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STM32L100RBT6TR

STMicroelectronics

STM32L100RBT6TR by STMicroelectronics

STM32L100RBT6TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 10240 RAM bytes, and 20-Ch 12-Bit ADC. Ideal for industrial applications, it offers a max clock frequency of 24 MHz and features peripherals like BOR, CRC, DMA(7), and USB connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 30,000 parts In-Stock

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30,000

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Distributors (In-Stock)

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Vyrian

USA . 6,094 parts In-Stock

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6,094

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Anansix

USA . 2,862 parts In-Stock

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2,862

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Digiode

USA . 278 parts In-Stock

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278

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Distributors (Availability)

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Vigor

Singapore . 1,508 parts In-Stock

1+ parts

$3.470

100+ parts

-

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1,508

$3.470

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AZTECH Wire

Italy . 286 parts In-Stock

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$15.040

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286

$15.040

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IDEA Electronic Components Group

UK . 1,793 parts In-Stock

1+ parts

$21.826

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$19.643

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1,793

$21.826

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$19.643

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Microchip USA

USA . 3,469 parts In-Stock

1+ parts

$29.464

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3,469

$29.464

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MKK Technologies

India . 2,076 parts In-Stock

1+ parts

$41.043

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2,076

$41.043

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DigiPath Technology Company

USA . 2,076 parts In-Stock

1+ parts

$41.043

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2,076

$41.043

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Component Stockers USA

USA . 1,319 parts In-Stock

1+ parts

$63.040

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1,319

$63.040

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Perfect Parts

USA . 8,960 parts In-Stock

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8,960

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Parana Technologies

USA . 1,900 parts In-Stock

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$26.096

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1,900

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$26.096

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Corphita

USA . 1,488 parts In-Stock

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1,488

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Futuretech Components

Singapore . 978 parts In-Stock

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978

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Overview

Unlock a world of possibilities with the STM32L100RBT6TR by STMicroelectronics. Crafted with precision and excellence, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, this product boasts advanced features and cutting-edge technology. Experience seamless connectivity, powerful performance, and innovative design with this versatile device. Elevate your projects and enhance your creations with the STM32L100RBT6TR - the ultimate choice for those who demand nothing but the best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Allows for a lightweight and durable package, suitable for a variety of applications.

Surface Mount: YES

Enables easy and secure installation on circuit boards, saving space and facilitating manufacturing.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply voltages, enhancing compatibility with different systems.

Package Shape: SQUARE

Square shape provides a compact design, optimizing space usage in electronic devices.

Bit Size: 32

High bit size allows for efficient data processing and handling complex algorithms.

DAC Channels: YES

Integrated digital-to-analog converters enable precise control over analog signals, expanding functionality.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers flexibility in system design and integration.

No. of Terminals: 64

Sufficient number of terminals for connecting to external components and peripherals, enhancing versatility.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for energy-efficient operation and extends battery life.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

CPU Family: CORTEX-M3

Advanced CPU family provides high-performance computing capabilities for demanding applications.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments without compromising functionality.

ADC Channels: YES

Built-in analog-to-digital converters enable the measurement and conversion of analog signals for processing.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency in handling large datasets.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and fast processing, ideal for real-time applications.

Technical Specifications

Microcontrollers STM32L100RBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(7), LCD, POR, PWM(4), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L100RBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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