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STM32L151VBT6D

STMicroelectronics

STM32L151VBT6D by STMicroelectronics

STM32L151VBT6D by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 24-Ch 12-Bit ADC channels. It operates at a max clock frequency of 32 MHz and has various peripherals like BOD, RTC, and USB. Ideal for industrial applications requiring high-speed data processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,347 parts In-Stock

1+ parts

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2,347

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Digiode

USA . 1,862 parts In-Stock

1+ parts

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1,862

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Anansix

USA . 370 parts In-Stock

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370

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,337 parts In-Stock

1+ parts

$4.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,337

$4.750

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AZTECH Wire

Italy . 1,172 parts In-Stock

1+ parts

$16.600

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1,172

$16.600

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Microchip USA

USA . 2,336 parts In-Stock

1+ parts

$17.312

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2,336

$17.312

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IDEA Electronic Components Group

UK . 1,545 parts In-Stock

1+ parts

$41.628

100+ parts

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$37.465

10k+ parts

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1,545

$41.628

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$37.465

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MKK Technologies

India . 1,335 parts In-Stock

1+ parts

$78.279

100+ parts

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1,335

$78.279

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DigiPath Technology Company

USA . 1,335 parts In-Stock

1+ parts

$78.279

100+ parts

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1,335

$78.279

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Parana Technologies

USA . 307 parts In-Stock

1+ parts

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100+ parts

$49.773

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307

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$49.773

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Corphita

USA . 163 parts In-Stock

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163

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Overview

Experience the innovative power of STMicroelectronics with the STM32L151VBT6D microcontroller. This cutting-edge device offers unmatched quality and reliability, making it ideal for a wide range of applications. With advanced features such as DAC channels, DMA channels, and ADC channels, this product provides exceptional value and performance to customers seeking high-speed and efficient solutions. Trust in STMicroelectronics to deliver the best in microcontroller technology for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the microcontroller lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power sources, providing flexibility in design.

Bit Size: 32

The 32-bit architecture allows for faster and more efficient processing of data, making this microcontroller suitable for complex tasks.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to output analog signals, expanding its functionality in controlling external devices.

No. of Terminals: 100

With a high number of terminals, this microcontroller offers ample connectivity options for interfacing with various external components.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its efficient performance and low power consumption, making this microcontroller ideal for energy-efficient applications.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to convert analog signals into digital data, enhancing its ability to interface with sensors and other analog devices.

ROM Words: 131072

With a large ROM capacity of 131072 words, this microcontroller can store a significant amount of program data, enabling the implementation of complex algorithms and functionalities.

RAM Bytes: 16384

The 16384 bytes of RAM provide sufficient space for temporary data storage, facilitating multitasking and efficient operation of the microcontroller.

Analog To Digital Convertors: 24-Ch 12-Bit

The presence of 24 ADC channels with 12-bit resolution allows for precise conversion of analog signals, making this microcontroller suitable for applications requiring high accuracy in analog-to-digital conversions.

Technical Specifications

Microcontrollers STM32L151VBT6D attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), IRDA, SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L151VBT6D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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