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STM32L431CCU7TR

STMicroelectronics

STM32L431CCU7TR by STMicroelectronics

STM32L431CCU7TR from STMicroelectronics is a versatile 32-bit microcontroller ideal for industrial applications. It features a max supply voltage of 3.6V, operates in extreme temps (-40 °C to 105 °C), and includes dual DACs and multiple connectivity options. Perfect for low-power IoT devices, it combines performance with efficiency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,904 parts In-Stock

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3,904

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Digiode

USA . 2,235 parts In-Stock

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2,235

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Anansix

USA . 1,840 parts In-Stock

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1,840

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Distributors (Availability)

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AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$11.680

100+ parts

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1,023

$11.680

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IDEA Electronic Components Group

UK . 25 parts In-Stock

1+ parts

$29.447

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$26.503

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25

$29.447

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$26.503

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MKK Technologies

India . 123 parts In-Stock

1+ parts

$55.374

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123

$55.374

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DigiPath Technology Company

USA . 123 parts In-Stock

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$55.374

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123

$55.374

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Corphita

USA . 4,552 parts In-Stock

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4,552

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Parana Technologies

USA . 613 parts In-Stock

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$35.209

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613

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$35.209

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Overview

Elevate your projects with the STM32L431CCU7TR microcontroller from STMicroelectronics! Renowned for their precision and innovation, STMicroelectronics empowers developers with this ultra-efficient 32-bit MCU, perfect for low-power applications. With an industrial-grade design, versatile connectivity options, and built-in DAC/ADC channels, it ensures seamless performance and reliability in diverse environments. Unlock endless possibilities for IoT, automation, and smart devices today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability makes it suitable for compact PCB designs, saving space and improving overall layout efficiency.

Maximum Supply Voltage: 3.6 V

This voltage range allows for flexibility in power supply choices, accommodating various application needs.

Package Shape: SQUARE

The square package shape facilitates easier placement on PCBs and is generally more efficient in thermal dissipation.

Bit Size: 32

With a 32-bit architecture, it offers enhanced processing power and performance for complex applications.

DAC Channels: YES

The presence of DAC channels means it can perform analog output tasks, making it suitable for signal generation applications.

No. of Terminals: 48

Having 48 terminals provides numerous interfacing options, allowing for greater connectivity and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink feature enhance thermal management and make it easier to integrate into densely packed designs.

Minimum Supply Voltage: 1.71 V

The lower minimum supply voltage expands its usability in battery-operated devices, improving energy efficiency.

Maximum Operating Temperature: 105 °C

This high temperature rating ensures reliability in demanding industrial environments.

CPU Family: CORTEX-M4

Utilizing the Cortex-M4 architecture provides superior performance, low power consumption, and advanced real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The wide temperature range makes it ideal for harsh environments, ensuring consistent performance across varying conditions.

ADC Channels: YES

The inclusion of ADC channels enables it to measure analog signals, making it versatile for a wide range of applications.

DMA Channels: YES

DMA capability allows for efficient data transfer without CPU intervention, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for easier soldering and better performance in high-density applications.

ROM Words: 262144

With a substantial amount of ROM, it can store complex programs and execute them efficiently.

Maximum Seated Height: 0.65 mm

This low seated height aids in reducing overall device thickness, enabling ultra-thin product designs.

Digital To Analog Converters: 2-Ch 12-Bit

Having multiple high-resolution DACs allows for precise analog output for various applications, improving signal fidelity.

Width: 7 mm

The compact width makes it easy to incorporate into various designs without compromising space.

Peripherals: COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

A rich set of peripherals enhances functionality and versatility, enabling integration into complex systems with ease.

Maximum Clock Frequency: 48 MHz

This clock frequency allows for efficient processing of data, enabling real-time response in applications.

Length: 7 mm

The small length contributes to compact designs, allowing for miniaturization of electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance under extreme environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides high performance per watt, making it suitable for low-power embedded applications.

No. of Timers: 9

Multiple timers allow for precise time control in applications like motor control, enabling better performance.

RAM Bytes: 65536

A substantial amount of RAM supports complex data handling and multi-tasking capabilities.

Technology: CMOS

The CMOS technology offers low power consumption, enhancing the energy efficiency of embedded systems.

Terminal Form: NO LEAD

No lead terminals reduce the risk of corrosion and improve the reliability of the device over time.

Analog To Digital Converters: 10-Ch 12-Bit

Having multiple ADC channels ensures the capability to monitor a variety of analog inputs simultaneously.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage aligns with modern low-power applications, ensuring efficiency and longer battery life.

No. of DMA Channels: 14

More DMA channels enhance data processing efficiency, minimizing CPU load during data transfers.

PWM Channels: YES

PWM capability makes it suitable for applications that require motor control, light dimming, and audio generation.

Connectivity: CAN, IRDA, IRTIM, I2C(3), LIN, UART, SAI, SMBUS, SPI(3), USART(3)

Extensive connectivity options make it highly versatile for communication between devices in various applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, enhancing the product’s adaptability.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density packaging, which is essential in modern electronic designs.

Speed: 80 rpm

The specified speed can be beneficial in applications that require precise timing or motor control functions.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient handling of a variety of programming tasks, enhancing performance.

No. of I/O Lines: 38

A high number of I/O lines provides ample interfacing options with external components, increasing the device’s functionality.

Technical Specifications

Microcontrollers STM32L431CCU7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of DMA Channels:

14

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

9

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, IRDA, IRTIM, I2C(3), LIN, UART, SAI, SMBUS, SPI(3), USART(3)

Peripherals:

COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L431CCU7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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