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STM32L412KBT3TR

STMicroelectronics

STM32L412KBT3TR by STMicroelectronics

STM32L412KBT3TR by STMicroelectronics is a 32-bit microcontroller with integrated cache and low power mode. It has 10-ch 12-bit ADC channels and offers connectivity options like I2C, SPI, USART, and USB. This microcontroller is commonly used in automotive applications due to its temperature grade and small package size.

Median Price

-

Lifecycle Status

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4

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1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,753 parts In-Stock

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6,753

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Digiode

USA . 4,841 parts In-Stock

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4,841

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Nova Conductors

Japan . 400 parts In-Stock

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400

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Anansix

USA . 170 parts In-Stock

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170

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AZTECH Wire

Italy . 730 parts In-Stock

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$5.487

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730

$5.487

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Ampacity Inc.

Singapore . 201 parts In-Stock

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$20.000

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201

$20.000

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Microchip USA

USA . 5,433 parts In-Stock

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$21.432

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$21.432

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IDEA Electronic Components Group

UK . 972 parts In-Stock

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$45.405

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$40.864

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972

$45.405

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$40.864

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Aztec Data Supply Inc.

USA . 3,131 parts In-Stock

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$45.733

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$45.733

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Corohmni

South Africa . 446 parts In-Stock

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$56.670

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446

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MKK Technologies

India . 307 parts In-Stock

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$85.381

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307

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DigiPath Technology Company

USA . 307 parts In-Stock

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$85.381

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Argo Parts USA

USA . 4,353 parts In-Stock

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Continental Prestige Electronics

USA . 3,733 parts In-Stock

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3,733

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Parana Technologies

USA . 1,293 parts In-Stock

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$54.288

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$54.288

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Corphita

USA . 1,282 parts In-Stock

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1,282

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the STM32L412KBT3TR by STMicroelectronics, a high-quality microcontroller that offers numerous advantages. As a leading manufacturer in the industry, STMicroelectronics is known for its exceptional reliability and innovation. This microcontroller is perfect for a wide range of applications, including automotive, industrial, and consumer electronics. With its integrated cache, low power mode, and maximum clock frequency of 48 MHz, this product delivers unparalleled performance and efficiency. Additionally, its small package size and surface mount capability make it easy to integrate into any project. Experience the value, benefits, and advantages that the STM32L412KBT3TR brings to your designs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material for the package body makes this microcontroller lightweight and durable, ideal for various applications.

Integrated Cache

YES - The integrated cache improves the overall performance of the microcontroller by reducing the average memory access time, making it a reliable and efficient choice.

Surface Mount

YES - The surface mount feature allows for easy and convenient installation, making this microcontroller suitable for compact designs and space-constrained environments.

Maximum Supply Voltage

3.6 V - With a high maximum supply voltage, this microcontroller can operate reliably even in voltage fluctuation scenarios, providing stability in different power supply conditions.

On Chip Data RAM Width

8 - The wide on-chip data RAM width enables the microcontroller to handle and process larger amounts of data efficiently, making it suitable for memory-intensive applications.

Package Shape

SQUARE - The square package shape ensures easy mounting and alignment during assembly, enhancing the ease of integration into various electronic systems.

Bit Size

32 - The 32-bit architecture of this microcontroller offers enhanced processing capabilities, enabling complex calculations and computations, making it a powerful choice for demanding applications.

No. of Terminals

32 - The availability of a sufficient number of terminals allows for easy connectivity with external components, making it versatile for diverse circuit designs.

Package Style (Meter)

FLATPACK, LOW PROFILE - The flatpack, low profile package style offers a compact form factor, making it suitable for applications where space optimization is crucial.

Minimum Supply Voltage

1.71 V - The low minimum supply voltage ensures energy efficiency and extends battery life, making this microcontroller suitable for portable and low-power devices.

Maximum Operating Temperature

125 °C - With a high maximum operating temperature, this microcontroller can withstand demanding environmental conditions, ensuring reliable performance in extreme temperature situations.

CPU Family

CORTEX-M4 - The Cortex-M4 CPU family provides a powerful and efficient processing platform, enabling this microcontroller to handle complex tasks with ease, making it a reliable choice for various applications.

No. of External Interrupts

16 - The availability of 16 external interrupts allows for efficient handling of real-time events, making this microcontroller suitable for applications requiring precise event-driven operations.

Minimum Operating Temperature

40 °C - With a low minimum operating temperature, this microcontroller can function reliably even in extremely cold environments, making it suitable for industrial and automotive applications.

ADC Channels

YES - The built-in analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its versatility for applications requiring analog measurements.

DMA Channels

YES - The presence of Direct Memory Access (DMA) channels enables efficient data transfer between peripherals and memory, enhancing overall system performance for high-speed data processing.

Terminal Position

QUAD - The quad terminal position facilitates easy soldering and connection, simplifying the assembly process and making this microcontroller ideal for mass production applications.

ROM Words

131072 - The large ROM capacity allows for extensive code storage, accommodating complex applications and enabling software development flexibility.

Maximum Seated Height

1.6 mm - With a low seated height, this microcontroller can be easily integrated into space-constrained designs, perfect for applications with limited vertical clearance.

Width

7 mm - The compact width of the microcontroller enables space-efficient integration into various electronic systems, making it suitable for small form factor designs.

Boundary Scan

YES - The presence of boundary scan capability facilitates the testing and debugging of connected devices, ensuring easier development and maintenance processes.

Peripherals

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2) - The inclusion of various peripherals such as Brown-Out Reset (BOR), Comparator, DMA channels, Power-On Reset (POR), Timer, and Watchdog Timer (WDT) enhances the microcontroller's functionality and versatility for a wide range of applications.

Maximum Clock Frequency

48 MHz - With a high maximum clock frequency, this microcontroller can perform tasks quickly, making it suitable for time-critical and high-speed applications.

Length

7 mm - The compact length of the microcontroller allows for space-efficient integration, making it suitable for small and portable electronic devices.

Temperature Grade

AUTOMOTIVE - This microcontroller's automotive temperature grade ensures reliable operation in automotive environments, making it an excellent choice for automotive applications.

Peripheral IC Type

MICROCONTROLLER, RISC - The microcontroller's RISC (Reduced Instruction Set Computer) architecture offers efficient instruction execution, making it suitable for applications requiring fast and precise operations.

No. of Timers

8 - The availability of multiple timers allows for precise timing control, making this microcontroller well-suited for applications involving synchronization and time-dependent operations.

RAM Bytes

40960 - The substantial RAM capacity enables efficient data storage and manipulation, making this microcontroller suitable for memory-intensive applications.

Technology

CMOS - The use of CMOS technology ensures low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in various operating conditions.

Terminal Form

GULL WING - The gull wing terminal form provides enhanced mechanical strength and improved solderability, offering increased durability and reliability in harsh operating environments.

Analog To Digital Convertors

10-Ch 12-Bit - The ten-channel 12-bit analog-to-digital convertors provide accurate and precise analog signal conversion, expanding the microcontroller's capability for sensor interfacing and measurement applications.

Maximum Supply Current

100 mA - With a high maximum supply current, this microcontroller can deliver sufficient power to connected components, making it suitable for systems requiring high-current operation.

Nominal Supply Voltage

3 V - The nominal supply voltage ensures compatibility with standard power supply sources, making this microcontroller easy to integrate into existing electronic systems.

No. of DMA Channels

14 - The availability of 14 DMA channels enables efficient data transfer and offloads the CPU, enhancing overall system performance for high-bandwidth applications.

No. of Serial I/Os

3 - The presence of three serial input/output interfaces allows for versatile communication with external devices, enabling this microcontroller to interface with a wide range of peripherals.

PWM Channels

YES - The availability of PWM (Pulse-Width Modulation) channels allows for precise control of voltage or current levels, making this microcontroller suitable for applications requiring precise analog outputs.

Connectivity

I2C(2), LPUART, SPI, USART(2), USB - With multiple connectivity options including I2C, LPUART, SPI, USART, and USB, this microcontroller offers versatile communication capabilities, enabling seamless integration with various external devices and networks.

ROM Programmability

FLASH - The use of FLASH ROM programmability provides easy and flexible firmware updates, allowing for efficient maintenance and future-proofing of the microcontroller-based systems.

Terminal Pitch

0.8 mm - The small terminal pitch allows for precise and secure soldering connections, making this microcontroller suitable for high-density circuit boards.

Format

FIXED POINT - The fixed-point format ensures accurate numeric calculations and precise control, making this microcontroller suitable for applications involving mathematics and control algorithms.

Speed

80 rpm - With a speed of 80 revolutions per minute, this microcontroller is well-suited for applications requiring precise and controlled rotational movements.

Low Power Mode

YES - The availability of low power modes enables energy-efficient operation, extending battery life and making this microcontroller suitable for power-constrained applications.

On Chip Program ROM Width

8 - The wide on-chip program ROM width allows for large program storage, accommodating complex software and enabling versatile application development.

No. of I/O Lines

26 - The availability of 26 input/output lines provides ample connectivity options for external components, making this microcontroller versatile for various interfacing requirements.

Technical Specifications

Microcontrollers STM32L412KBT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

40960

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(2), LPUART, SPI, USART(2), USB

Peripherals:

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L412KBT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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