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STM32L151RBT7A

STMicroelectronics

STM32L151RBT7A by STMicroelectronics

STM32L151RBT7A microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 51 I/O lines. With industrial-grade temperature tolerance (-40 °C to 105 °C), it's ideal for low-power applications. Its integrated DAC, ADC, and PWM channels enhance versatility in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,946 parts In-Stock

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3,946

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Digiode

USA . 3,901 parts In-Stock

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3,901

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Anansix

USA . 2,047 parts In-Stock

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2,047

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Distributors (Availability)

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Vigor

Singapore . 1,950 parts In-Stock

1+ parts

$3.580

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1,950

$3.580

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AZTECH Wire

Italy . 386 parts In-Stock

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$18.270

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386

$18.270

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Microchip USA

USA . 2,100 parts In-Stock

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$27.950

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$27.950

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IDEA Electronic Components Group

UK . 1,334 parts In-Stock

1+ parts

$46.813

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$42.132

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1,334

$46.813

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$42.132

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MKK Technologies

India . 2,339 parts In-Stock

1+ parts

$88.029

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2,339

$88.029

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DigiPath Technology Company

USA . 2,339 parts In-Stock

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$88.029

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2,339

$88.029

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QUARKTWIN TECHNOLOGY LTD

USA . 24,186 parts In-Stock

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Parana Technologies

USA . 1,610 parts In-Stock

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$55.972

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1,610

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$55.972

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Corphita

USA . 86 parts In-Stock

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Overview

Elevate your projects with the STM32L151RBT7A microcontroller by STMicroelectronics, a leader in innovation and quality. This versatile 32-bit powerhouse is designed for optimal performance in industrial applications, offering low power consumption and robust features like ADC, DAC, and PWM channels. Experience the reliability and unparalleled support of STMicroelectronics as you unlock endless possibilities for smart devices, IoT solutions, and beyond!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy offers durability and insulation, making the microcontroller suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient usage of PCB space, enhancing overall system integration.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, providing flexibility in design.

Package Shape: SQUARE

The square package shape aids in uniform power distribution and simplifies layout design, promoting reliable performance.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and larger data sets efficiently.

DAC Channels: YES

Inclusion of DAC channels allows for analog signal output, making it ideal for applications requiring sound or variable control.

No. of Terminals: 64

A higher number of terminals provides extensive connectivity options, enhancing the microcontroller's versatility in applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack design with low profile and fine pitch ensures easy integration into compact designs, further optimizing space.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage allows it to operate in low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

This high temperature tolerance makes the microcontroller suitable for industrial applications where heat is a concern.

Minimum Operating Temperature: -40 °C

The low operating temperature range allows functionality in extreme conditions, making it reliable for outdoor and harsh environments.

ADC Channels: YES

Having ADC channels means it can convert analog signals to digital, allowing for a wide range of sensor applications.

DMA Channels: YES

DMA channels enhance data handling capabilities, allowing efficient data transfers without CPU intervention, maximizing processing power.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient connectivity, ensuring stable communication and minimizing interference.

Maximum Seated Height: 1.6 mm

The low seated height is ideal for applications requiring compactness and low profile designs, enhancing compatibility with small devices.

Width: 10 mm

A compact width contributes to space-saving designs, making it suitable for modern electronic applications that prioritize size.

Maximum Clock Frequency: 32 MHz

The 32 MHz clock frequency allows for decent processing power, enabling the microcontroller to execute tasks quickly and efficiently.

Length: 10 mm

A length of 10 mm supports compact designs, allowing for efficient arrangement in small or constrained spaces.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this microcontroller is designed to operate reliably under challenging environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance with reduced instruction cycles, resulting in faster processing and efficient energy consumption.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this microcontroller ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals promote easy soldering and provide excellent electrical connections, ensuring robust assembly quality.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V strikes a balance between power efficiency and performance, making it versatile for various applications.

PWM Channels: YES

PWM channels facilitate precise control of motors and other devices, making this microcontroller suitable for automation applications.

ROM Programmability: FLASH

Flash programmability allows for easy software updates and reprogramming, making the microcontroller adaptable for evolving needs.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables dense configurations on PCBs, providing better space utilization for advanced circuits.

Speed: 32 rpm

The maximum speed of 32 rpm indicates potential applications in low-speed actuation tasks, useful in mechatronic systems.

No. of I/O Lines: 51

Having 51 I/O lines provides extensive interfacing capabilities, making the microcontroller highly adaptable for diverse applications.

Technical Specifications

Microcontrollers STM32L151RBT7A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L151RBT7A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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