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STM32L151QDH6TR

STMicroelectronics

STM32L151QDH6TR by STMicroelectronics

STM32L151QDH6TR by STMicroelectronics is a 32-bit microcontroller with 132 terminals, operating at up to 24 MHz. It features DAC and ADC channels, DMA support, and 109 I/O lines. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,825 parts In-Stock

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12,825

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Digiode

USA . 4,518 parts In-Stock

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4,518

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Anansix

USA . 1,952 parts In-Stock

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1,952

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ComSIT Distribution GmbH

Germany . 109 parts In-Stock

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109

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Distributors (Availability)

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$6.370

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-

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3,000

$6.370

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AZTECH Wire

Italy . 451 parts In-Stock

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$12.330

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451

$12.330

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Microchip USA

USA . 4,669 parts In-Stock

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$21.406

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4,669

$21.406

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IDEA Electronic Components Group

UK . 1,080 parts In-Stock

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$43.963

100+ parts

-

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$39.567

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1,080

$43.963

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$39.567

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MKK Technologies

India . 6 parts In-Stock

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$82.670

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6

$82.670

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DigiPath Technology Company

USA . 6 parts In-Stock

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$82.670

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6

$82.670

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Perfect Parts

USA . 236,674 parts In-Stock

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236,674

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Futuretech Components

Singapore . 10,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,918 parts In-Stock

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7,918

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Corphita

USA . 4,277 parts In-Stock

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4,277

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Infinite Electronics LLP (Excess)

. 2,501 parts In-Stock

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2,501

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Parana Technologies

USA . 2,095 parts In-Stock

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$52.565

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2,095

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$52.565

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Overview

Unlock a world of possibilities with the STM32L151QDH6TR microcontroller from STMicroelectronics. Trust in the renowned quality of this leading manufacturer to deliver exceptional performance and reliability. Ideal for a wide range of applications, this powerful 32-bit microcontroller offers customers unmatched value, benefits, and advantages. Seamlessly integrate this product into your projects and experience the innovation and efficiency that STMicroelectronics is known for. Elevate your designs with the STM32L151QDH6TR and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuits.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options for the microcontroller.

Bit Size: 32

A higher bit size allows for advanced processing capabilities and handling of complex algorithms efficiently.

DAC Channels: YES

Integrated DAC channels enable analog signal generation, widening the range of applications for the microcontroller.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages gives flexibility in designing power-efficient systems.

No. of Terminals: 132

A higher number of terminals provide more connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The package style offers space-efficient mounting and high-density integration on circuit boards.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage allows for power-saving operation and compatibility with a wide range of power sources.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and energy efficiency for embedded applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the microcontroller can operate in extreme cold conditions as well.

Terminal Finish: NICKEL GOLD

Nickel gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for accurate analog signal conversion, enhancing sensor interfacing capabilities.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory, optimizing system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies board layout and routing of connections for easier PCB design.

ROM Words: 393216

Large ROM capacity allows for storing a significant amount of program code and data for complex applications.

Maximum Seated Height: 0.6 mm

Low profile design with minimal seated height saves space and enables compact electronic device designs.

Width: 7 mm

Compact width size allows for efficient space utilization on the circuit board.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speeds and real-time control applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the microcontroller can withstand soldering processes without damage.

Length: 7 mm

Compact length size allows for efficient space utilization on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the microcontroller can operate reliably in industrial environments with varying temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller offers high performance and efficiency for embedded control applications.

RAM Bytes: 49152

Large RAM capacity enables temporary data storage and multitasking capabilities for faster processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the microcontroller.

Terminal Form: BALL

Ball terminal form simplifies the soldering process and enhances connectivity with the circuit board.

Maximum Supply Current: 12.3 mA

Low maximum supply current consumption helps in designing energy-efficient systems with longer battery life.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

PWM channels allow for precise control of output signals, enabling applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating and reprogramming of firmware without requiring specialized tools.

Terminal Pitch: 0.5 mm

Small terminal pitch provides high-density mounting options for compact electronic device designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the microcontroller can withstand standard surface mount soldering processes.

Speed: 32 rpm

Operating speed of 32 rpm allows for efficient data processing and control in various applications.

No. of I/O Lines: 109

High number of I/O lines provide extensive interfacing capabilities with external devices and sensors for versatile applications.

Technical Specifications

Microcontrollers STM32L151QDH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B132

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

109

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L151QDH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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