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STM32L152QCH6

STMicroelectronics

STM32L152QCH6 by STMicroelectronics

STM32L152QCH6 by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words, 32768 RAM bytes, and 40-Ch 12-Bit ADC channels. It operates at a max clock frequency of 24 MHz and has various peripherals like PWM(4), USART(3), and USB for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,244 parts In-Stock

1+ parts

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4,244

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Digiode

USA . 3,840 parts In-Stock

1+ parts

-

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3,840

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Anansix

USA . 1,951 parts In-Stock

1+ parts

-

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1,951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,636 parts In-Stock

1+ parts

$5.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,636

$5.830

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-

-

Semicontronic

India . 692 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

692

$9.000

$8.775

$8.730

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Microchip USA

USA . 4,446 parts In-Stock

1+ parts

$19.593

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-

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4,446

$19.593

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AZTECH Wire

Italy . 1,093 parts In-Stock

1+ parts

$20.030

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1,093

$20.030

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IDEA Electronic Components Group

UK . 118 parts In-Stock

1+ parts

$46.093

100+ parts

-

1k+ parts

$41.484

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118

$46.093

-

$41.484

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Component Stockers USA

USA . 1,299 parts In-Stock

1+ parts

$79.290

100+ parts

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1,299

$79.290

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MKK Technologies

India . 956 parts In-Stock

1+ parts

$86.675

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956

$86.675

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DigiPath Technology Company

USA . 956 parts In-Stock

1+ parts

$86.675

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956

$86.675

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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Parana Technologies

USA . 643 parts In-Stock

1+ parts

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$55.111

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643

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$55.111

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Corphita

USA . 585 parts In-Stock

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585

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Overview

Unleash the power of innovation with the STM32L152QCH6 by STMicroelectronics, a cutting-edge microcontroller that offers unmatched quality and reliability. Developed by a trusted industry leader, this product is designed to meet the demands of a wide range of applications in the electronics field. With its advanced features and high performance capabilities, customers can expect superior value, efficiency, and flexibility for their projects. Elevate your designs and experience the benefits of seamless integration and enhanced functionality with the STM32L152QCH6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package durable and resistant to damage, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Operates at a maximum supply voltage of 3.6V, providing flexibility in power supply options.

Bit Size: 32

32-bit architecture offers high computational power and performance for processing complex tasks efficiently.

DAC Channels: YES

Digital-to-Analog Converters allow for analog output signals, enabling interfacing with external analog devices.

No. of Terminals: 132

Large number of terminals provide abundant connectivity options for interfacing with external components and peripherals.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable operation in various environmental conditions.

CPU Family: CORTEX-M3

Utilizes Cortex-M3 CPU architecture known for its energy efficiency, high performance, and cost-effectiveness.

ADC Channels: YES

Analog-to-Digital Converters enable the microcontroller to read and convert analog signals into digital data for processing.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speed and efficiency, reducing CPU workload for improved performance.

Technical Specifications

Microcontrollers STM32L152QCH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

109

No. of Terminals:

132

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

8K

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(8), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(12), LCD, POR, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

Analog To Digital Convertors:

40-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L152QCH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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