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STM32L431RBI6TR

STMicroelectronics

STM32L431RBI6TR by STMicroelectronics

STM32L431RBI6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With 64 terminals, it includes dual DACs and 16 ADC channels for versatile applications. Ideal for low-power IoT devices, it offers extensive connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,880 parts In-Stock

1+ parts

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100+ parts

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2,880

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Anansix

USA . 2,749 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,749

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Digiode

USA . 315 parts In-Stock

1+ parts

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315

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,000 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

$3.050

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AZTECH Wire

Italy . 350 parts In-Stock

1+ parts

$21.420

100+ parts

-

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10k+ parts

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350

$21.420

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IDEA Electronic Components Group

UK . 347 parts In-Stock

1+ parts

$38.717

100+ parts

-

1k+ parts

$34.846

10k+ parts

-

347

$38.717

-

$34.846

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MKK Technologies

India . 2,229 parts In-Stock

1+ parts

$72.805

100+ parts

-

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2,229

$72.805

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DigiPath Technology Company

USA . 2,229 parts In-Stock

1+ parts

$72.805

100+ parts

-

1k+ parts

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10k+ parts

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2,229

$72.805

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Corphita

USA . 3,272 parts In-Stock

1+ parts

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3,272

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Parana Technologies

USA . 746 parts In-Stock

1+ parts

-

100+ parts

$46.292

1k+ parts

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746

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$46.292

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Overview

Elevate your projects with the STM32L431RBI6TR microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. This compact powerhouse offers incredible versatility for a wide array of applications, from IoT devices to industrial automation. Enjoy low-power consumption without sacrificing performance, enabling longer battery life and enhanced efficiency. Trust in ST's legacy of innovation to unlock new possibilities in your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material provides reliable performance in various environments, ensuring longevity.

Surface Mount: YES

Surface mount capability allows for compact designs, making it perfect for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with a range of power sources.

Package Shape: SQUARE

The square package shape provides uniformity in layout, simplifying PCB design and manufacturing.

Bit Size: 32

The 32-bit architecture enables processing of complex calculations and supports advanced applications.

DAC Channels: YES

Presence of DAC channels allows for high-quality analog signal output, beneficial for audio and control applications.

No. of Terminals: 64

The 64 terminals allow for extensive peripheral connectivity, enhancing the versatility of the microcontroller.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch design minimize footprint while accommodating multiple connections.

Minimum Supply Voltage: 1.71 V

This low minimum supply voltage enables operation in battery-powered and energy-efficient designs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this microcontroller suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 architecture brings advanced performance and efficiency, suitable for real-time applications.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this microcontroller is capable of functioning in harsh environments.

ADC Channels: YES

Inclusion of ADC channels enables high-resolution data acquisition for sensor applications.

DMA Channels: YES

DMA capability allows for efficient data transfers without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier heat dissipation and soldering on PCBs.

ROM Words: 131072

The ample ROM facilitates storage of substantial firmware and application data, enhancing functionality.

Maximum Seated Height: 0.6 mm

Low seated height contributes to space-saving designs, especially in compact devices.

Digital To Analog Convertors: 2-Ch 12-Bit

The dual-channel DAC with 12-bit resolution provides flexible analog output options for varying applications.

Width: 5 mm

Compact width allows integration into space-constrained systems, optimizing board layout.

Peripherals: COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Rich set of peripherals enhances functionality and makes this microcontroller suitable for diverse applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures responsive and efficient processing for various tasks.

Length: 5 mm

Short length complements the compact design requirements, making it suitable for small-scale applications.

Temperature Grade: INDUSTRIAL

Industrial-grade rating ensures reliability and performance in challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances execution speed and efficiency, ideal for performance-critical applications.

No. of Timers: 9

With 9 timers, the microcontroller is equipped for complex time-based operations and scheduling.

RAM Bytes: 65536

Generous RAM capacity supports larger data operations and complex applications, facilitating multitasking.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed performance.

Terminal Form: BALL

Ball terminal form provides reliable connection and better thermal performance on PCBs.

Analog To Digital Convertors: 16-Ch 12-Bit

The inclusion of a 16-channel 12-bit ADC enables extensive input from various sensors, ensuring versatility.

Nominal Supply Voltage: 1.8 V

This voltage level is ideal for low-power applications, extending battery life in portable devices.

No. of DMA Channels: 14

With 14 DMA channels, this microcontroller supports high data throughput and efficient memory management.

PWM Channels: YES

PWM capability is essential for motor control and signal modulation in various applications.

Connectivity: CAN, IRDA, IRTIM, I2C(3), LIN, UART, SAI, SDMMC, SMBUS, SPI(3), USART(3)

Extensive connectivity options facilitate integration with diverse systems and peripherals.

ROM Programmability: FLASH

FLASH ROM enables easy program updates and flexibility during product lifecycle management.

Terminal Pitch: 0.5 mm

A 0.5 mm pitch allows for a dense layout, maximizing terminal count in limited PCB space.

Speed: 80 rpm

A speed rating of 80 rpm indicates its capability for precise and controlled operations in real-time systems.

On Chip Program ROM Width: 8

An 8-bit width for onboard ROM optimizes programming efficiency and access to stored data.

No. of I/O Lines: 52

With 52 I/O lines, this microcontroller can handle multiple input and output tasks simultaneously.

Technical Specifications

Microcontrollers STM32L431RBI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of DMA Channels:

14

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

9

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, IRDA, IRTIM, I2C(3), LIN, UART, SAI, SDMMC, SMBUS, SPI(3), USART(3)

Peripherals:

COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L431RBI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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