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STM32L151RBT7ATR

STMicroelectronics

STM32L151RBT7ATR by STMicroelectronics

STM32L151RBT7ATR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 51 I/O lines. With industrial-grade temperature tolerance (-40 °C to 105 °C), it's ideal for low-power applications. Its integrated DAC, ADC, and PWM channels enhance versatility in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,961 parts In-Stock

1+ parts

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6,961

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Digiode

USA . 2,488 parts In-Stock

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2,488

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Anansix

USA . 1,614 parts In-Stock

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1,614

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,328 parts In-Stock

1+ parts

$3.580

100+ parts

-

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1,328

$3.580

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AZTECH Wire

Italy . 524 parts In-Stock

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$20.190

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524

$20.190

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Microchip USA

USA . 2,838 parts In-Stock

1+ parts

$27.950

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2,838

$27.950

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

1+ parts

$55.614

100+ parts

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$50.053

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1,096

$55.614

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$50.053

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Component Stockers USA

USA . 1,798 parts In-Stock

1+ parts

$62.200

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1,798

$62.200

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MKK Technologies

India . 1,416 parts In-Stock

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$104.578

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1,416

$104.578

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DigiPath Technology Company

USA . 1,416 parts In-Stock

1+ parts

$104.578

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1,416

$104.578

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Corphita

USA . 2,610 parts In-Stock

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2,610

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Parana Technologies

USA . 1,992 parts In-Stock

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$66.495

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1,992

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$66.495

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Overview

Unlock limitless possibilities with the STM32L151RBT7ATR microcontroller by STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for versatility and endurance, this 32-bit marvel excels in power-sensitive applications, ensuring optimal performance from industrial automation to wearable tech. Experience superior efficiency, robust connectivity, and seamless integration that drives innovation while reducing energy consumption. Elevate your projects with a trusted partner—STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability under various environmental conditions, making the microcontroller a suitable choice for industrial applications.

Surface Mount: YES

Surface mount technology facilitates compact design and allows for efficient use of PCB space, which is essential in modern electronic devices.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with a wide variety of sensors and peripheral components available in the market.

Package Shape: SQUARE

The square shape aids in efficient layout on PCBs, making soldering and manufacturing processes simpler.

Bit Size: 32

A 32-bit architecture allows for more robust processing capabilities, essential for handling complex tasks and operations.

DAC Channels: YES

Incorporating DAC channels enables high-quality analog signal output, making it suitable for audio applications and precise control systems.

No. of Terminals: 64

With 64 terminals, this microcontroller can interface with numerous peripherals, enhancing its versatility for various projects.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for space-constrained designs and offers excellent thermal performance.

Minimum Supply Voltage: 1.8 V

A lower minimum operating voltage allows for energy-efficient designs, making it a great choice for battery-powered devices.

Maximum Operating Temperature: 105 °C

A high maximum temperature rating ensures reliability in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures makes this microcontroller appropriate for outdoor and extreme condition applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to directly interface with sensors, enabling digital processing of analog signals.

DMA Channels: YES

DMA channels enhance performance by allowing data transfers without CPU intervention, improving overall processing efficiency.

Terminal Position: QUAD

Quad terminal positioning facilitates easier surface mounting and improves connectivity options on the PCB.

Maximum Seated Height: 1.6 mm

The low profile design allows for denser packing of components, which is ideal for compact electronic devices.

Width: 10 mm

A standardized width fits well with common PCB designs, promoting ease of integration.

Maximum Clock Frequency: 32 MHz

High clock frequency provides the processing power necessary for demanding applications, ensuring quick data handling.

Length: 10 mm

Standardized length contributes to ease of production and ensures compatibility with existing hardware designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates suitability for harsh usage conditions, making it ideal for factory applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution, improving performance and responsiveness in applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it a reliable choice for various electronics.

Terminal Form: GULL WING

Gull wing terminals provide a strong mechanical connection and ease of soldering, enhancing assembly reliability.

Nominal Supply Voltage: 3 V

A nominal voltage of 3V supports a wide variety of power supply configurations, making it flexible for designers.

PWM Channels: YES

PWM channels enable precise control over motors and other devices, enhancing its utility in automation and robotics.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, extending the product's usability over its lifespan.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for designs with high density, supporting modern compact circuit board layouts.

Speed: 32 rpm

Operating at 32 rpm indicates that this microcontroller can handle rotational applications, suitable for motors and robotics.

No. of I/O Lines: 51

A higher number of I/O lines enables extensive interfacing capabilities with other components, providing flexibility for various applications.

Technical Specifications

Microcontrollers STM32L151RBT7ATR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L151RBT7ATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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