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STM32L151UCY6DTR

STMicroelectronics

STM32L151UCY6DTR by STMicroelectronics

STM32L151UCY6DTR by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words, 32768 RAM bytes, and 21-Ch 12-Bit ADC channels. It operates at a max clock frequency of 24 MHz and has various peripherals like PWM(4), USART(3), and USB for industrial applications requiring low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,571 parts In-Stock

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Anansix

USA . 2,252 parts In-Stock

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2,252

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Digiode

USA . 1,642 parts In-Stock

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1,642

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Vigor

Singapore . 5,417 parts In-Stock

1+ parts

$3.530

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-

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5,417

$3.530

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AZTECH Wire

Italy . 1,101 parts In-Stock

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$18.100

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$18.100

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Microchip USA

USA . 4,450 parts In-Stock

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$29.484

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4,450

$29.484

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IDEA Electronic Components Group

UK . 748 parts In-Stock

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$68.835

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$61.952

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748

$68.835

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$61.952

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Component Stockers USA

USA . 1,196 parts In-Stock

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$69.760

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$69.760

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MKK Technologies

India . 1,214 parts In-Stock

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$129.440

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$129.440

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DigiPath Technology Company

USA . 1,214 parts In-Stock

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$129.440

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$129.440

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 4,047 parts In-Stock

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Parana Technologies

USA . 592 parts In-Stock

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$82.303

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Overview

Get ready to take your designs to the next level with the STM32L151UCY6DTR microcontroller from STMicroelectronics. Known for their top-quality products, STMicroelectronics delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value with its advanced features and reliable performance. Whether you're designing IoT devices, consumer electronics, or industrial equipment, the STM32L151UCY6DTR is the perfect choice to bring your ideas to life. Elevate your projects with the power and efficiency of STMicroelectronics microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Allows for easy and convenient mounting on a PCB.

Maximum Supply Voltage: 3.6 V

Can handle a higher supply voltage which provides flexibility in power supply options.

Bit Size: 32

Provides a good balance between computational power and efficiency.

DAC Channels: YES Carried out by printers

Having DAC channels allows for accurate analog output signals.

Power Supplies (V): 1.8/3.3

Supports multiple power supply options for different applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density packaging on a PCB.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperature environments, enhancing its versatility.

ADC Channels: YES

Allows for accurate conversion of analog signals to digital data.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency.

Maximum Clock Frequency: 24 MHz

Provides fast processing speed suitable for various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances performance and efficiency of the microcontroller.

Technology: CMOS

Uses CMOS technology for low power consumption and high-speed operation.

Analog To Digital Convertors: 21-Ch 12-Bit

Offers a high number of ADC channels for precise digital conversion of analog signals.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(8), USART(3), USB

The multiple connectivity options facilitate communication with other devices.

No. of I/O Lines: 51

Plenty of I/O lines for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers STM32L151UCY6DTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B63

Length:

4.164 mm

No. of I/O Lines:

51

No. of Terminals:

63

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA63,7X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.228 mm

Peripheral IC Type:

Data EEPROM Size:

8K

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(8), USART(3), USB

Peripherals:

COMPARATOR(2), CRC, DMA(12), POR, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L151UCY6DTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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