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STM32L083RZH3TR

STMicroelectronics

STM32L083RZH3TR by STMicroelectronics

STM32L083RZH3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 64 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,058 parts In-Stock

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6,058

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Digiode

USA . 2,266 parts In-Stock

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2,266

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Anansix

USA . 170 parts In-Stock

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170

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Distributors (Availability)

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AZTECH Wire

Italy . 134 parts In-Stock

1+ parts

$10.470

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134

$10.470

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Microchip USA

USA . 4,394 parts In-Stock

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$31.434

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4,394

$31.434

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Component Stockers USA

USA . 1,587 parts In-Stock

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$58.440

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$58.440

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IDEA Electronic Components Group

UK . 937 parts In-Stock

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$69.899

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$62.909

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937

$69.899

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$62.909

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MKK Technologies

India . 1,097 parts In-Stock

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$131.440

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1,097

$131.440

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DigiPath Technology Company

USA . 1,097 parts In-Stock

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$131.440

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$131.440

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Corphita

USA . 4,469 parts In-Stock

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4,469

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Parana Technologies

USA . 1,300 parts In-Stock

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$83.575

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$83.575

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Overview

Unleash innovation with the STM32L083RZH3TR microcontroller from STMicroelectronics, a trusted leader in advanced semiconductor solutions. Designed for efficiency and robustness, this 32-bit marvel excels in low-power applications, ensuring outstanding performance in smart devices, IoT, and automotive systems. Its compact design and versatile connectivity options empower you to create cutting-edge technology while reducing time-to-market—experience the perfect blend of quality, reliability, and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures resilience and protects the microcontroller from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling high-density circuit layouts which saves space on the PCB.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures safety and reliability in operation, compatible with most low-voltage applications.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution and is generally easier to handle during assembly.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and allows for handling of large data sets more efficiently.

DAC Channels: YES

Built-in DAC channels facilitate high-quality analog signal output, making it versatile for audio and sensor applications.

No. of Terminals: 64

A higher number of terminals enables more peripheral connections, enhancing the microcontroller's possibilities for interfacing with other devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The fine pitch grid array contributes to compact designs and allows for a smaller footprint on PCBs, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The ability to operate down to 1.8 V increases flexibility in power supply choices, catering to battery-operated devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this microcontroller is suitable for high-temperature environments, such as automotive applications.

CPU Family: CORTEX-M0

The Cortex-M0 core is optimized for low power consumption while maintaining efficient performance, making it suitable for embedded systems.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this microcontroller highly reliable for rugged environments and outdoor applications.

ADC Channels: YES

Integrated ADC channels enable accurate digital representation of analog signals, essential for sensor interfacing.

DMA Channels: YES

DMA support allows for efficient data movement without CPU intervention, leading to improved system performance and responsiveness.

Terminal Position: BOTTOM

Bottom terminal position can enhance connectivity on the PCB, which is beneficial for layouts requiring efficient space utilization.

ROM Words: 196608

A substantial ROM capacity facilitates rich firmware and program storage, allowing for complex application requirements.

Maximum Seated Height: 1.2 mm

The low height of the package is beneficial for designs where vertical space is limited, promoting low-profile assemblies.

Digital To Analog Converters: 2-Ch 12-Bit

The 12-bit DACs allow for precise signal generation, making this microcontroller ideal for applications requiring fine analog outputs.

Width: 5 mm

A compact width facilitates integration into tight spaces, corresponding to the trend of miniaturization in electronics.

Data EEPROM Size: 6K

An adequate EEPROM size allows for efficient non-volatile storage of critical parameters and configuration settings.

Peripherals: BOR, COMPARATOR(2), DMA(7), LCD, POR, PWM(5), RTC, TIMER(8), WDT(2)

Diverse peripherals enable various functionalities, giving developers flexibility to innovate in application design.

Maximum Clock Frequency: 32 MHz

A clock speed of 32 MHz provides reliable performance for most control tasks, balancing power efficiency and responsiveness.

Length: 5 mm

Short length specifications contribute to a compact form factor, facilitating easier placement in small devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller can withstand harsh conditions, ensuring reliability in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture minimizes instruction complexity, leading to increased performance and efficiency in processing tasks.

No. of Timers: 8

Multiple timers allow for precise timing and scheduling, essential for real-time applications.

RAM Bytes: 20480

Ample RAM size supports complex calculations and data handling, making it suitable for demanding embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise resistance, which is crucial for battery-operated devices.

Terminal Form: BALL

Ball terminal form allows for better thermal dissipation and robust mechanical connections on the PCB.

Analog To Digital Converters: 16-Ch 12-Bit

The presence of 16 ADC channels supports multiple sensor inputs, enhancing system capabilities for data collection and monitoring.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3 V is ideal for compatibility with common power sources, providing design convenience.

No. of DMA Channels: 7

A total of 7 DMA channels allow for extensive data handling capabilities, promoting efficient operation in multitasking environments.

PWM Channels: YES

Integrated PWM channels enable effective control of motors and other devices, ideal for automation and robotics applications.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Rich connectivity options support various communication protocols, making it versatile for diverse application interfaces.

ROM Programmability: FLASH

The FLASH programmability allows for easy updates and flexibility in application development, making iteration straightforward.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density layouts and potentially more connections within a given space.

Speed: 32 rpm

This speed is suitable for applications requiring controlled movement or actuation in automated systems.

On Chip Program ROM Width: 8

An 8-bit wide program ROM can accommodate efficient data processing for specific control tasks.

No. of I/O Lines: 51

The availability of 51 I/O lines provides extensive interfacing options for sensors and actuators, enhancing design flexibility.

Technical Specifications

Microcontrollers STM32L083RZH3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), LCD, POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L083RZH3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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