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STM32L162QDH6

STMicroelectronics

STM32L162QDH6 by STMicroelectronics

STM32L162QDH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 26-bit address bus, and 16-bit external data bus. It operates at up to 24 MHz clock frequency, has 109 I/O lines, and features ADC and DMA channels. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,113 parts In-Stock

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13,113

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Digiode

USA . 4,304 parts In-Stock

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4,304

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Anansix

USA . 2,242 parts In-Stock

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2,242

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ComSIT Distribution GmbH

Germany . 1,994 parts In-Stock

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1,994

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Distributors (Availability)

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Vigor

Singapore . 4,860 parts In-Stock

1+ parts

$6.650

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4,860

$6.650

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AZTECH Wire

Italy . 199 parts In-Stock

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$20.130

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199

$20.130

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Microchip USA

USA . 3,544 parts In-Stock

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$22.373

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3,544

$22.373

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IDEA Electronic Components Group

UK . 887 parts In-Stock

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$26.159

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$23.543

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887

$26.159

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$23.543

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MKK Technologies

India . 1,319 parts In-Stock

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$49.191

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1,319

$49.191

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DigiPath Technology Company

USA . 1,319 parts In-Stock

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$49.191

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1,319

$49.191

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Perfect Parts

USA . 3,261 parts In-Stock

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3,261

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,786 parts In-Stock

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1,786

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Parana Technologies

USA . 1,534 parts In-Stock

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$31.277

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1,534

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$31.277

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Overview

Unleash the power of innovation with the STM32L162QDH6 microcontroller by STMicroelectronics. Crafted with precision and expertise, this versatile device offers a wide range of applications in various industries. Experience seamless performance, reliability, and efficiency with this cutting-edge product. Elevate your projects with the value and benefits that only STMicroelectronics can deliver. Revolutionize your designs and unlock endless possibilities with the STM32L162QDH6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a long lifespan.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, increasing compatibility with different power sources.

Bit Size: 32

Higher bit size allows for more complex operations and calculations to be performed by the microcontroller.

ADC Channels: YES

Ability to convert analog signals into digital data, enabling the microcontroller to interact with a variety of sensors and inputs.

CPU Family: CORTEX-M3

Belongs to a high-performance ARM Cortex-M3 family, providing efficient and powerful processing capabilities.

RAM Bytes: 49152

Large amount of RAM allows for storing and accessing a significant amount of data and variables during operation.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast execution of instructions, improving overall performance of the microcontroller.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, making the microcontroller versatile and adaptable.

Speed: 32 rpm

Although low for a microcontroller, this speed is suitable for applications that require precise control and timing, such as robotics or motor control.

Technical Specifications

Microcontrollers STM32L162QDH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

7 mm

No. of I/O Lines:

109

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L162QDH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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