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STM32L162QDH6DTR

STMicroelectronics

STM32L162QDH6DTR by STMicroelectronics

STM32L162QDH6DTR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 26-bit address bus, and 24 MHz clock frequency. Ideal for industrial applications, it features 49152 bytes of RAM, flash ROM programmability, and ADC/DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,944 parts In-Stock

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4,944

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Anansix

USA . 2,179 parts In-Stock

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2,179

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Digiode

USA . 405 parts In-Stock

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405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,780 parts In-Stock

1+ parts

$6.650

100+ parts

-

1k+ parts

-

10k+ parts

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4,780

$6.650

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AZTECH Wire

Italy . 582 parts In-Stock

1+ parts

$12.150

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582

$12.150

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Microchip USA

USA . 3,983 parts In-Stock

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$22.373

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3,983

$22.373

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$32.612

100+ parts

$29.677

1k+ parts

$26.742

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-

3,000

$32.612

$29.677

$26.742

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IDEA Electronic Components Group

UK . 1,958 parts In-Stock

1+ parts

$42.263

100+ parts

-

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$38.037

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1,958

$42.263

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$38.037

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MKK Technologies

India . 296 parts In-Stock

1+ parts

$79.473

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296

$79.473

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DigiPath Technology Company

USA . 296 parts In-Stock

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$79.473

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296

$79.473

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,302 parts In-Stock

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2,302

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Parana Technologies

USA . 502 parts In-Stock

1+ parts

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$50.532

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502

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$50.532

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Overview

Elevate your projects with the STM32L162QDH6DTR microcontroller by STMicroelectronics. This powerhouse of a device boasts top-notch quality from a reputable manufacturer, making it a reliable choice for a wide range of applications. With its impressive features and capabilities, customers can enjoy enhanced performance, efficiency, and versatility in their designs. Trust in the value and benefits that this product brings to the table, and take your projects to new heights with the STM32L162QDH6DTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply voltages, increasing flexibility in design and compatibility with various systems.

Address Bus Width: 26

Allows for efficient communication and addressing of memory locations, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle, making the product suitable for compact designs and ease of installation.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sizes and perform complex operations more efficiently.

Power Supplies (V): 1.8/3.3

Supports multiple power supply options, enabling compatibility with different power sources and reducing overall system complexity.

No. of Terminals: 132

A higher number of terminals allow for more connectivity options and peripheral attachments, increasing the versatility of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density, small footprint, and precise interconnects, contributing to improved performance and reliability.

Minimum Supply Voltage: 1.65 V

Even with low voltage requirements, the microcontroller can operate efficiently, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the microcontroller can withstand harsh environmental conditions and maintain reliable performance.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 family, the microcontroller offers high performance, low power consumption, and advanced features for various applications.

Minimum Operating Temperature: -40 °C

With a low operating temperature limit, the microcontroller can function effectively in cold environments without compromising its performance.

ADC Channels: YES

Having Analog-to-Digital Converter channels allows the microcontroller to interface with analog sensors and signals, expanding its application capabilities.

DMA Channels: YES

Direct Memory Access channels enable faster data transfer between peripherals and memory, enhancing overall system performance and efficiency.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, making it easier to integrate the microcontroller into a system design.

ROM Words: 393216

With a large ROM capacity, the microcontroller can store a significant amount of program code and data, supporting complex applications and algorithms.

Width: 7 mm

Compact width dimensions allow for space-efficient PCB design and integration, suitable for applications with size constraints.

External Data Bus Width: 16

Having a 16-bit external data bus allows for faster data transfer between the microcontroller and external memory devices, enhancing performance.

Maximum Clock Frequency: 24 MHz

With a high clock frequency, the microcontroller can execute instructions quickly, improving overall system responsiveness and performance.

Length: 7 mm

A compact length size contributes to the overall small form factor of the product, making it ideal for applications with space limitations.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, the microcontroller can operate reliably in harsh conditions with high temperature ranges and varying temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC architecture, the microcontroller offers high performance, low power consumption, and efficient instruction execution for diverse applications.

RAM Bytes: 49152

With a generous RAM capacity, the microcontroller can efficiently handle data processing and storage requirements, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliable performance characteristics, making the microcontroller energy-efficient and cost-effective.

Terminal Form: BALL

Ball terminal form simplifies soldering and connection processes, ensuring reliable and secure electrical connections for the microcontroller.

Maximum Supply Current: 12.3 mA

With a low supply current requirement, the microcontroller operates efficiently without drawing excessive power, contributing to energy savings and extended battery life.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V ensures stable and consistent power delivery, preventing voltage fluctuations that could impact the microcontroller's performance.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog signals, making the microcontroller suitable for applications requiring accurate pulse modulation.

ROM Programmability: FLASH

Utilizing FLASH memory for ROM programmability allows for easy and efficient programming of the microcontroller, enabling quick updates and modifications to firmware.

Terminal Pitch: 0.5 mm

With a small terminal pitch size, the microcontroller supports high-density packaging, enabling compact and space-efficient PCB designs for various applications.

Speed: 32 rpm

With a speed of 32 rotations per minute, the microcontroller can process instructions and data quickly, enhancing overall system performance and responsiveness.

No. of I/O Lines: 109

A high number of I/O lines offer versatile interfacing options with external peripherals and devices, expanding the connectivity and functionality of the microcontroller.

Technical Specifications

Microcontrollers STM32L162QDH6DTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

7 mm

No. of I/O Lines:

109

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L162QDH6DTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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