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STM32L412K8U6TR

STMicroelectronics

STM32L412K8U6TR by STMicroelectronics

STM32L412K8U6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 48 MHz clock frequency, and 10-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features 40960 bytes of RAM, 65536 ROM words, and connectivity options like I2C, SPI, and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,681 parts In-Stock

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4,681

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Anansix

USA . 933 parts In-Stock

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933

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Digiode

USA . 764 parts In-Stock

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764

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$14.781

100+ parts

-

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677

$14.781

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Microchip USA

USA . 6,117 parts In-Stock

1+ parts

$15.469

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-

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6,117

$15.469

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Corohmni

South Africa . 374 parts In-Stock

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$23.948

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374

$23.948

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$29.893

100+ parts

-

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$26.903

10k+ parts

-

1,356

$29.893

-

$26.903

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Ampacity Inc.

Singapore . 1,423 parts In-Stock

1+ parts

$34.000

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-

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1,423

$34.000

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Aztec Data Supply Inc.

USA . 4,050 parts In-Stock

1+ parts

$44.315

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4,050

$44.315

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MKK Technologies

India . 1,321 parts In-Stock

1+ parts

$56.211

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1,321

$56.211

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DigiPath Technology Company

USA . 1,321 parts In-Stock

1+ parts

$56.211

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1,321

$56.211

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Argo Parts USA

USA . 3,710 parts In-Stock

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3,710

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Continental Prestige Electronics

USA . 2,227 parts In-Stock

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Corphita

USA . 1,963 parts In-Stock

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1,963

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Parana Technologies

USA . 240 parts In-Stock

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$35.741

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240

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$35.741

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the STM32L412K8U6TR microcontroller by STMicroelectronics. Designed with cutting-edge technology, this device offers unmatched performance and reliability for a wide range of applications. From industrial automation to smart devices, this microcontroller delivers exceptional value and efficiency, ensuring seamless operation and optimal functionality. Trust STMicroelectronics, a leading manufacturer in the industry, to provide you with top-quality products that exceed expectations. Elevate your projects with the STM32L412K8U6TR and experience the difference today.

Feature Benefit Bullets

Integrated Cache - YES

Having an integrated cache helps improve the overall performance of the microcontroller by storing frequently accessed data for quick retrieval, leading to faster execution times.

Surface Mount - YES

Surface mount technology enables easy and efficient PCB assembly, making the product suitable for compact and space-constrained applications.

Maximum Supply Voltage - 3.6 V

The high maximum supply voltage allows for flexibility in power supply design and compatibility with a wide range of voltage sources.

On Chip Data RAM Width - 8

With a data RAM width of 8, the microcontroller can efficiently process and manipulate data in 8-bit chunks, optimizing memory usage and performance.

Package Shape - SQUARE

The square package shape offers consistent and uniform dimensions, facilitating easy integration into PCB layouts and ensuring mechanical stability.

Bit Size - 32

The 32-bit architecture of the microcontroller allows for high-speed processing of data and instructions, making it suitable for demanding applications that require fast execution.

No. of Terminals - 32

With 32 terminals, the microcontroller offers a sufficient number of I/O options for connecting external devices and peripherals, enhancing its versatility and functionality.

Technical Specifications

Microcontrollers STM32L412K8U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

40960

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Connectivity:

I2C(2), LPUART, SPI, USART(2), USB

Peripherals:

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L412K8U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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