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STM32L152CBU6A

STMicroelectronics

STM32L152CBU6A by STMicroelectronics

STM32L152CBU6A by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 32768 RAM words. It features 14-Ch 12-Bit ADCs, 2-Ch 12-Bit DACs, and low power mode ideal for industrial applications requiring high-speed processing at up to 32 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,437 parts In-Stock

1+ parts

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9,437

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Anansix

USA . 1,845 parts In-Stock

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1,845

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Digiode

USA . 1,752 parts In-Stock

1+ parts

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1,752

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,484 parts In-Stock

1+ parts

$3.240

100+ parts

-

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-

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9,484

$3.240

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AZTECH Wire

Italy . 501 parts In-Stock

1+ parts

$10.490

100+ parts

-

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501

$10.490

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Microchip USA

USA . 3,842 parts In-Stock

1+ parts

$25.280

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3,842

$25.280

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Component Stockers USA

USA . 1,936 parts In-Stock

1+ parts

$53.730

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1,936

$53.730

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IDEA Electronic Components Group

UK . 1,711 parts In-Stock

1+ parts

$68.181

100+ parts

-

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$61.363

10k+ parts

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1,711

$68.181

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$61.363

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MKK Technologies

India . 1,982 parts In-Stock

1+ parts

$128.210

100+ parts

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1,982

$128.210

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DigiPath Technology Company

USA . 1,982 parts In-Stock

1+ parts

$128.210

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1,982

$128.210

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Parana Technologies

USA . 1,246 parts In-Stock

1+ parts

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$81.521

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1,246

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$81.521

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Corphita

USA . 867 parts In-Stock

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867

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Overview

Unlock the power of innovation with the STM32L152CBU6A microcontroller by STMicroelectronics. Crafted with precision and expertise, this chip offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, this device boasts low power consumption, high-speed processing, and a wealth of integrated peripherals. From IoT devices to industrial automation, the possibilities are endless. Trust STMicroelectronics to deliver cutting-edge technology that elevates your projects to new heights. Elevate your designs with the STM32L152CBU6A and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the microcontroller, making it suitable for various industrial applications.

Maximum Supply Voltage: 3.6 V

Being able to handle up to 3.6V ensures compatibility with a wide range of power sources, increasing flexibility in design.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance and efficiency, making this microcontroller suitable for complex tasks and applications.

ADC Channels: YES

Having analog to digital converter channels allows for accurate and precise analog signal conversion, essential for sensor interfacing and measurements.

Maximum Clock Frequency: 32 MHz

With a high clock frequency of 32 MHz, this microcontroller can handle demanding tasks and operate at fast speeds, ideal for real-time applications.

Connectivity: I2C(2), SPI(2), USART(3), USB

Multiple connectivity options such as I2C, SPI, USART, and USB enable easy communication with other devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers STM32L152CBU6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

7

No. of External Interrupts:

16

No. of I/O Lines:

37

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, ULTRA THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, CAPSENS, LCD, POR, PWM(4), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L152CBU6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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