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STM32L151V8H6A

STMicroelectronics

STM32L151V8H6A by STMicroelectronics

STM32L151V8H6A by STMicroelectronics is a 32-bit microcontroller with 83 I/O lines, DAC and ADC channels, PWM support, and 32 MHz clock frequency. Ideal for industrial applications due to its CMOS technology, operating temperature range of -40 to 85 °C, and low profile grid array package style.

Median Price

$8.780

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$8.780

100+ parts

$5.080

1k+ parts

$3.810

10k+ parts

-

1

$8.780

$5.080

$3.810

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,582 parts In-Stock

1+ parts

$6.450

100+ parts

-

1k+ parts

-

10k+ parts

-

1,582

$6.450

-

-

-

Vyrian

USA . 7,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,419

-

-

-

-

Anansix

USA . 2,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,707

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,165 parts In-Stock

1+ parts

$3.530

100+ parts

-

1k+ parts

-

10k+ parts

-

4,165

$3.530

-

-

-

Corphita

USA . 3,247 parts In-Stock

1+ parts

$6.111

100+ parts

-

1k+ parts

-

10k+ parts

-

3,247

$6.111

-

-

-

Microchip USA

USA . 3,517 parts In-Stock

1+ parts

$27.525

100+ parts

-

1k+ parts

-

10k+ parts

-

3,517

$27.525

-

-

-

IDEA Electronic Components Group

UK . 1,209 parts In-Stock

1+ parts

$69.434

100+ parts

-

1k+ parts

$62.491

10k+ parts

-

1,209

$69.434

-

$62.491

-

MKK Technologies

India . 1,490 parts In-Stock

1+ parts

$130.567

100+ parts

-

1k+ parts

-

10k+ parts

-

1,490

$130.567

-

-

-

DigiPath Technology Company

USA . 1,490 parts In-Stock

1+ parts

$130.567

100+ parts

-

1k+ parts

-

10k+ parts

-

1,490

$130.567

-

-

-

Perfect Parts

USA . 2,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,796

-

-

-

-

Parana Technologies

USA . 2,147 parts In-Stock

1+ parts

-

100+ parts

$83.019

1k+ parts

-

10k+ parts

-

2,147

-

$83.019

-

-

Overview

Unlock the potential of your next project with the STM32L151V8H6A microcontroller by STMicroelectronics. Crafted with precision and innovation, this cutting-edge device offers unparalleled performance and reliability. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller boasts advanced features such as DAC and ADC channels, DMA capabilities, and PWM channels. With its compact size, low power consumption, and high clock frequency, the STM32L151V8H6A is designed to exceed expectations and deliver exceptional value to customers seeking top-of-the-line microcontroller solutions. Elevate your designs with the STM32L151V8H6A and experience the difference that quality craftsmanship can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microcontroller onto PCBs, reducing assembly time and cost.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in powering the microcontroller and connecting with different components.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the PCB, optimizing design layout.

Bit Size: 32

32-bit architecture provides high processing power, suitable for handling complex tasks and calculations efficiently.

DAC Channels: YES

Digital-to-Analog Converter (DAC) channels enable the microcontroller to generate analog voltage signals, expanding its functionality in controlling analog devices.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options, enabling interfacing with a wide range of external peripherals and sensors.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch enhances PCB space utilization and facilitates high-density mounting, suitable for compact designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables power-efficient operation and compatibility with various power sources, extending the applicability of the microcontroller.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows the microcontroller to function in extreme cold temperatures, enhancing its versatility for diverse environments.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels enable the microcontroller to read analog signals from external sensors, enhancing its ability to interface with the physical world.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency by enabling peripheral devices to access memory without CPU intervention, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, reducing signal interference and improving overall signal integrity.

Maximum Seated Height: 0.6 mm

Low maximum seated height minimizes the overall profile of the microcontroller on the PCB, ideal for slim and compact device designs.

Width: 7 mm

Compact width dimension contributes to space-saving PCB layouts and allows for integration into small form factor devices.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency supports fast and responsive operation, ensuring efficient execution of computations and real-time tasks.

Length: 7 mm

Short length dimension aids in compact PCB design and efficient use of space within electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding environments with wide temperature variations, suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture enhances processing efficiency and speed, making the microcontroller suitable for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and ensures reliable electrical connections, simplifying the assembly process.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage simplifies power management and compatibility with common power sources, ensuring consistent performance.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of output signals, beneficial for applications requiring accurate voltage or current control.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and easy firmware updates, ensuring adaptability to changing requirements and bug fixes.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact PCB layout, enhancing design flexibility and space efficiency.

Speed: 32 rpm

High speed of 32 revolutions per minute (rpm) indicates the microcontroller's fast processing capabilities, suitable for time-sensitive applications.

No. of I/O Lines: 83

A high number of I/O lines provide extensive connectivity options and versatile interfacing capabilities, allowing the microcontroller to communicate with multiple external devices.

Technical Specifications

Microcontrollers STM32L151V8H6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L151V8H6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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