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STM32L412RBT6TR

STMicroelectronics

STM32L412RBT6TR by STMicroelectronics

STM32L412RBT6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With integrated ADC and DMA channels, it's ideal for low-power industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 18,999 parts In-Stock

1+ parts

-

100+ parts

$3.220

1k+ parts

$2.296

10k+ parts

$2.159

18,999

-

$3.220

$2.296

$2.159

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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RLX Solution Inc.

Canada . 20,000 parts In-Stock

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20,000

-

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Vyrian

USA . 7,629 parts In-Stock

1+ parts

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7,629

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Digiode

USA . 4,729 parts In-Stock

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-

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4,729

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Anansix

USA . 765 parts In-Stock

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765

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Distributors (Availability)

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AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$15.820

100+ parts

-

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-

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-

221

$15.820

-

-

-

Microchip USA

USA . 5,431 parts In-Stock

1+ parts

$22.114

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-

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-

5,431

$22.114

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IDEA Electronic Components Group

UK . 526 parts In-Stock

1+ parts

$56.662

100+ parts

-

1k+ parts

$50.996

10k+ parts

-

526

$56.662

-

$50.996

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MKK Technologies

India . 1,056 parts In-Stock

1+ parts

$106.549

100+ parts

-

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1,056

$106.549

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DigiPath Technology Company

USA . 1,056 parts In-Stock

1+ parts

$106.549

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1,056

$106.549

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,173 parts In-Stock

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1,173

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Parana Technologies

USA . 218 parts In-Stock

1+ parts

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100+ parts

$67.748

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218

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$67.748

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Overview

Unlock the potential of your projects with the STM32L412RBT6TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility in low-power applications, this high-performance MCU excels in industrial, medical, and IoT devices. With exceptional reliability and advanced features, it simplifies complex designs, enhances efficiency, and ensures longevity in challenging environments. Elevate your next design with the trusted quality and performance that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body protects the microcontroller from environmental factors, ensuring reliability.

Integrated Cache: YES

Having an integrated cache enhances the performance by increasing data access speed for applications.

Surface Mount: YES

Surface mount technology allows for compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Operating at a maximum of 3.6 V ensures compatibility with a wide range of power supply systems.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data handling and processing capabilities.

Package Shape: SQUARE

A square package shape simplifies PCB layout and provides uniform thermal characteristics.

Bit Size: 32

The 32-bit architecture supports complex calculations and enhances processing capabilities.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design aids in efficient use of space on printed circuit boards.

Minimum Supply Voltage: 1.71 V

A wide supply voltage range allows for flexibility in powering the microcontroller in different applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes it suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 core provides advanced performance features including signal processing capabilities.

No. of External Interrupts: 16

With 16 external interrupts, the microcontroller can handle various asynchronous events effectively.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature preserves functionality in harsh environments.

ADC Channels: YES

Integrated ADC channels allow for direct analog data processing, enhancing versatility.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU load.

Terminal Position: QUAD

Quad terminal configuration supports better routing and connectivity options on PCBs.

ROM Words: 131072

A substantial ROM capacity allows for larger code storage and complex application development.

Maximum Seated Height: 1.6 mm

The low profile height aids in reducing the overall height of the final build.

Width: 10 mm

A compact width enhances fit in smaller electronic designs and devices.

Boundary Scan: YES

Allows for easy testing and debugging of PCB interconnections, enhancing reliability.

Peripherals: BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

A rich set of peripherals supports various functions and applications in a single module.

Maximum Clock Frequency: 48 MHz

48 MHz clock frequency ensures efficient processing speed, accommodating demanding applications.

Length: 10 mm

The compact length is advantageous for designs with limited space.

Temperature Grade: INDUSTRIAL

Industrial grade ensures robust performance in challenging environments and extended longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables faster data processing due to simpler instruction sets.

No. of Timers: 8

With 8 timers, the microcontroller can be utilized for simultaneous task scheduling.

RAM Bytes: 40960

Sufficient RAM supports complex applications without frequent memory constraints.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals enhance surface mount reliability and simplify soldering processes.

Analog To Digital Converters: 16-Ch 12-Bit

Having 16 channels of 12-bit ADC enhances the capability to interface with multiple sensors and signals.

Maximum Supply Current: 100 mA

A maximum current of 100 mA allows for higher performance components to be connected without issues.

Nominal Supply Voltage: 3 V

The nominal voltage aligns with common standards, ensuring compatibility with many systems.

No. of DMA Channels: 14

14 DMA channels facilitate high-speed data transfers, essential for efficient real-time applications.

No. of Serial I/Os: 3

Three serial I/O lines provide multiple communication options, enhancing interconnectivity.

PWM Channels: YES

PWM support is crucial for applications like motor control and analog output generation.

Connectivity: I2C(3), LPUART, SPI(2), USART(3), USB

Versatile connectivity options ensure compatibility with various devices and communication standards.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications, empowering long-term application development.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for greater density on PCBs, suitable for modern compact designs.

Format: FIXED POINT

Fixed-point format enhances computational efficiency for applications with predictable numeric ranges.

Speed: 80 rpm

An operational capability of 80 rpm indicates potential for responsive control systems.

Low Power Mode: YES

Low power mode extends battery life in portable devices, enhancing overall efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates ease of programming and exection.

No. of I/O Lines: 52

52 I/O lines provide extensive capability for interfacing, making the microcontroller highly versatile.

Technical Specifications

Microcontrollers STM32L412RBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

40960

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

I2C(3), LPUART, SPI(2), USART(3), USB

Peripherals:

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32L412RBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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