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STM32L151RDT7

STMicroelectronics

STM32L151RDT7 by STMicroelectronics

STM32L151RDT7 microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 24 MHz clock frequency. With integrated ADC, DAC, and PWM channels, it's ideal for low-power industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$8.890

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 148 parts In-Stock

1+ parts

-

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-

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$8.890

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148

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$8.890

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,893 parts In-Stock

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3,893

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Anansix

USA . 2,889 parts In-Stock

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2,889

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Digiode

USA . 1,539 parts In-Stock

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1,539

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Distributors (Availability)

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Vigor

Singapore . 1,075 parts In-Stock

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$4.830

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-

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1,075

$4.830

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Microchip USA

USA . 3,079 parts In-Stock

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$16.230

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-

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3,079

$16.230

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AZTECH Wire

Italy . 898 parts In-Stock

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$20.280

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898

$20.280

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IDEA Electronic Components Group

UK . 1,009 parts In-Stock

1+ parts

$33.985

100+ parts

-

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$30.586

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-

1,009

$33.985

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$30.586

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MKK Technologies

India . 2,105 parts In-Stock

1+ parts

$63.906

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2,105

$63.906

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DigiPath Technology Company

USA . 2,105 parts In-Stock

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$63.906

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2,105

$63.906

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

USA . 2,137 parts In-Stock

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2,137

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Parana Technologies

USA . 557 parts In-Stock

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$40.634

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557

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$40.634

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Overview

Unlock the potential of your next project with the STM32L151RDT7 microcontroller from STMicroelectronics. Renowned for their exceptional quality and innovation, STMicroelectronics delivers a powerful solution designed for low-power applications, ideal for IoT devices, wearables, and industrial automation. Experience unmatched performance, versatility, and reliability, all packaged in a compact, energy-efficient design that enhances your product's value and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and is cost-effective, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and more efficient placement on PCBs, enhancing design flexibility.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate within commonly used voltage ranges for low-power applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and aids in thermal management.

Bit Size: 32

A 32-bit architecture allows for higher processing power and better performance in complex applications.

DAC Channels: YES

Having DAC channels enables the microcontroller to produce analog signals, enhancing its functionality for applications such as audio and signal generation.

No. of Terminals: 64

With 64 terminals, this microcontroller can support multiple peripherals and communication interfaces, making it versatile for various projects.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design facilitates compact device designs and improved thermal performance.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V ensures compatibility with low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

Operating at a maximum temperature of 105 °C allows the microcontroller to function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C makes this microcontroller suitable for extreme temperature applications, such as industrial settings.

ADC Channels: YES

ADC channels enable the microcontroller to read analog inputs, broadening its application in sensor interfacing.

DMA Channels: YES

With DMA channels, the microcontroller can perform data transfers efficiently, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positions allow for easier access and soldering during PCB assembly.

ROM Words: 393216

The large ROM capacity of 393216 words provides ample space for program code, enabling sophisticated applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a low profile, which is advantageous for compact designs.

Width: 10 mm

With a width of 10 mm, it's suitable for space-constrained designs in modern electronics.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz ensures sufficient processing speed for many applications, from control systems to data processing.

Length: 10 mm

At 10 mm in length, this microcontroller fits well into various compact applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies suitability for long-term reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution, leading to performance gains in embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller ideal for battery-operated applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering options, enhancing the robustness of the product in manufacturing.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V balances efficiency and performance, ideal for many modern microcontroller applications.

PWM Channels: YES

PWM channels allow for precise control of analog devices, such as motors and LEDs, enhancing functionality.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and flexibility in application development.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density mounting, which is essential in compact modern electronics.

Speed: 32 rpm

A speed rating of 32 rpm indicates the microcontroller's responsiveness in control applications.

No. of I/O Lines: 51

Having 51 I/O lines allows for extensive interfacing capabilities with various sensors and actuators, making it highly versatile.

Technical Specifications

Microcontrollers STM32L151RDT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L151RDT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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