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STM32L083VBT6

STMicroelectronics

STM32L083VBT6 by STMicroelectronics

STM32L083VBT6 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 20480 RAM bytes, and 16-Ch 12-Bit ADC. It operates at up to 32 MHz, suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With multiple peripherals like DMA(7), PWM(5), and USB connectivity, it offers versatile functionality in a compact package.

Median Price

$5.840

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 364 parts In-Stock

1+ parts

$5.840

100+ parts

$3.590

1k+ parts

$3.460

10k+ parts

$3.300

364

$5.840

$3.590

$3.460

$3.300

DigiKey

USA . 209 parts In-Stock

1+ parts

$5.840

100+ parts

$3.801

1k+ parts

$3.450

10k+ parts

$3.271

209

$5.840

$3.801

$3.450

$3.271

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$4.961

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$4.961

-

-

-

Digiode

USA . 3,354 parts In-Stock

1+ parts

$5.263

100+ parts

-

1k+ parts

-

10k+ parts

-

3,354

$5.263

-

-

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Vyrian

USA . 5,706 parts In-Stock

1+ parts

-

100+ parts

-

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5,706

-

-

-

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Anansix

USA . 2,788 parts In-Stock

1+ parts

-

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-

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-

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2,788

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-

-

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Chip Stock

USA . 827 parts In-Stock

1+ parts

-

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-

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827

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-

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Holdelec - ElecDif-Pro

France . 200 parts In-Stock

1+ parts

-

100+ parts

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200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 223 parts In-Stock

1+ parts

$4.710

100+ parts

-

1k+ parts

-

10k+ parts

-

223

$4.710

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$4.862

100+ parts

-

1k+ parts

$4.667

10k+ parts

-

100

$4.862

-

$4.667

-

Corphita

USA . 1,096 parts In-Stock

1+ parts

$4.986

100+ parts

-

1k+ parts

-

10k+ parts

-

1,096

$4.986

-

-

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Vigor

Singapore . 1,750 parts In-Stock

1+ parts

$6.610

100+ parts

-

1k+ parts

-

10k+ parts

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1,750

$6.610

-

-

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AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$13.553

100+ parts

-

1k+ parts

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10k+ parts

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790

$13.553

-

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IDEA Electronic Components Group

UK . 1,658 parts In-Stock

1+ parts

$65.740

100+ parts

-

1k+ parts

$59.166

10k+ parts

-

1,658

$65.740

-

$59.166

-

MKK Technologies

India . 1,909 parts In-Stock

1+ parts

$123.619

100+ parts

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1,909

$123.619

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DigiPath Technology Company

USA . 1,909 parts In-Stock

1+ parts

$123.619

100+ parts

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1,909

$123.619

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Perfect Parts

USA . 224,101 parts In-Stock

1+ parts

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224,101

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Lixinc

USA . 14,919 parts In-Stock

1+ parts

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14,919

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-

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Parana Technologies

USA . 1,433 parts In-Stock

1+ parts

-

100+ parts

$78.602

1k+ parts

-

10k+ parts

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1,433

-

$78.602

-

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RC Electronics

USA . 703 parts In-Stock

1+ parts

-

100+ parts

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703

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Overview

Unleash the power of innovation with the STM32L083VBT6 by STMicroelectronics. As a leading manufacturer in the industry, this microcontroller offers exceptional quality and reliability for a wide range of applications. With advanced features like DAC and ADC channels, DMA capabilities, and a maximum clock frequency of 32 MHz, this product provides unparalleled value and benefits to customers. Whether you're developing IoT devices, wearables, or industrial automation systems, the STM32L083VBT6 delivers high performance and efficiency in a compact package. Elevate your projects with this cutting-edge microcontroller and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to external elements, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the product can handle higher power requirements, providing flexibility in power supply design.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, optimizing the layout and reducing overall footprint.

Bit Size: 32

A 32-bit architecture enables higher processing capabilities and performance, making the product suitable for complex tasks and applications.

DAC Channels: YES

Digital-to-analog converter channels allow for precise control and conversion of digital signals to analog voltage or current outputs, offering versatile signal processing capabilities.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external devices and components, enhancing the product's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving advantages, making the product suitable for compact designs with high-density components.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V allows for operation in low-power environments, increasing energy efficiency and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand elevated temperatures, ensuring reliable performance in various industrial settings.

Technical Specifications

Microcontrollers STM32L083VBT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

7

No. of I/O Lines:

84

No. of Terminals:

100

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), LCD, POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L083VBT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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