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STM32L152ZET6D

STMicroelectronics

STM32L152ZET6D by STMicroelectronics

STM32L152ZET6D by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 24 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,623 parts In-Stock

1+ parts

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5,623

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Anansix

USA . 2,413 parts In-Stock

1+ parts

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2,413

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Digiode

USA . 2,235 parts In-Stock

1+ parts

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2,235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,837 parts In-Stock

1+ parts

$8.760

100+ parts

-

1k+ parts

-

10k+ parts

-

7,837

$8.760

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AZTECH Wire

Italy . 373 parts In-Stock

1+ parts

$9.830

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-

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-

10k+ parts

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373

$9.830

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IDEA Electronic Components Group

UK . 1,004 parts In-Stock

1+ parts

$19.885

100+ parts

-

1k+ parts

$17.896

10k+ parts

-

1,004

$19.885

-

$17.896

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$22.887

100+ parts

$20.827

1k+ parts

$18.767

10k+ parts

-

3,000

$22.887

$20.827

$18.767

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Microchip USA

USA . 2,179 parts In-Stock

1+ parts

$28.730

100+ parts

$28.320

1k+ parts

$28.110

10k+ parts

$27.910

2,179

$28.730

$28.320

$28.110

$27.910

MKK Technologies

India . 828 parts In-Stock

1+ parts

$37.392

100+ parts

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828

$37.392

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DigiPath Technology Company

USA . 828 parts In-Stock

1+ parts

$37.392

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828

$37.392

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Component Stockers USA

USA . 449 parts In-Stock

1+ parts

$127.900

100+ parts

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449

$127.900

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Corphita

USA . 4,122 parts In-Stock

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4,122

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Parana Technologies

USA . 793 parts In-Stock

1+ parts

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100+ parts

$23.775

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793

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$23.775

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Overview

Unlock the power of innovation with the STM32L152ZET6D microcontroller from STMicroelectronics. With its cutting-edge technology and high-quality design, this device offers a wide range of applications for your projects. From IoT devices to consumer electronics, this microcontroller provides unparalleled performance and efficiency. Experience the benefits of seamless integration, low power consumption, and superior functionality that only STMicroelectronics can deliver. Take your product development to the next level with the STM32L152ZET6D and see the difference it can make for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability while also keeping the overall weight of the product low.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time during manufacturing.

Maximum Supply Voltage: 3.6 V

Can accommodate a wide range of power sources, making it versatile for different applications.

Bit Size: 32

Provides sufficient processing power for handling complex tasks efficiently.

DAC Channels: YES

Allows for accurate analog output, enabling the product to interface with other analog devices.

No. of Terminals: 144

Offers a high level of connectivity for various components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact design while still providing excellent connectivity options.

Minimum Supply Voltage: 1.65 V

Allows for operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, providing versatility in different environments.

ADC Channels: YES

Enables accurate analog input, enhancing the product's ability to interact with sensors and other analog devices.

DMA Channels: YES

Facilitates efficient data transfer and processing, improving overall performance.

Terminal Position: QUAD

Provides a stable and secure connection for multiple terminals, ensuring reliability.

ROM Words: 524288

Offers ample storage space for program code and data, allowing for complex applications to run smoothly.

Maximum Seated Height: 1.6 mm

Allows for a slim profile, ideal for applications where space is limited.

Width: 20 mm

Compact size makes it easy to integrate into various electronic devices.

Maximum Clock Frequency: 24 MHz

Provides fast processing speed, suitable for real-time applications.

Length: 20 mm

Compact size, suitable for small form factor products.

Temperature Grade: INDUSTRIAL

Built to withstand harsh industrial environments, increasing product reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and energy efficiency, suitable for a wide range of applications.

Technology: CMOS

Low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Provides a reliable connection to the circuit board, ensuring stable operation.

Nominal Supply Voltage: 3.3 V

Standard voltage level for many electronic devices, ensuring compatibility with existing systems.

PWM Channels: YES

Enables precise control of digital signals, useful for tasks such as motor control and LED dimming.

ROM Programmability: FLASH

Allows for easy rewriting of program code, facilitating product updates and customization.

Terminal Pitch: 0.5 mm

Compact pitch size for efficient use of space on the PCB.

Speed: 32 rpm

Provides fast processing speed for handling real-time tasks efficiently.

No. of I/O Lines: 115

Offers a high level of connectivity for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32L152ZET6D attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

STM32L152ZET6D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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