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STM32L431CBY6TR

STMicroelectronics

STM32L431CBY6TR by STMicroelectronics

STM32L431CBY6TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 65536 RAM bytes, and max clock frequency of 48 MHz. Ideal for industrial applications, it features CAN, I2C, SPI connectivity and 10-Ch 12-Bit ADC channels for precise data acquisition.

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 5,000 parts In-Stock

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$1.710

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$1.710

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Chip Stock

USA . 10,830 parts In-Stock

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Vyrian

USA . 10,752 parts In-Stock

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Cyclops Electronics Ltd

UK . 8,146 parts In-Stock

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IBS Electronics

USA . 5,000 parts In-Stock

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$2.595

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$2.595

Anansix

USA . 1,915 parts In-Stock

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Digiode

USA . 972 parts In-Stock

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972

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,956 parts In-Stock

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$1.430

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$1.430

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Semicontronic

India . 4,771 parts In-Stock

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$1.430

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$1.394

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$1.387

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$1.430

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$1.387

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Vigor

Singapore . 2,094 parts In-Stock

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$2.720

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AZTECH Wire

Italy . 983 parts In-Stock

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$20.440

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983

$20.440

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Corohmni

South Africa . 331 parts In-Stock

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$27.084

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331

$27.084

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Aztec Data Supply Inc.

USA . 1,578 parts In-Stock

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$32.520

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IDEA Electronic Components Group

UK . 18 parts In-Stock

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$47.141

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$42.427

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$47.141

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MKK Technologies

India . 47 parts In-Stock

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$88.645

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DigiPath Technology Company

USA . 47 parts In-Stock

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Perfect Parts

USA . 78,400 parts In-Stock

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RC Electronics

USA . 8,280 parts In-Stock

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Argo Parts USA

USA . 4,179 parts In-Stock

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Parana Technologies

USA . 2,156 parts In-Stock

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$56.364

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Corphita

USA . 2,151 parts In-Stock

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Continental Prestige Electronics

USA . 996 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the STM32L431CBY6TR by STMicroelectronics, a top-quality microcontroller designed to bring unparalleled performance to a wide range of applications. With its cutting-edge technology and innovative features, this product offers customers exceptional value and benefits. From industrial automation to consumer electronics, this microcontroller delivers reliability, efficiency, and versatility. Trust STMicroelectronics for superior products that push the boundaries of what's possible in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in powering the microcontroller in various applications.

Package Shape: SQUARE

Square package shape simplifies PCB layout and makes it easier to place the microcontroller in compact designs.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex computations and processes efficiently.

DAC Channels: YES

DAC channels allow the microcontroller to generate analog voltage outputs, expanding its range of applications.

No. of Terminals: 49

Having a higher number of terminals provides more connectivity options and interfaces for peripheral devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch enhances the overall packaging density and thermal performance of the microcontroller.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage allows for operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Operating at a high temperature range ensures reliability in industrial settings where temperature fluctuations are common.

CPU Family: CORTEX-M4

Cortex-M4 architecture provides high performance and efficiency for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

Operating at a low temperature range makes this microcontroller suitable for harsh environments with extreme cold conditions.

ADC Channels: YES

ADC channels allow the microcontroller to convert analog signals into digital data, enabling precise measurements and sensor integration.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB routing and assembly, making the microcontroller easier to integrate into the design.

ROM Words: 131072

Large ROM capacity allows for storing program code and data, enabling the microcontroller to run complex algorithms and applications.

Maximum Seated Height: 0.585 mm

Low seated height makes the microcontroller suitable for slim designs and compact electronic devices.

Digital To Analog Convertors: 2-Ch 12-Bit

Having 2 channels with 12-bit resolution provides high accuracy in generating analog output signals for precision control applications.

Width: 3.127 mm

Compact width dimension allows for space-efficient PCB layout and integration of the microcontroller in small form factor devices.

Peripherals: COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

A rich set of peripherals enables versatile functionality and connectivity options for diverse application requirements.

Maximum Clock Frequency: 48 MHz

High clock frequency supports fast data processing and multitasking capabilities in real-time embedded systems.

Length: 3.141 mm

Optimal length dimension enhances the overall compactness of the microcontroller, allowing for efficient space utilization in designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers high performance and low power consumption, suitable for embedded control applications.

No. of Timers: 9

Multiple timers provide timing and scheduling functions essential for controlling various processes and peripherals in real-time applications.

RAM Bytes: 65536

Large RAM capacity enables efficient data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high-speed operation, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form simplifies soldering and provides secure electrical connections for stable operation in electronic systems.

Analog To Digital Convertors: 10-Ch 12-Bit

Having 10 channels with 12-bit resolution enables precise digital conversion of analog signals for accurate sensor interfacing and measurements.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and reliability of the microcontroller under varying operating conditions.

No. of DMA Channels: 14

A higher number of DMA channels allow for efficient data transfer and management between peripherals and memory, enhancing system performance.

PWM Channels: YES

PWM channels enable the microcontroller to generate pulse-width modulated signals for motor control, power management, and other applications.

Connectivity: CAN, IRDA, IRTIM, I2C(3), LIN, UART, SAI, SMBUS, SPI(3), USART(3)

Diverse connectivity options enhance communication and interfacing capabilities, supporting a wide range of industrial and consumer applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and fast reprogramming of the microcontroller, allowing for flexible firmware updates and customization.

Terminal Pitch: 0.4 mm

Fine terminal pitch simplifies PCB layout and assembly, enabling high-density integration of the microcontroller in compact designs.

Speed: 80 rpm

High-speed operation at 80 RPM ensures rapid data processing and real-time response in time-critical applications.

On Chip Program ROM Width: 8

Having an 8-bit on-chip program ROM width allows for efficient data storage and retrieval, enhancing the overall performance of the microcontroller.

No. of I/O Lines: 39

Abundance of I/O lines provides flexibility in interfacing with external devices, sensors, and peripherals, expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers STM32L431CBY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

Length:

3.141 mm

No. of DMA Channels:

14

No. of I/O Lines:

39

No. of Terminals:

49

No. of Timers:

9

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.127 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, IRDA, IRTIM, I2C(3), LIN, UART, SAI, SMBUS, SPI(3), USART(3)

Peripherals:

COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L431CBY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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