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STM32L100R8T6ATR

STMicroelectronics

STM32L100R8T6ATR by STMicroelectronics

STM32L100R8T6ATR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 24 MHz clock frequency, and 51 I/O lines. It features 8 DAC channels, 16 external interrupts, and low power mode. Ideal for industrial applications requiring high performance in a compact package.

Median Price

$3.613

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$3.613

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$3.613

-

-

-

Vyrian

USA . 8,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,709

-

-

-

-

Anansix

USA . 1,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,690

-

-

-

-

Digiode

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,295

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,863 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

-

10k+ parts

-

8,863

$2.650

-

-

-

Semicontronic

India . 6,134 parts In-Stock

1+ parts

$2.650

100+ parts

$2.584

1k+ parts

$2.570

10k+ parts

-

6,134

$2.650

$2.584

$2.570

-

Vigor

Singapore . 2,940 parts In-Stock

1+ parts

$2.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,940

$2.800

-

-

-

Corohmni

South Africa . 167 parts In-Stock

1+ parts

$3.290

100+ parts

-

1k+ parts

-

10k+ parts

-

167

$3.290

-

-

-

Continental Prestige Electronics

USA . 6,777 parts In-Stock

1+ parts

$3.613

100+ parts

-

1k+ parts

-

10k+ parts

$3.541

6,777

$3.613

-

-

$3.541

Argo Parts USA

USA . 966 parts In-Stock

1+ parts

$3.613

100+ parts

-

1k+ parts

-

10k+ parts

-

966

$3.613

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.613

100+ parts

-

1k+ parts

$3.433

10k+ parts

$3.360

500

$3.613

-

$3.433

$3.360

AZTECH Wire

Italy . 75 parts In-Stock

1+ parts

$16.880

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$16.880

-

-

-

Microchip USA

USA . 3,209 parts In-Stock

1+ parts

$22.466

100+ parts

-

1k+ parts

-

10k+ parts

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3,209

$22.466

-

-

-

IDEA Electronic Components Group

UK . 17 parts In-Stock

1+ parts

$38.742

100+ parts

-

1k+ parts

$34.868

10k+ parts

-

17

$38.742

-

$34.868

-

MKK Technologies

India . 1,596 parts In-Stock

1+ parts

$72.852

100+ parts

-

1k+ parts

-

10k+ parts

-

1,596

$72.852

-

-

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DigiPath Technology Company

USA . 1,596 parts In-Stock

1+ parts

$72.852

100+ parts

-

1k+ parts

-

10k+ parts

-

1,596

$72.852

-

-

-

Aztec Data Supply Inc.

USA . 1,442 parts In-Stock

1+ parts

$78.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,442

$78.300

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,138 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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28,138

-

-

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Lixinc

USA . 15,992 parts In-Stock

1+ parts

-

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15,992

-

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,000

-

-

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Corphita

USA . 1,906 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

-

1,906

-

-

-

-

Parana Technologies

USA . 1,733 parts In-Stock

1+ parts

-

100+ parts

$46.322

1k+ parts

-

10k+ parts

-

1,733

-

$46.322

-

-

Infinite Electronics LLP (Excess)

. 502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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502

-

-

-

-

Overview

Unlock the power of innovation with the STM32L100R8T6ATR microcontroller by STMicroelectronics. Designed for high performance and reliability, this cutting-edge device offers a wide range of applications in various industries. With advanced features like low power mode, PWM channels, and multiple ADC and DAC channels, this microcontroller provides unparalleled value and benefits to customers looking to take their projects to the next level. Trust in STMicroelectronics' reputation for quality and experience the advantages of the STM32L100R8T6ATR for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC

Plastic material is lightweight, durable, and cost-effective, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input options, ensuring compatibility with various power sources.

On Chip Data RAM Width: 8

Having a wide data RAM width enables efficient data processing and storage on the chip, improving performance.

Package Shape: SQUARE

Square packages typically offer better thermal performance and easier handling during PCB assembly.

Bit Size: 32

A 32-bit architecture allows for higher computational capabilities, making the product suitable for complex applications.

DAC Channels: YES

Digital-to-analog converter channels provide flexibility in interfacing with analog devices, expanding the product's application range.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options, making the product versatile in design and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch packaging styles offers space-saving and efficient PCB layout options.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables operation in low-power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand a wide range of environmental conditions, ensuring reliability.

CPU Family: CORTEX-M3

Belonging to the Cortex-M3 family indicates a high-performance and energy-efficient processor core, suitable for demanding applications.

No. of External Interrupts: 16

Having multiple external interrupts allows the product to respond quickly to external events, enhancing real-time responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in extreme cold conditions without performance degradation.

ADC Channels: YES

Analog-to-digital converter channels enable accurate conversion of analog signals, making the product suitable for sensor interfacing and data acquisition.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and robust mechanical connections, ensuring reliable electrical contact.

ROM Words: 65536

With a large ROM capacity, the product can store a significant amount of program code, accommodating complex algorithms and firmware.

Maximum Seated Height: 1.6 mm

The low seated height of the package saves space in the overall product design, especially in compact electronic devices.

RAM Words: 4096

Having a sufficient RAM capacity allows for effective data buffering and manipulation, enhancing the product's performance in multitasking scenarios.

Width: 10 mm

The compact width dimension of the product enables it to fit into space-constrained designs, making it suitable for miniaturized applications.

Boundary Scan: YES

Boundary scan capability facilitates efficient testing and debugging during product development and manufacturing processes.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency enables fast data processing and execution speed, making the product suitable for real-time applications.

Length: 10 mm

The product's compact length dimension contributes to its overall small form factor, ideal for portable and space-limited designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range operation, the product can withstand harsh environmental conditions prevalent in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, the product offers efficient instruction execution and low power consumption, ideal for embedded system applications.

No. of Timers: 8

Multiple timer channels provide precise timing and event scheduling functionality, enhancing the product's versatility in time-critical applications.

RAM Bytes: 8192

A generous RAM size in bytes enables efficient data storage and manipulation, ensuring smooth operation in memory-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in harsh electrical environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy solderability, ensuring reliable electrical connections in the device.

Maximum Supply Current: 10.2 mA

With a low maximum supply current, the product consumes minimal power during operation, contributing to overall energy efficiency.

Nominal Supply Voltage: 3 V

Having a stable nominal supply voltage simplifies power management and ensures consistent performance under varying load conditions.

No. of DMA Channels: 7

The presence of multiple DMA channels allows for efficient data transfer and processing, reducing CPU workload and enhancing system performance.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog output signals, making the product suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability offers the flexibility to update firmware and software applications in the field, enhancing product longevity and functionality.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for high-density PCB layout, optimizing space utilization and facilitating compact product designs.

Format: FIXED POINT

Using fixed-point format for numerical representation simplifies arithmetic operations and reduces computational overhead, improving overall system efficiency.

Speed: 32 rpm

Operating at a speed of 32 rotations per minute, the product can efficiently process data and execute tasks at a moderate pace suitable for various applications.

Low Power Mode: YES

The availability of a low power mode allows the product to conserve energy during idle periods or low activity, enhancing overall energy efficiency.

On Chip Program ROM Width: 8

Having an on-chip ROM width of 8 bits enables efficient program storage and retrieval, contributing to faster boot times and streamlined operation.

No. of I/O Lines: 51

A high number of input/output lines provide ample connectivity options for external devices and peripherals, enabling versatile system integration and interfacing.

Technical Specifications

Microcontrollers STM32L100R8T6ATR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

16

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Current:

10.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L100R8T6ATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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