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STM32L152VBH6A

STMicroelectronics

STM32L152VBH6A by STMicroelectronics

STM32L152VBH6A by STMicroelectronics is a 32-bit microcontroller with 83 I/O lines, DAC and ADC channels, PWM support, and 32 MHz clock frequency. Ideal for industrial applications requiring low power consumption, it operates b/w -40 to 85 °C with a supply voltage range of 1.8V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,261 parts In-Stock

1+ parts

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7,261

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Digiode

USA . 2,385 parts In-Stock

1+ parts

-

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2,385

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Anansix

USA . 2,287 parts In-Stock

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2,287

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,870 parts In-Stock

1+ parts

$4.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,870

$4.100

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AZTECH Wire

Italy . 239 parts In-Stock

1+ parts

$18.770

100+ parts

-

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-

239

$18.770

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-

Microchip USA

USA . 4,707 parts In-Stock

1+ parts

$32.014

100+ parts

-

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4,707

$32.014

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IDEA Electronic Components Group

UK . 1,312 parts In-Stock

1+ parts

$41.107

100+ parts

-

1k+ parts

$36.997

10k+ parts

-

1,312

$41.107

-

$36.997

-

MKK Technologies

India . 440 parts In-Stock

1+ parts

$77.300

100+ parts

-

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440

$77.300

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DigiPath Technology Company

USA . 440 parts In-Stock

1+ parts

$77.300

100+ parts

-

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440

$77.300

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QUARKTWIN TECHNOLOGY LTD

USA . 27,735 parts In-Stock

1+ parts

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27,735

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A-Z Elektronik GmbH

Germany . 6,419 parts In-Stock

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6,419

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Perfect Parts

USA . 3,261 parts In-Stock

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3,261

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 1,740 parts In-Stock

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1,740

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Parana Technologies

USA . 695 parts In-Stock

1+ parts

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$49.150

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695

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$49.150

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Corphita

USA . 254 parts In-Stock

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254

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Overview

Discover the STM32L152VBH6A by STMicroelectronics, a top-tier microcontroller that delivers unmatched quality and performance. With a maximum clock frequency of 32 MHz and 83 I/O lines, this innovative product is perfect for a wide range of applications in various industries. STMicroelectronics, known for its cutting-edge technology and reliable products, ensures that customers receive value and benefits that exceed expectations. Experience the advantages of this advanced microcontroller and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microcontroller, ensuring reliable performance.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, offering flexibility in power options.

Package Shape: SQUARE

Square shape makes it easier to integrate into circuit designs and offers uniform mounting options.

Bit Size: 32

Offers a good balance between complexity and efficiency for various applications.

DAC Channels: YES

Allows for precise control of analog outputs, useful in many control and signal processing applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style enables high-density mounting and efficient signal routing, ideal for compact and complex designs.

Minimum Supply Voltage: 1.8 V

Supports low-power operation and is compatible with various battery technologies.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in very cold environments, providing versatility for a wide range of use cases.

ADC Channels: YES

Enables accurate analog-to-digital conversion, crucial for sensing and data acquisition applications.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, enhancing system performance.

Terminal Position: BOTTOM

Simplifies PCB layout and assembly, making it easier to integrate into existing designs.

Maximum Seated Height: 0.6 mm

Low profile design saves space and allows for compact and slim electronic devices.

Width: 7 mm

Compact width allows for easy placement on PCBs and compatibility with standard board sizes.

Maximum Clock Frequency: 32 MHz

Offers fast processing speed for real-time applications and high-speed data processing.

Length: 7 mm

Compact length enables efficient use of PCB real estate, especially in small form factor designs.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous temperature demands of industrial applications, ensuring reliability and long-term performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient execution of instructions, optimized for microcontroller applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminals provide good contact reliability and enable easy rework or replacement if needed.

Nominal Supply Voltage: 3 V

Stable supply voltage ensures consistent performance and compatibility with common power sources.

PWM Channels: YES

Supports Pulse Width Modulation for precision control of motor speed, LED brightness, and other applications.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updating of firmware, essential for flexibility in product development.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density mounting and efficient signal routing, essential for compact designs.

Speed: 32 rpm

The high speed of 32 rpm allows for quick response times and efficient data processing.

No. of I/O Lines: 83

Provides ample input and output lines for versatile connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers STM32L152VBH6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L152VBH6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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