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STM32L100R8T6

STMicroelectronics

STM32L100R8T6 by STMicroelectronics

STM32L100R8T6 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 2 DAC and 20 ADC channels, suitable for industrial applications requiring low power consumption and high-speed processing. With various peripherals like PWM, USART, and USB connectivity options, it offers versatile solutions in compact form factor.

Median Price

$5.201

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 950 parts In-Stock

1+ parts

$7.500

100+ parts

$4.510

1k+ parts

$3.680

10k+ parts

-

950

$7.500

$4.510

$3.680

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Verical

USA . 2,416 parts In-Stock

1+ parts

-

100+ parts

$2.902

1k+ parts

$2.775

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2,416

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$2.902

$2.775

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Avnet

USA . 1,120 parts In-Stock

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1,120

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Distributors (In-Stock)

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Digiode

USA . 879 parts In-Stock

1+ parts

$6.251

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879

$6.251

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Vyrian

USA . 6,170 parts In-Stock

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6,170

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Anansix

USA . 2,488 parts In-Stock

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2,488

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Whistler Technology

UK . 400 parts In-Stock

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400

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Distributors (Availability)

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Vigor

Singapore . 1,900 parts In-Stock

1+ parts

$5.730

100+ parts

-

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1,900

$5.730

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-

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Corphita

USA . 291 parts In-Stock

1+ parts

$5.922

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-

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291

$5.922

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

1+ parts

$59.998

100+ parts

-

1k+ parts

$53.998

10k+ parts

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1,939

$59.998

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$53.998

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MKK Technologies

India . 797 parts In-Stock

1+ parts

$112.822

100+ parts

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797

$112.822

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DigiPath Technology Company

USA . 797 parts In-Stock

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$112.822

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797

$112.822

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QUARKTWIN TECHNOLOGY LTD

USA . 16,276 parts In-Stock

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16,276

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Metaverse IC Inc.

Canada . 10,806 parts In-Stock

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10,806

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RC Electronics

USA . 10,000 parts In-Stock

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Microchip USA

USA . 4,156 parts In-Stock

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Perfect Parts

USA . 3,624 parts In-Stock

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3,624

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S.R.D Solutions

India . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 813 parts In-Stock

1+ parts

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$71.736

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813

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$71.736

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GreenTree Electronics

Israel . 640 parts In-Stock

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640

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Glotronic Ltd.

UK . 397 parts In-Stock

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397

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Overview

Revolutionize your next project with the STM32L100R8T6 microcontroller from the industry leader, STMicroelectronics. Designed for efficiency and reliability, this Cortex-M3 CPU family device offers a wide range of peripherals and connectivity options, making it perfect for applications such as IoT, industrial control, and consumer electronics. With its low power consumption and high performance, the STM32L100R8T6 delivers exceptional value and benefits to customers looking for cutting-edge technology in a compact package. Upgrade your designs today with this innovative microcontroller!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and facilitating assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 32

Higher bit size allows for more complex processing and operations, suitable for advanced applications.

DAC Channels: YES

Digital-to-analog conversion capabilities enable interfacing with analog devices and sensors.

Power Supplies (V): 2/3.3

Multiple power supply options provide flexibility in voltage requirements for different components.

No. of Terminals: 64

Sufficient terminals for connecting to various peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style saves space on the PCB and ensures efficient layout design.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage reduces power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications with varying environmental conditions.

CPU Family: CORTEX-M3

Advanced CPU architecture provides high-performance processing capabilities for demanding tasks.

Minimum Operating Temperature: -40 °C

Operational in extreme cold temperatures, making it suitable for outdoor and low-temperature environments.

ADC Channels: YES

Analog-to-digital conversion capabilities enable interfacing with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency in handling large volumes of data.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection to external components on the PCB.

ROM Words: 65536

Sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact product designs.

Digital To Analog Convertors: 2-Ch 12-Bit (2)

Two-channel 12-bit DACs provide high-resolution analog output for precise control and communication with external devices.

Width: 10 mm

Compact width allows for efficient PCB layout and space-saving designs.

Data EEPROM Size: 2K

Sufficient EEPROM size for storing configuration settings and non-volatile data.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(7), LCD, POR, PWM(4), RTC, TIMER(9), WDT(2)

Wide range of peripherals enhance system capabilities and enable interfacing with various components and devices.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing and response times for real-time applications.

Length: 10 mm

Compact length allows for space-efficient product designs and PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions in the microcontroller.

RAM Bytes: 8192

Sufficient RAM size for data storage and temporary processing of information during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable electrical connections.

Analog To Digital Convertors: 20-Ch 12-Bit

Twenty-channel 12-bit ADCs provide high-resolution analog input for accurate data acquisition and processing.

Maximum Supply Current: 11 mA

Low supply current consumption for efficient power usage and extended battery life in portable devices.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and reliable operation.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals for motor control and power management.

Connectivity: I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Versatile connectivity options for interfacing with a variety of external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and modification of firmware and program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact package size and high-density PCB designs.

Speed: 32 rpm

Efficient processing speed for handling real-time tasks and data processing applications.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits provides efficient program storage and execution capabilities.

No. of I/O Lines: 51

Sufficient I/O lines for interfacing with external devices and peripherals, enabling versatile system configurations.

Technical Specifications

Microcontrollers STM32L100R8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(7), LCD, POR, PWM(4), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L100R8T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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