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STM32L162VDT6TR

STMicroelectronics

STM32L162VDT6TR by STMicroelectronics

STM32L162VDT6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 26-bit address bus, and 16-bit external data bus. It operates at up to 24 MHz clock frequency, has 83 I/O lines, and offers ADC and DMA channels. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,442 parts In-Stock

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7,442

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Anansix

USA . 1,989 parts In-Stock

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1,989

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Digiode

USA . 1,324 parts In-Stock

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1,324

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Distributors (Availability)

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AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$15.990

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224

$15.990

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Microchip USA

USA . 2,070 parts In-Stock

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$18.626

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2,070

$18.626

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IDEA Electronic Components Group

UK . 2,078 parts In-Stock

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$58.719

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$52.847

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2,078

$58.719

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$52.847

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Component Stockers USA

USA . 715 parts In-Stock

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$107.830

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715

$107.830

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MKK Technologies

India . 2,073 parts In-Stock

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$110.417

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2,073

$110.417

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DigiPath Technology Company

USA . 2,073 parts In-Stock

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$110.417

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2,073

$110.417

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 4,532 parts In-Stock

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4,532

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Parana Technologies

USA . 473 parts In-Stock

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$70.208

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473

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Overview

Enhance your electronic projects with the STM32L162VDT6TR microcontroller by STMicroelectronics. Known for their top-notch quality and cutting-edge technology, STMicroelectronics delivers reliable solutions for a wide range of applications. This versatile microcontroller offers customers unmatched value, benefits, and advantages, making it a must-have component for any design. From its low power consumption to its high-speed performance, the STM32L162VDT6TR is the perfect choice for all your electronic needs. Upgrade your projects today with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Facilitates easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 26

Enables efficient memory addressing capabilities, supporting complex algorithms and data handling.

Package Shape: SQUARE

Optimizes space utilization on circuit boards, ensuring efficient layout and design.

Bit Size: 32

Offers high processing capability and precision in handling data and instructions.

Power Supplies (V): 2/3.3

Provides flexibility in power options, allowing for compatibility with different voltage requirements.

No. of Terminals: 100

Offers ample connectivity options for peripherals and external devices, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ensures a compact and efficient package design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Supports low-power operation and energy efficiency, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Allows for reliable performance in high-temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient processor architecture, ensuring high performance and speed.

Minimum Operating Temperature: -40 °C

Provides reliable operation in extreme cold conditions, suitable for a wide range of environments.

ADC Channels: YES

Enables analog-to-digital conversion for accurate sensor readings and data acquisition.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, enhancing overall system performance.

Terminal Position: QUAD

Enables easy and secure connection to external components, enhancing reliability and stability.

ROM Words: 393216

Provides ample storage for program instructions and data, supporting complex applications.

Width: 14 mm

Compact size allows for easy integration into various electronic devices and systems.

External Data Bus Width: 16

Supports efficient data transfer between the microcontroller and external devices, enhancing overall system performance.

Maximum Clock Frequency: 24 MHz

Offers high processing speed and performance capabilities, suitable for demanding real-time applications.

Length: 14 mm

Compact size facilitates space-saving designs and integration in small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a robust and efficient microcontroller architecture, suitable for a wide range of applications.

RAM Bytes: 49152

Provides sufficient memory for data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

Utilizes advanced CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Facilitates easy soldering and secure connection to circuit boards, ensuring reliable performance.

Maximum Supply Current: 12.3 mA

Ensures efficient power consumption for energy-saving operation, suitable for battery-powered devices.

Nominal Supply Voltage: 3 V

Standard voltage supply for compatibility with common power sources and systems.

PWM Channels: YES

Supports pulse-width modulation for precise control of motor speeds and other applications.

ROM Programmability: FLASH

Allows for easy and fast programming of the ROM memory, enabling quick updates and modifications.

Terminal Pitch: 0.5 mm

Provides fine pitch terminals for compact layout and flexibility in circuit board design.

Speed: 32 rpm

Delivers high processing speed and performance, suitable for time-critical applications.

No. of I/O Lines: 83

Offers ample input/output options for connecting to external devices and peripherals, enhancing versatility.

Technical Specifications

Microcontrollers STM32L162VDT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32L162VDT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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