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STM32L412R8T6TR

STMicroelectronics

STM32L412R8T6TR by STMicroelectronics

STM32L412R8T6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. With low power modes and extensive connectivity options, it's ideal for industrial applications. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,112 parts In-Stock

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8,112

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Digiode

USA . 3,829 parts In-Stock

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3,829

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Anansix

USA . 1,134 parts In-Stock

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1,134

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Distributors (Availability)

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$17.040

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564

$17.040

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IDEA Electronic Components Group

UK . 778 parts In-Stock

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$58.275

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$52.447

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778

$58.275

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$52.447

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MKK Technologies

India . 1,381 parts In-Stock

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$109.582

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1,381

$109.582

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DigiPath Technology Company

USA . 1,381 parts In-Stock

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$109.582

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1,381

$109.582

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Parana Technologies

USA . 1,577 parts In-Stock

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$69.676

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1,577

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$69.676

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Corphita

USA . 816 parts In-Stock

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Overview

Unlock the potential of your next innovation with the STM32L412R8T6TR microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, this versatile device is perfect for energy-efficient applications in IoT, wearables, and industrial automation. Enjoy seamless integration, advanced performance, and low power consumption that drives efficiency and longevity in your designs. Elevate your projects with a trusted partner committed to excellence and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material gives durability and reliability, making it suitable for various applications.

Integrated Cache: YES

Having integrated cache improves the speed of data access, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for compact design and easier assembly, which is ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage ensures compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

An 8-bit RAM width offers sufficient memory handling for various applications, maintaining efficiency.

Package Shape: SQUARE

The square shape maximizes layout options on PCBs, allowing for efficient space utilization.

Bit Size: 32

A 32-bit architecture allows for processing of larger data types, improving computational capabilities.

No. of Terminals: 64

With 64 terminals, there are ample connections available for various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style facilitates efficient thermal management and signal integrity in compact designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage supports a variety of low power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller is suitable for industrial environments.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family supports high performance and energy efficiency, essential for modern embedded systems.

No. of External Interrupts: 16

Having 16 external interrupts enhances responsiveness to events and improves multitasking capabilities.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in harsh conditions.

ADC Channels: YES

Built-in ADC channels allow for easy interfacing with analog sensors, adding versatility to the application.

DMA Channels: YES

DMA support enables efficient data transfer without CPU intervention, improving system performance.

Terminal Position: QUAD

The quad terminal position aids in effective handling and connection stability.

ROM Words: 65536

A large ROM capacity allows for complex programs and more extensive functions in applications.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for creating slim profiles in embedded systems.

Width: 10 mm

The compact width makes it easy to fit into various space-constrained designs.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of PCBs, enhancing reliability.

Peripherals: BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

A variety of integrated peripherals expands application possibilities and reduces external component needs.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency enables efficient computation and timely processing within applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures that the microcontroller can operate in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction processing, enhancing performance and efficiency.

No. of Timers: 8

Multiple timers enable various timing applications, improving functionalities in control systems.

RAM Bytes: 40960

With significant RAM, this microcontroller can handle complex data and multitasking applications effectively.

Technology: CMOS

CMOS technology provides low power consumption and high density, vital for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering in manufacturing.

Analog To Digital Convertors: 16-Ch 12-Bit

High-resolution ADCs enable precise analog measurements, essential for accurate data acquisition.

Maximum Supply Current: 100 mA

The current rating offers flexibility in power supply design while ensuring reliable operation.

Nominal Supply Voltage: 3 V

The nominal supply voltage simplifies power design and enhances compatibility with common sources.

No. of DMA Channels: 14

14 DMA channels allow for high-efficiency data processing, minimizing CPU load.

No. of Serial I/Os: 3

Multiple serial I/O options provide flexibility in communication interfaces for diverse applications.

PWM Channels: YES

PWM channel support enables control over motor speed and brightness in various applications.

Connectivity: I2C(3), LPUART, SPI(2), USART(3), USB

Versatile connectivity options enable easy integration with a wide range of devices and protocols.

ROM Programmability: FLASH

FLASH programmability allows easy updates and modifications to the code post-deployment.

Terminal Pitch: 0.5 mm

A small terminal pitch supports high-density designs, packing more functionality into smaller spaces.

Format: FIXED POINT

Fixed point format is ideal for many real-time applications, improving performance for specific tasks.

Speed: 80 rpm

The speed rating indicates suitability for applications requiring moderate performance without excessive power consumption.

Low Power Mode: YES

Low power mode extends battery life in portable applications, significantly improving energy efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width offers compatibility with a range of applications while ensuring simplicity.

No. of I/O Lines: 52

Having 52 I/O lines provides extensive options for peripheral connections, enhancing versatility.

Technical Specifications

Microcontrollers STM32L412R8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

40960

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

I2C(3), LPUART, SPI(2), USART(3), USB

Peripherals:

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32L412R8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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