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STM32L151R8H6A

STMicroelectronics

STM32L151R8H6A by STMicroelectronics

STM32L151R8H6A by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features DAC and ADC channels, PWM support, and DMA capabilities. Ideal for industrial applications requiring a temperature range of -40 to 85 °C, it offers low power consumption with a supply voltage range of 1.8-3.6 V.

Median Price

$3.223

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 609 parts In-Stock

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-

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$3.223

609

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$3.223

Distributors (In-Stock)

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Vyrian

USA . 8,702 parts In-Stock

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-

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8,702

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Digiode

USA . 4,089 parts In-Stock

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4,089

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Anansix

USA . 2,696 parts In-Stock

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2,696

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Classic Components Corporation

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$2.950

100+ parts

-

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-

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-

3,000

$2.950

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AZTECH Wire

Italy . 951 parts In-Stock

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$19.500

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-

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-

951

$19.500

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Microchip USA

USA . 6,439 parts In-Stock

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$23.035

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-

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6,439

$23.035

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IDEA Electronic Components Group

UK . 62 parts In-Stock

1+ parts

$74.304

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-

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$66.873

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-

62

$74.304

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$66.873

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MKK Technologies

India . 905 parts In-Stock

1+ parts

$139.723

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905

$139.723

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DigiPath Technology Company

USA . 905 parts In-Stock

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$139.723

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905

$139.723

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Perfect Parts

USA . 21,504 parts In-Stock

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21,504

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Lixinc

USA . 9,461 parts In-Stock

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9,461

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Component Stockers USA

USA . 4,186 parts In-Stock

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4,186

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Corphita

USA . 2,795 parts In-Stock

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2,795

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Glotronic Ltd.

UK . 2,536 parts In-Stock

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2,536

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Parana Technologies

USA . 1,135 parts In-Stock

1+ parts

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$88.842

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1,135

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$88.842

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Overview

Discover the STM32L151R8H6A by STMicroelectronics, a top-tier microcontroller designed for high-performance applications. Crafted with precision and expertise, this product from a trusted manufacturer offers unparalleled quality and reliability. With its advanced features and cutting-edge technology, this microcontroller is perfect for a wide range of applications. Unlock endless possibilities and harness the power of innovation with the STM32L151R8H6A. Experience the value, benefits, and advantages it brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can support a wide range of power sources, providing flexibility in design.

Package Shape: SQUARE

The square package shape helps in easy placement and alignment on the PCB, optimizing space utilization and layout efficiency.

Bit Size: 32

The 32-bit architecture enhances the processing power and efficiency of the microcontroller, enabling it to handle complex tasks effectively.

DAC Channels: YES

The presence of DAC channels allows for accurate and precise analog output generation, essential for many applications that require analog signal processing.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external devices, sensors, and peripherals, making the microcontroller versatile in terms of connectivity.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style ensures high-density mounting, improved thermal performance, and space-saving characteristics, ideal for compact electronic designs.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage of 1.8 V allows for low-power operation, making the microcontroller suitable for battery-powered applications or energy-efficient designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance in harsh environmental conditions or industrial applications that may experience elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables the microcontroller to operate in cold environments without compromising its functionality or reliability.

ADC Channels: YES

The availability of ADC channels allows for accurate analog-to-digital conversion, essential for reading and processing real-world data from sensors or external sources.

DMA Channels: YES

Having DMA channels enables efficient data transfer between peripherals and memory without CPU intervention, improving system performance and reducing processing overhead.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and soldering, enhancing the overall assembly process and ensuring proper electrical connections.

Maximum Seated Height: 1.2 mm

The slim profile with a maximum seated height of 1.2 mm allows for compact and low-profile designs, suitable for applications with space constraints.

Width: 5 mm

The narrow width of 5 mm contributes to the overall compactness of the microcontroller package, enabling efficient use of PCB real estate and streamlined circuit design.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz ensures fast and responsive operation, making the microcontroller suitable for applications that require real-time processing or high-speed data handling.

Length: 5 mm

The short length of 5 mm complements the square package shape, allowing for uniformity in dimensions and facilitating easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance and longevity in demanding industrial environments, offering robustness and resilience to temperature fluctuations and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral integration, it offers efficient processing capabilities and versatile functionality for a wide range of applications, including embedded systems and IoT devices.

Technology: CMOS

The CMOS technology used in the microcontroller provides low power consumption, high noise immunity, and compatibility with modern semiconductor processes, ensuring energy-efficient and reliable operation.

Terminal Form: BALL

The ball terminal form offers precise and reliable electrical connections, ensuring secure solder joints and improved mechanical strength, vital for maintaining signal integrity and long-term durability.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides stable and consistent power delivery to the microcontroller, ensuring reliable operation and preventing voltage fluctuations that may affect performance.

PWM Channels: YES

The availability of PWM channels allows for accurate control of analog signals, making it ideal for applications that require precise modulation of power, voltage, or frequency.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in firmware development and updates, enabling customization and modification of the microcontroller's code without the need for external programming devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and fine-pitch assembly, enabling compact and space-efficient PCB designs with improved signal integrity and thermal performance.

Speed: 32 rpm

With a speed rating of 32 rpm, the microcontroller can process tasks efficiently and respond quickly to input signals, making it suitable for applications that require high-speed operation or real-time control.

No. of I/O Lines: 50

Having 50 I/O lines provides extensive input and output capabilities, allowing for versatile connectivity and interface options with external devices and peripherals, facilitating diverse application requirements.

Technical Specifications

Microcontrollers STM32L151R8H6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

50

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32L151R8H6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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