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STM32L152CCU6D

STMicroelectronics

STM32L152CCU6D by STMicroelectronics

STM32L152CCU6D by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words, 32768 RAM bytes, and 14-Ch 12-Bit ADC channels. It operates at a max clock frequency of 24 MHz and has various peripherals like PWM(4), USART(3), and USB for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,945 parts In-Stock

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4,945

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Digiode

USA . 3,961 parts In-Stock

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3,961

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Anansix

USA . 92 parts In-Stock

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92

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Distributors (Availability)

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Vigor

Singapore . 6,588 parts In-Stock

1+ parts

$3.849

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-

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6,588

$3.849

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AZTECH Wire

Italy . 127 parts In-Stock

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$20.990

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127

$20.990

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Microchip USA

USA . 2,864 parts In-Stock

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$29.878

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2,864

$29.878

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IDEA Electronic Components Group

UK . 958 parts In-Stock

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$36.416

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$32.775

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958

$36.416

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$32.775

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MKK Technologies

India . 263 parts In-Stock

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$68.479

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263

$68.479

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DigiPath Technology Company

USA . 263 parts In-Stock

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$68.479

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263

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Parana Technologies

USA . 1,985 parts In-Stock

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$43.541

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1,985

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$43.541

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Corphita

USA . 146 parts In-Stock

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Overview

Unlock a world of endless possibilities with the STM32L152CCU6D microcontroller from STMicroelectronics. With its cutting-edge technology and reliable performance, this chip is perfect for a wide range of applications. Whether you are designing IoT devices, consumer electronics, or industrial automation systems, this microcontroller offers unparalleled efficiency and flexibility. Trust in STMicroelectronics' expertise in manufacturing top-quality components to bring your innovative ideas to life. Experience the value and benefits of the STM32L152CCU6D and revolutionize your projects today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package makes it easy to mount and solder onto PCBs, saving time and effort in assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and a compact design.

Bit Size: 32

32-bit architecture provides higher processing capabilities and can handle complex tasks efficiently.

DAC Channels: YES

Built-in DAC channels allow for analog output, enabling the microcontroller to interface with analog devices.

Power Supplies (V): 1.8/3.3

Supports multiple power supply options, providing flexibility in power management.

No. of Terminals: 48

Ample number of terminals allow for connectivity to various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles offer options for different mounting and cooling methods, leading to improved thermal performance.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage ensures operation in low-power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable operation in harsh environments.

CPU Family: CORTEX-M3

Based on the Cortex-M3 architecture, known for its high performance and power efficiency.

Minimum Operating Temperature: -40 °C

Impressive minimum operating temperature range ensures operation in cold environments without issues.

Terminal Finish: MATTE TIN

Matte tin finish provides good corrosion resistance and solderability for long-term reliability.

ADC Channels: YES

Presence of ADC channels enables the microcontroller to convert analog signals to digital data for processing.

DMA Channels: YES

DMA channels enhance data transfer speeds and efficiency, ideal for high-performance applications.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and ensures secure connection to the board.

ROM Words: 262144

Large ROM size allows for ample storage of program code and data, catering to complex applications.

Maximum Seated Height: 0.65 mm

Low seated height saves space in the system design and enables compact form factor.

Digital To Analog Convertors: 2-Ch 12-Bit (2)

Dual 12-bit DACs offer precise analog outputs for accurate control of external devices.

Width: 7 mm

Narrow width facilitates space-efficient board layout and integration into compact devices.

Data EEPROM Size: 8K

Adequate EEPROM size for storing data persistently, enabling customization and configuration memory.

Peripherals: COMPARATOR(2), CRC, DMA(12), LCD, POR, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

Rich set of peripherals enhance the microcontroller's capabilities for interfacing with various external components.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for rapid execution of instructions and fast processing speeds.

Peak Reflow Temperature °C: 260

Peak reflow temperature tolerance ensures reliability during soldering and assembly processes.

Length: 7 mm

Compact length facilitates space-saving designs and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high performance and power efficiency for demanding applications.

RAM Bytes: 32768

Sufficient RAM size for data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology provides power efficiency and high-speed operation, essential for modern electronics.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and assembly processes while ensuring robust electrical connections.

Analog To Digital Convertors: 14-Ch 12-Bit

High number of ADC channels with 12-bit resolution for accurate conversion of analog signals to digital data.

Maximum Supply Current: 12.3 mA

Low maximum supply current consumption for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent and reliable performance of the microcontroller.

PWM Channels: YES

PWM channels enable the generation of precise and adjustable analog output signals for control applications.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(8), USART(3), USB

Diverse connectivity options for interfacing with a wide range of devices and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updating of firmware and applications without requiring additional external memory.

Terminal Pitch: 0.5 mm

Narrow terminal pitch enables high-density board designs and fine-pitch component integration.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the microcontroller is suited for reflow soldering processes.

Speed: 32 rpm

High processing speed of 32 RPM ensures efficient execution of operations and fast response times.

On Chip Program ROM Width: 8

On-chip ROM width of 8 allows for ample storage of program code, reducing the need for external memory.

No. of I/O Lines: 37

Adequate number of I/O lines enable versatile connectivity with external devices and peripherals for diverse applications.

Technical Specifications

Microcontrollers STM32L152CCU6D attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

8K

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(8), USART(3), USB

Peripherals:

COMPARATOR(2), CRC, DMA(12), LCD, POR, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L152CCU6D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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