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STM32L162QDH6TR

STMicroelectronics

STM32L162QDH6TR by STMicroelectronics

STM32L162QDH6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 26-bit address bus, and 24 MHz clock frequency. Ideal for industrial applications, it features 109 I/O lines, 49152 bytes of RAM, and operates in temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,651 parts In-Stock

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7,651

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Digiode

USA . 4,434 parts In-Stock

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4,434

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Anansix

USA . 2,564 parts In-Stock

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2,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,276 parts In-Stock

1+ parts

$6.650

100+ parts

-

1k+ parts

-

10k+ parts

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6,276

$6.650

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$8.410

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896

$8.410

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Microchip USA

USA . 4,081 parts In-Stock

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$22.373

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4,081

$22.373

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IDEA Electronic Components Group

UK . 601 parts In-Stock

1+ parts

$58.464

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$52.618

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601

$58.464

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$52.618

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MKK Technologies

India . 1,527 parts In-Stock

1+ parts

$109.938

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1,527

$109.938

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DigiPath Technology Company

USA . 1,527 parts In-Stock

1+ parts

$109.938

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1,527

$109.938

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Component Stockers USA

USA . 385 parts In-Stock

1+ parts

$109.990

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385

$109.990

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Corphita

USA . 3,883 parts In-Stock

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3,883

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,670 parts In-Stock

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$69.903

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1,670

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$69.903

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Overview

Unleash the power of innovation with the STM32L162QDH6TR by STMicroelectronics, a cutting-edge microcontroller that delivers exceptional performance and reliability. Designed by a trusted industry leader, this product is perfect for a wide range of applications, from IoT devices to consumer electronics. With its advanced features and high-quality construction, customers can expect seamless integration, improved efficiency, and unmatched value. Stay ahead of the competition and elevate your projects with the STM32L162QDH6TR - the ultimate choice for next-level technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is cost-effective and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability makes installation easier and allows for compact PCB design.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6V provides flexibility in power supply options.

Address Bus Width: 26

Wider address bus width allows for increased memory addressing capabilities.

Package Shape: SQUARE

Square package shape enables efficient use of PCB space.

Bit Size: 32

32-bit architecture offers high processing power and data handling capabilities.

Power Supplies (V): 2/3.3

Support for multiple power supply options allows for versatile integration in different systems.

No. of Terminals: 132

High number of terminals provides ample connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch simplifies PCB layout and assembly process.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage requirement enhances energy efficiency and extends battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures product reliability in various environmental conditions.

CPU Family: CORTEX-M3

Inclusion of CORTEX-M3 CPU family ensures high performance and efficient processing capabilities.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the product suitable for industrial and harsh environments.

ADC Channels: YES

Presence of ADC channels enables analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels help in efficient data transfer and processing, optimizing system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and ensures easy accessibility for connections.

ROM Words: 393216

Large ROM storage capacity allows for extensive program code storage and execution.

Width: 7 mm

Compact width dimension enables space-efficient integration in smaller devices.

External Data Bus Width: 16

16-bit external data bus width provides high-speed data transfer capabilities.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency enables fast processing and efficient operation of the device.

Length: 7 mm

Short length dimension contributes to the overall compact size of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability and stability in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Use of RISC architecture in a microcontroller design enhances processing speed and efficiency.

RAM Bytes: 49152

Ample RAM storage capacity allows for efficient data processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form facilitates reliable solder connections and ensures mechanical stability.

Maximum Supply Current: 12.3 mA

Low maximum supply current requirement helps in achieving energy efficiency and prolonging battery life.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation of the device.

PWM Channels: YES

Availability of PWM channels enables precise control of analog outputs and motor speed regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of software programs.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB integration and compact design.

Speed: 32 rpm

Operational speed of 32 rpm ensures rapid data processing and system responsiveness.

No. of I/O Lines: 109

High number of I/O lines provides ample connectivity options for external devices and peripherals.

Technical Specifications

Microcontrollers STM32L162QDH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

7 mm

No. of I/O Lines:

109

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L162QDH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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