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STM32L151R6T6

STMicroelectronics

STM32L151R6T6 by STMicroelectronics

STM32L151R6T6 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 20-Ch 12-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring low power consumption and high performance. With various peripherals like BOD, RTC, and USB connectivity, it offers versatile solutions in compact FLATPACK package style.

Median Price

$4.160

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 297 parts In-Stock

1+ parts

$4.160

100+ parts

$3.330

1k+ parts

$3.320

10k+ parts

-

297

$4.160

$3.330

$3.320

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 700 parts In-Stock

1+ parts

$5.444

100+ parts

$2.359

1k+ parts

$2.232

10k+ parts

-

700

$5.444

$2.359

$2.232

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Digiode

USA . 4,577 parts In-Stock

1+ parts

$7.552

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-

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4,577

$7.552

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Ashlea Components Ltd

UK . 2,018 parts In-Stock

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2,018

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Vyrian

USA . 1,948 parts In-Stock

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1,948

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ACDS - Activité Composants Distribution Service

France . 700 parts In-Stock

1+ parts

-

100+ parts

-

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700

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Dan-Mar Components

USA . 700 parts In-Stock

1+ parts

-

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700

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Anansix

USA . 282 parts In-Stock

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282

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Distributors (Availability)

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Vigor

Singapore . 66 parts In-Stock

1+ parts

$5.170

100+ parts

-

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66

$5.170

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Corphita

USA . 1,252 parts In-Stock

1+ parts

$7.155

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-

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1,252

$7.155

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Microchip USA

USA . 2,678 parts In-Stock

1+ parts

$18.788

100+ parts

-

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2,678

$18.788

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IDEA Electronic Components Group

UK . 2,046 parts In-Stock

1+ parts

$49.379

100+ parts

-

1k+ parts

$44.441

10k+ parts

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2,046

$49.379

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$44.441

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MKK Technologies

India . 1,312 parts In-Stock

1+ parts

$92.854

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1,312

$92.854

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DigiPath Technology Company

USA . 1,312 parts In-Stock

1+ parts

$92.854

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1,312

$92.854

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Perfect Parts

USA . 1,832 parts In-Stock

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1,832

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Parana Technologies

USA . 255 parts In-Stock

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$59.040

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255

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$59.040

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Cyclops Electronics Ltd (Excess)

UK . 25 parts In-Stock

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25

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Overview

Experience the cutting-edge technology of the STM32L151R6T6 microcontroller by STMicroelectronics, a top-tier manufacturer renowned for its quality and reliability. This versatile device offers a wide range of applications in various industries, providing customers with exceptional value and benefits. With a powerful 32-bit Cortex-M3 CPU, advanced peripherals, low power consumption, and industrial-grade temperature capabilities, the STM32L151R6T6 delivers superior performance and efficiency. Upgrade your projects today with this innovative solution that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and protection for the microcontroller, making it durable and reliable in various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, enabling compact designs and saving space in electronic devices.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 32

A 32-bit architecture provides higher processing power and performance, making the microcontroller suitable for demanding tasks and applications.

DAC Channels: YES

Digital-to-Analog Converter channels allow for precise control of analog signals, enabling accurate output voltage generation for various control and communication tasks.

Power Supplies (V): 2/3.3

Support for multiple power supply options ensures compatibility with different voltage requirements, offering flexibility in system design and integration.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for external devices and sensors, enhancing the microcontroller's capability to interface with a variety of peripherals.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to accurately sample and convert analog signals into digital data, making it suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory without CPU intervention, enhancing system performance and enabling multitasking capability.

ROM Words: 32768

With 32768 words of Read-Only Memory, the microcontroller has sufficient program memory for storing firmware and code, supporting complex algorithms and functionalities.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32 MHz provides fast processing speed and responsiveness, making the microcontroller suitable for real-time applications and high-speed data processing.

RAM Bytes: 10240

Having 10240 bytes of Random Access Memory allows for efficient data storage and manipulation, enabling the microcontroller to handle complex computations and data processing tasks.

Analog To Digital Convertors: 20-Ch 12-Bit

Having 20 Analog-to-Digital Converter channels with 12-bit resolution provides high-precision analog signal sampling and conversion capabilities, making the microcontroller suitable for accurate sensor data acquisition.

Connectivity: I2C(2), SPI(2), USART(3), USB

Support for various communication interfaces such as I2C, SPI, USART, and USB enables seamless connectivity with external devices and peripherals, allowing for versatile integration and communication options.

Technical Specifications

Microcontrollers STM32L151R6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L151R6T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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