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STM32L162RCT6

STMicroelectronics

STM32L162RCT6 by STMicroelectronics

STM32L162RCT6 by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption and high performance. With features like ADC and DMA channels, it offers versatile functionality in compact dimensions (10mm x 10mm).

Median Price

$4.539

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.539

10k+ parts

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740

-

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$4.539

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,424 parts In-Stock

1+ parts

-

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4,424

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Vyrian

USA . 3,325 parts In-Stock

1+ parts

-

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3,325

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Anansix

USA . 2,276 parts In-Stock

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-

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2,276

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Cyclops Electronics Ltd

UK . 830 parts In-Stock

1+ parts

-

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830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,267 parts In-Stock

1+ parts

$4.080

100+ parts

-

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-

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-

5,267

$4.080

-

-

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Microchip USA

USA . 1,886 parts In-Stock

1+ parts

$15.616

100+ parts

-

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1,886

$15.616

-

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AZTECH Wire

Italy . 170 parts In-Stock

1+ parts

$22.180

100+ parts

-

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170

$22.180

-

-

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IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$72.048

100+ parts

-

1k+ parts

$64.843

10k+ parts

-

1,691

$72.048

-

$64.843

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MKK Technologies

India . 966 parts In-Stock

1+ parts

$135.481

100+ parts

-

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966

$135.481

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DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$135.481

100+ parts

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966

$135.481

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Corphita

USA . 2,249 parts In-Stock

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2,249

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Parana Technologies

USA . 1,436 parts In-Stock

1+ parts

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100+ parts

$86.144

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1,436

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$86.144

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Perfect Parts

USA . 896 parts In-Stock

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896

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Kepictronics

USA . 830 parts In-Stock

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830

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Overview

Discover the STM32L162RCT6 by STMicroelectronics, a top-of-the-line microcontroller designed to deliver exceptional performance and reliability. With a powerful Cortex-M3 CPU, 32-bit processing, and versatile ADC and DMA channels, this device is perfect for a wide range of applications. From industrial automation to IoT devices, the STM32L162RCT6 offers advanced features and precise control. Trust in STMicroelectronics' reputation for quality and innovation, and unlock new possibilities with this cutting-edge microcontroller. Drive your projects forward with the unmatched value and benefits of the STM32L162RCT6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material allows for a lightweight and durable package, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology makes it easy to mount the microcontroller on a PCB, saving space and facilitating automated assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power supply inputs, making it versatile for different operating conditions.

Package Shape: SQUARE

The square package shape allows for easy placement on a PCB and efficient use of board space.

Bit Size: 32

A 32-bit architecture provides high processing power and performance for advanced applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows flexibility in design and compatibility with different power sources.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and external components, enhancing the microcontroller's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables a compact design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage allows for operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers a balance of performance and power efficiency, suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels support direct memory access, enabling efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Quad terminal positioning provides a stable connection and simplifies PCB layout design.

ROM Words: 262144

With a large ROM capacity, the microcontroller can store a significant amount of program code, enabling complex algorithms and functionality.

Width: 10 mm

A compact width of 10mm allows for a space-efficient PCB design and integration into small form factor devices.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency of 24MHz enables fast processing speeds and real-time operation for time-critical applications.

Length: 10 mm

A length of 10mm contributes to the microcontroller's compact form factor, making it suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals, it offers optimized performance for embedded control applications.

RAM Bytes: 32768

The generous RAM capacity of 32768 bytes enables efficient data storage and manipulation, supporting multitasking and data-intensive operations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing the microcontroller's overall performance.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering during PCB assembly, ensuring reliable electrical connections.

Maximum Supply Current: 9.6 mA

With a low maximum supply current of 9.6mA, the microcontroller operates efficiently without consuming excessive power.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V ensures compatibility with standard power sources and stable operation under normal operating conditions.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, facilitating motor control, LED dimming, and other applications requiring pulse width modulation.

ROM Programmability: FLASH

The use of Flash memory for ROM programmability allows for in-circuit programming and easy firmware updates, enhancing the microcontroller's flexibility.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm enables high-density PCB layout and minimizes signal crosstalk, improving overall system reliability.

Speed: 32 rpm

With a speed of 32rpm, the microcontroller can execute instructions quickly, enabling efficient operation in real-time control applications.

No. of I/O Lines: 51

Having 51 I/O lines provides ample connectivity for interfacing with external devices, sensors, and peripherals, making the microcontroller versatile for diverse applications.

Technical Specifications

Microcontrollers STM32L162RCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L162RCT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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