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STM32L152VDT6TR

STMicroelectronics

STM32L152VDT6TR by STMicroelectronics

STM32L152VDT6TR by STMicroelectronics is a 32-bit microcontroller with 83 I/O lines, 24 MHz clock frequency, and 49152 bytes of RAM. Ideal for industrial applications due to its -40 to 85 °C operating temperature range and low profile flatpack package style.

Median Price

$7.181

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.181

10k+ parts

-

8,000

-

-

$7.181

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Vyrian

USA . 7,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,601

-

-

-

-

Chip Stock

USA . 6,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,900

-

-

-

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Digiode

USA . 3,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,768

-

-

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Anansix

USA . 1,267 parts In-Stock

1+ parts

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1,267

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$5.300

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$5.300

-

-

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AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$12.990

100+ parts

-

1k+ parts

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10k+ parts

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358

$12.990

-

-

-

Microchip USA

USA . 3,583 parts In-Stock

1+ parts

$18.263

100+ parts

-

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-

3,583

$18.263

-

-

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IDEA Electronic Components Group

UK . 39 parts In-Stock

1+ parts

$59.994

100+ parts

-

1k+ parts

$53.995

10k+ parts

-

39

$59.994

-

$53.995

-

MKK Technologies

India . 629 parts In-Stock

1+ parts

$112.815

100+ parts

-

1k+ parts

-

10k+ parts

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629

$112.815

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DigiPath Technology Company

USA . 629 parts In-Stock

1+ parts

$112.815

100+ parts

-

1k+ parts

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629

$112.815

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Perfect Parts

USA . 87,360 parts In-Stock

1+ parts

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100+ parts

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87,360

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Corphita

USA . 1,459 parts In-Stock

1+ parts

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1,459

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Parana Technologies

USA . 313 parts In-Stock

1+ parts

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100+ parts

$71.732

1k+ parts

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10k+ parts

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313

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$71.732

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Overview

Discover the STM32L152VDT6TR by STMicroelectronics, a high-quality microcontroller that offers unmatched performance and reliability. With advanced technology from a trusted manufacturer, this product is ideal for a wide range of applications. From IoT devices to industrial automation, this microcontroller provides exceptional value and benefits to customers. Experience seamless operation and enhanced functionality with the STM32L152VDT6TR, setting a new standard in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Easy to mount on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, accommodating different system requirements.

Package Shape: SQUARE

Optimal shape for efficient space utilization on the PCB.

Bit Size: 32

Offers high computational power and precision for handling complex tasks efficiently.

DAC Channels: YES

Enables the microcontroller to generate analog output signals for various applications.

Power Supplies (V): 2/3.3

Provides flexibility in power input options, making it compatible with different power sources.

No. of Terminals: 100

Sufficient number of terminals for connecting to various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style with low profile and fine pitch for space-saving and high-density PCB designs.

Minimum Supply Voltage: 1.8 V

Supports low-power operation, making it ideal for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

CPU Family: CORTEX-M3

Utilizes advanced Cortex-M3 architecture for efficient and reliable performance.

Minimum Operating Temperature: -40 °C

Operational in extreme cold temperatures, ensuring functionality in diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable terminal connections.

ADC Channels: YES

Allows the microcontroller to convert analog signals to digital data, expanding its input capabilities.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer operations, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position for easy and secure mounting on the PCB.

ROM Words: 393216

Large ROM capacity for storing program instructions and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design for compact and space-efficient PCB layouts.

Width: 14 mm

Compact width dimension for easy integration into different electronic systems.

Maximum Clock Frequency: 24 MHz

High clock frequency for fast and efficient processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during soldering process with specified time limit for peak reflow temperature.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure soldering and robust connection to the PCB.

Length: 14 mm

Compact length dimension for space-saving PCB designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and optimized processing of instructions.

RAM Bytes: 49152

Large RAM capacity for temporary data storage and efficient program execution.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections on the PCB.

Maximum Supply Current: 12.3 mA

Low supply current for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for stable and reliable operation of the microcontroller.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of analog signals, ideal for motor control and power management.

ROM Programmability: FLASH

Flash programmable ROM for easy and efficient updating of program code and data.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layout and high-density board designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for safe and reliable soldering process, ensuring quality connections.

Speed: 32 rpm

Operates at 32 revolutions per minute, suitable for various timing and control applications.

No. of I/O Lines: 83

Sufficient number of I/O lines for connecting to external devices and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers STM32L152VDT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32L152VDT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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