache: YES

An integrated cache helps to improve processing speed by reducing access times for frequently used data.

Surface Mount: YES

Surface mount technology allows for compact design and higher circuit density, making it ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for versatility in power supply options, making it suitable for various low-power applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width provides efficient data handling and communication, optimizing memory usage in embedded systems.

Package Shape: SQUARE

A square package shape facilitates efficient layout in PCB design and improves thermal management.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle larger data types and perform more complex computations, enhancing performance.

DAC Channels: YES

Having digital-to-analog converters allows for versatile signal processing capabilities, crucial in applications such as audio and control systems.

No. of Terminals: 48

With 48 terminals, this microcontroller supports numerous I/O options and peripheral interfaces essential for complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style aids in saving space on PCBs while allowing for easy soldering and component placement.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage increases energy efficiency, enabling battery-operated and energy-conscious applications.

Maximum Operating Temperature: 125 °C

The ability to operate in high-temperature environments makes it suitable for automotive and industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 family provides a balance of performance and power efficiency, ideal for various embedded applications.

No. of External Interrupts: 16

Multiple external interrupts allow for responsive and real-time applications, increasing versatility in embedded systems.

Minimum Operating Temperature: -40 °C

Its wide temperature range underscores reliability in extreme conditions, making it perfect for automotive and industrial uses.

ADC Channels: YES

Having analog-to-digital converters is essential for interfacing with sensors, enhancing its usability in data acquisition systems.

DMA Channels: YES

Direct Memory Access (DMA) improves data transfer efficiency, reducing CPU load and optimizing performance in data-heavy applications.

Terminal Position: QUAD

A quad terminal position offers enhanced connectivity options in compact designs, crucial for space-constrained applications.

ROM Words: 262144

A substantial ROM capacity enables complex applications with extensive code requirements, providing flexibility for developers.

Maximum Seated Height: 1.6 mm

The low profile aids in compact circuit design, making it ideal for space-sensitive applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Offers high-resolution DAC output, perfect for applications needing precise analog signal generation.

RAM Words: 65536

Ample RAM ensures smooth execution of applications, supporting multitasking and complex data handling.

Width: 7 mm

A compact width allows for flexible integration into small form-factor devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging, enhancing manufacturability and reliability.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, PWM, RTC, TIMER(9), WDT(2)

A rich array of peripherals supports diverse applications, adding significant functionality without requiring additional components.

Maximum Clock Frequency: 48 MHz

A high clock frequency enhances processing capability, allowing for more demanding applications.

Length: 7 mm

Short length contributes to compact design, making it ideal for portable devices.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive specifications, ensuring high reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and minimal power consumption, essential for embedded applications.

No. of Timers: 11

Multiple timers enhance control capabilities in embedded systems, making it suitable for real-time applications.

RAM Bytes: 65536

Sufficient RAM enables robust applications with complex algorithms and data processing requirements.

Technology: CMOS

CMOS technology enhances power efficiency and speed while providing high noise immunity.

Terminal Form: GULL WING

Gull wing terminals offer enhanced soldering reliability and ease of assembly, improving manufacturability.

Analog To Digital Convertors: 10-Ch 12-Bit

Ten 12-bit ADC channels provide high precision, making it ideal for applications requiring accurate sensor data processing.

Nominal Supply Voltage: 3 V

A nominal voltage of 3 V aligns well with common power supply standards, enhancing compatibility in various applications.

No. of DMA Channels: 14

A high number of DMA channels facilitates efficient data handling, minimizing CPU intervention and enhancing overall performance.

PWM Channels: YES

PWM channels provide control over motor speeds and brightness levels, essential for mechatronic and lighting applications.

Connectivity: CAN, I2C(3), LPUART, QSPI, SAI, SPI(3), SWPMI, USART(3), USB

Diverse connectivity options support various communication standards, facilitating integration into complex systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and customization of firmware, enhancing flexibility for developers.

Terminal Pitch: 0.5 mm

A fine pitch enables high-density layouts, ideal for compact applications that require numerous connections.

Format: FLOATING POINT

Supporting floating-point operations enhances computational capability, making it suitable for complex mathematical algorithms.

Speed: 80 rpm

This operational speed indicates effective processing capabilities in real-time applications where speed is crucial.

Low Power Mode: YES

Low power modes extend battery life in portable and battery-operated devices, crucial for energy efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows efficient storage and execution of instructions, optimizing performance.

No. of I/O Lines: 38

With 38 I/O lines available, it supports various peripherals and interfacing options, catering to complex applications.

Technical Specifications

Microcontrollers STM32L433CCT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, QSPI, SAI, SPI(3), SWPMI, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, PWM, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L433CCT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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