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STM32L152R8T6TR

STMicroelectronics

STM32L152R8T6TR by STMicroelectronics

STM32L152R8T6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 32 MHz. It features 2 DAC and 20 ADC channels, suitable for industrial applications requiring low power consumption and high-performance computing. With various peripherals like BOD, DMA, and USB connectivity, it offers versatile solutions in embedded systems design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,503 parts In-Stock

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4,503

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Digiode

USA . 3,186 parts In-Stock

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3,186

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Anansix

USA . 973 parts In-Stock

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973

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Distributors (Availability)

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Vigor

Singapore . 2,974 parts In-Stock

1+ parts

$3.390

100+ parts

-

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-

10k+ parts

-

2,974

$3.390

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AZTECH Wire

Italy . 937 parts In-Stock

1+ parts

$15.770

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-

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937

$15.770

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Microchip USA

USA . 3,265 parts In-Stock

1+ parts

$29.183

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3,265

$29.183

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IDEA Electronic Components Group

UK . 781 parts In-Stock

1+ parts

$56.034

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$50.430

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781

$56.034

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$50.430

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MKK Technologies

India . 1,161 parts In-Stock

1+ parts

$105.367

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1,161

$105.367

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DigiPath Technology Company

USA . 1,161 parts In-Stock

1+ parts

$105.367

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1,161

$105.367

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Corphita

USA . 3,766 parts In-Stock

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3,766

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Parana Technologies

USA . 954 parts In-Stock

1+ parts

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$66.997

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954

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$66.997

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Overview

Unlock the power of innovation with the STM32L152R8T6TR by STMicroelectronics. This cutting-edge microcontroller boasts exceptional quality and reliability, backed by a renowned manufacturer known for delivering top-notch electronic solutions. Ideal for a wide range of applications, this product offers unmatched value with its advanced features, including DAC and ADC channels, DMA support, and a maximum clock frequency of 32 MHz. Discover endless possibilities and elevate your projects with the superior performance and efficiency of the STM32L152R8T6TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight housing for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making the microcontroller versatile in various applications.

Bit Size: 32

Offers high processing power and capability for handling complex tasks and calculations.

DAC Channels: YES

Enables the generation of analog signals, essential for interfacing with external devices and sensors.

Power Supplies (V): 2/3.3

Provides multiple voltage options for different components, ensuring compatibility and flexibility in design.

No. of Terminals: 64

Offers a high number of I/O connections, allowing for extensive interfacing with peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and space-saving design suitable for modern electronic devices with limited space.

Minimum Supply Voltage: 1.8 V

Allows for operation at low voltages, conserving power and extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

Ideal for industrial environments with high temperature variations, ensuring reliable performance under challenging conditions.

CPU Family: CORTEX-M3

Utilizes a powerful and energy-efficient processor architecture for optimal performance and power efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and control capabilities for a wide range of applications.

RAM Bytes: 10240

Sufficient memory capacity for storing and processing data, ensuring smooth operation of applications and algorithms.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable and energy-efficient operation.

Analog To Digital Convertors: 20-Ch 12-Bit

High-resolution ADCs for accurate conversion of analog signals, essential for sensor interfacing and data acquisition.

Connectivity: I2C(2), SPI(2), USART(3), USB

Versatile connectivity options for interfacing with various communication protocols and peripherals in diverse applications.

Technical Specifications

Microcontrollers STM32L152R8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), LCD, POR, RTC, TIMER(10)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L152R8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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