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STM32L162VET6TR

STMicroelectronics

STM32L162VET6TR by STMicroelectronics

STM32L162VET6TR by STMicroelectronics is a 32-bit microcontroller with 524288 ROM words and 81920 RAM bytes. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring high-speed processing and low power consumption. With features like ADC and DMA channels, it offers versatile functionality in compact dimensions (14mm x 14mm).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,248 parts In-Stock

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3,248

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Digiode

USA . 2,074 parts In-Stock

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2,074

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Anansix

USA . 221 parts In-Stock

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221

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Distributors (Availability)

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AZTECH Wire

Italy . 1,022 parts In-Stock

1+ parts

$12.430

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-

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1,022

$12.430

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Microchip USA

USA . 3,797 parts In-Stock

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$20.560

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3,797

$20.560

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IDEA Electronic Components Group

UK . 1,726 parts In-Stock

1+ parts

$68.357

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$61.521

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1,726

$68.357

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$61.521

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Component Stockers USA

USA . 1,163 parts In-Stock

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$100.570

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1,163

$100.570

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MKK Technologies

India . 365 parts In-Stock

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$128.541

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365

$128.541

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DigiPath Technology Company

USA . 365 parts In-Stock

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$128.541

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365

$128.541

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 2,775 parts In-Stock

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2,775

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Parana Technologies

USA . 660 parts In-Stock

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$81.731

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660

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$81.731

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Overview

Revolutionize your electronic designs with the STM32L162VET6TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality microcontrollers like this one, perfect for a wide range of applications. With its advanced features and high-performance capabilities, this microcontroller offers unmatched value to customers looking to create cutting-edge products. Experience the benefits and advantages of using the STM32L162VET6TR in your next project and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and long-lasting.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources while providing sufficient power for operation.

Bit Size: 32

Provides high computational power and efficiency for handling complex tasks.

Power Supplies (V): 2/3.3

Offers flexibility in power input options, ensuring compatibility with different power sources.

No. of Terminals: 100

Provides ample connection points for integrating with other components in a circuit.

Package Style (Meter): FLATPACK

Compact design saves space on the circuit board and allows for efficient layout.

Minimum Supply Voltage: 1.8 V

Allows for operation at lower power levels, reducing energy consumption and heat generation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

CPU Family: CORTEX-M3

A high-performance and energy-efficient processor that enhances overall system performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments, making it versatile for various applications.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interact with analog sensors.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing.

Terminal Position: QUAD

Optimal terminal arrangement for easier connection and soldering on the circuit board.

ROM Words: 524288

Ample storage capacity for program memory, enabling complex algorithms and applications to be executed.

Width: 14 mm

Compact size allows for easy integration into small-scale electronic devices.

Maximum Clock Frequency: 32 MHz

High clock speed for rapid data processing and responsiveness.

Length: 14 mm

Symmetrical dimensions for a balanced and efficient layout on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for efficient and streamlined operation.

RAM Bytes: 81920

Sufficient random-access memory for processing data and running multiple applications simultaneously.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high performance.

Terminal Form: GULL WING

Gull-wing terminals for easy soldering and secure connections on the circuit board.

Maximum Supply Current: 12.3 mA

Efficient power usage with low supply current requirements for reduced energy costs.

Nominal Supply Voltage: 3 V

Stable and standard voltage supply for consistent performance and reliability.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of connected devices.

ROM Programmability: FLASH

Flash memory for reprogrammable and flexible storage of program code and data.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density connections and space-saving design.

Speed: 32 rpm

High processing speed of 32 RPM for efficient data processing and real-time responsiveness.

No. of I/O Lines: 83

Ample input/output lines for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers STM32L162VET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32L162VET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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