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STM32L151RDY6TR

STMicroelectronics

STM32L151RDY6TR by STMicroelectronics

STM32L151RDY6TR by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 24 MHz. It has 64 terminals and operates at temperatures ranging from -40 to 85 °C. This microcontroller is commonly used in industrial applications due to its low power consumption and high performance capabilities.

Median Price

$3.765

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 118,960 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$3.290

118,960

-

-

-

$3.290

Chip1Stop

Japan . 118,960 parts In-Stock

1+ parts

-

100+ parts

$4.240

1k+ parts

$3.660

10k+ parts

$3.270

118,960

-

$4.240

$3.660

$3.270

Avnet

USA . 9,000 parts In-Stock

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-

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9,000

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.221

100+ parts

-

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10

$5.221

-

-

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Rapid Electronics

USA . 118,960 parts In-Stock

1+ parts

-

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118,960

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Sensible Micro Corp

USA . 11,776 parts In-Stock

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11,776

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Vyrian

USA . 8,281 parts In-Stock

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8,281

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Digiode

USA . 1,238 parts In-Stock

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1,238

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Anansix

USA . 1,208 parts In-Stock

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1,208

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SPM Sales

USA . 695 parts In-Stock

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695

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Prism Electronics

USA . 245 parts In-Stock

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245

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Distributors (Availability)

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Semicontronic

India . 81,983 parts In-Stock

1+ parts

$2.800

100+ parts

$2.730

1k+ parts

$2.716

10k+ parts

-

81,983

$2.800

$2.730

$2.716

-

Ampacity Inc.

Singapore . 81,971 parts In-Stock

1+ parts

$2.800

100+ parts

-

1k+ parts

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10k+ parts

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81,971

$2.800

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Continental Prestige Electronics

USA . 2,873 parts In-Stock

1+ parts

$5.221

100+ parts

-

1k+ parts

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10k+ parts

$5.116

2,873

$5.221

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$5.116

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$6.091

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244

$6.091

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Vigor

Singapore . 2,753 parts In-Stock

1+ parts

$7.620

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2,753

$7.620

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AZTECH Wire

Italy . 593 parts In-Stock

1+ parts

$10.610

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593

$10.610

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Microchip USA

USA . 4,564 parts In-Stock

1+ parts

$14.618

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4,564

$14.618

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IDEA Electronic Components Group

UK . 1,084 parts In-Stock

1+ parts

$28.044

100+ parts

-

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$25.240

10k+ parts

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1,084

$28.044

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$25.240

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Aztec Data Supply Inc.

USA . 219 parts In-Stock

1+ parts

$32.570

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219

$32.570

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MKK Technologies

India . 1,645 parts In-Stock

1+ parts

$52.736

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1,645

$52.736

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DigiPath Technology Company

USA . 1,645 parts In-Stock

1+ parts

$52.736

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1,645

$52.736

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Component Stockers USA

USA . 124,407 parts In-Stock

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124,407

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iodParts Technologies Inc.

India . 121,960 parts In-Stock

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121,960

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RC Electronics

USA . 24,000 parts In-Stock

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24,000

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Kepictronics

USA . 18,800 parts In-Stock

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18,800

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 1,939 parts In-Stock

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1,939

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Argo Parts USA

USA . 1,396 parts In-Stock

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1,396

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Parana Technologies

USA . 1,354 parts In-Stock

1+ parts

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100+ parts

$33.531

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1,354

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$33.531

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Perfect Parts

USA . 274 parts In-Stock

1+ parts

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274

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Overview

Discover the STM32L151RDY6TR by STMicroelectronics, a high-quality microcontroller that offers exceptional value and benefits to customers. With its advanced technology and reliable performance, this microcontroller is perfect for a wide range of applications. Whether you're designing smart appliances, industrial control systems, or IoT devices, the STM32L151RDY6TR delivers outstanding power efficiency and versatility. Trust in STMicroelectronics, a leading manufacturer known for their commitment to excellence and innovation. Upgrade your projects with the STM32L151RDY6TR and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microcontroller's plastic/epoxy package body material ensures durability and protection for long-term usage, making it an excellent choice for high-performance applications.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily integrated into circuit boards, offering convenience and efficient assembly processes, making it an ideal choice for mass production.

Maximum Supply Voltage: 3.6 V

This microcontroller can handle a maximum supply voltage of 3.6 V, providing flexibility and compatibility with various power sources, making it suitable for a wide range of electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape of this microcontroller allows for easy placement and secure fitting within electronic systems, ensuring optimized space utilization and enhancing overall design efficiency.

Bit Size: 32

With a bit size of 32, this microcontroller offers substantial processing power and enables the execution of complex tasks, making it an excellent choice for applications that require high-speed data processing and multitasking capabilities.

DAC Channels: YES

The inclusion of DAC (Digital-to-Analog Converter) channels in this microcontroller allows for efficient conversion of digital signals into analog outputs, making it an ideal choice for applications requiring precise analog control or audio processing.

Power Supplies (V): 2/3.3

Supporting multiple power supply options at 2 V and 3.3 V ensures flexibility and compatibility with a wide range of operational environments, making this microcontroller suitable for diverse applications.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample interface options for connecting external devices or components, facilitating seamless integration into various systems and expanding versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables compact designs and allows for efficient heat dissipation, making this microcontroller an excellent choice for space-constrained applications requiring enhanced thermal management.

Minimum Supply Voltage: 1.8 V

This microcontroller can operate at a minimum supply voltage of 1.8 V, ensuring compatibility with low power settings and enabling energy-efficient designs, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand higher temperatures without compromising performance, making it suitable for applications in demanding industrial environments.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers improved performance, enhanced power efficiency, and comprehensive architecture, making this microcontroller an excellent choice for demanding embedded systems or real-time applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can operate reliably in extremely cold environments, making it suitable for outdoor or automotive applications in harsh climates.

Terminal Finish: TIN

The use of tin terminal finish provides corrosion resistance and solderability, ensuring a reliable connection and longevity, making this microcontroller a reliable choice for long-lasting electronic designs.

ADC Channels: YES

The availability of ADC (Analog-to-Digital Converter) channels allows this microcontroller to accurately convert analog signals into digital data, making it suitable for applications involving sensor interfacing or data acquisition.

DMA Channels: YES

The presence of DMA (Direct Memory Access) channels enables efficient data transfer without CPU intervention, enhancing system performance and enabling seamless handling of large data streams, making this microcontroller suitable for high-speed data processing applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and convenient soldering, simplifying the assembly process and enabling streamlined integration, making this microcontroller an ideal choice for efficient production.

ROM Words: 393216

With a ROM capacity of 393,216 words, this microcontroller provides ample space to store program instructions, allowing for the implementation of complex algorithms and accommodating extensive software requirements, making it suitable for demanding applications.

Maximum Seated Height: 0.6 mm

The microcontroller's low maximum seated height of 0.6 mm ensures compatibility with slim and compact designs, facilitating space-saving layouts and making it useful for portable or miniaturized electronic devices.

Width: 4.539 mm

With a compact width of 4.539 mm, this microcontroller offers flexibility in PCB layout and allows for efficient use of board space, making it suitable for compact electronic systems or those with strict layout constraints.

Maximum Clock Frequency: 24 MHz

Supporting a maximum clock frequency of 24 MHz, this microcontroller enables fast and efficient data processing, making it a favorable choice for applications that require real-time responsiveness and high-speed computations.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller's capability to withstand a maximum time of 30 seconds at peak reflow temperature ensures proper solder joint formation during assembly, enhancing reliability and facilitating smooth production processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can endure the high temperatures of the soldering process, ensuring reliable solder connections and facilitating successful manufacturing.

Length: 4.911 mm

The microcontroller's length of 4.911 mm provides a compact form factor, allowing for efficient space utilization in electronic designs, making it suitable for miniaturized applications or those with size restrictions.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller can withstand demanding operating conditions, including high temperatures, humidity, and vibration, making it reliable and robust for use in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computer) microcontroller, this product offers streamlined instruction execution and improved performance efficiency, making it an excellent choice for applications that require optimized code execution.

RAM Bytes: 49152

With a RAM capacity of 49,152 bytes, this microcontroller offers ample working memory for data storage and efficient execution of programs, allowing for complex computations and multitasking, making it suitable for memory-intensive applications.

Technology: CMOS

Utilizing CMOS (Complementary Metal-Oxide-Semiconductor) technology, this microcontroller offers low power consumption, high noise immunity, and improved reliability, making it a preferred choice for energy-efficient and high-performance electronic designs.

Terminal Form: BALL

The ball terminal form facilitates easier integration into ball-grid array (BGA) packages, offering improved electrical and thermal characteristics, making this microcontroller suitable for applications requiring high-density interconnections and optimized heat dissipation.

Maximum Supply Current: 12.3 mA

With a maximum supply current of 12.3 mA, this microcontroller ensures efficient power consumption while maintaining reliable performance, making it suitable for battery-powered or energy-conscious applications.

Nominal Supply Voltage: 3.3 V

Supporting a nominal supply voltage of 3.3 V, this microcontroller offers compatibility with standard voltage levels, ensuring easy integration and reducing the need for additional voltage regulation, making it convenient for various electronic systems.

PWM Channels: YES

With PWM (Pulse Width Modulation) channels available, this microcontroller enables precise control of power output or motor speed, making it an ideal choice for applications that require accurate and adjustable analog signal generation.

ROM Programmability: FLASH

The microcontroller's flash programmability allows for easy and flexible programming of firmware and software updates, ensuring adaptability and future-proofing, making it suitable for applications that require frequent updates or customization.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, this microcontroller provides a fine pitch layout option, allowing for compact and high-density circuit designs, making it suitable for space-constrained electronic systems.

Speed: 32 rpm

The speed of 32 revolutions per minute (rpm) indicates the rotation speed of a motor or a mechanical component driven by this microcontroller, making it appropriate for applications requiring controlled rotational movement.

No. of I/O Lines: 51

With 51 I/O (Input/Output) lines, this microcontroller offers ample interface options for connecting peripheral devices or external components, facilitating versatile system configurations and making it suitable for applications with numerous external connections.

Technical Specifications

Microcontrollers STM32L151RDY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e3

Length:

4.911 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.539 mm

Peripheral IC Type:

Trade Compliance

STM32L151RDY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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